Circuits Assembly Online Magazine - Features

MTpro software is said to simplify conveyor system planning and application by using 3-D solid model and electronic catalog technology. Contains all components and systems for VarioFlow modular chain conveyors, TS-family assembly conveyors, aluminum structural framing, and Manual Production Systems. Integrated product configurator supports user selection of technical parameters and directly displays chosen configuration as a 3-D model. Users can transfer 3-D models and 2-D drawings into internal systems via direct interfaces to all common CAD programs. Enables retroactive modifications to components and parts list information in selected CAD systems.

Bosch Rexroth, www.boschrexroth-us.com

The LTS200 Lead Tinning System is a programmable, automated machine that reconditions component leads for hi-rel and/or RoHS applications. Can be used for conventional lead tinning or for re-conditioning SnPb parts. Built using designs and components from KISS Selective Soldering systems, including the KISS-ware OS. Has a central fluxing station with two solder pots. Can be programmed to handle transistors, capacitors, diodes, axials, radials, QFPs, pin grid array, sips, dips and connectors.

ACE Production Technologies, www.ace-protech.com

A series of nine turnkey lines are targeted to diverse production and budget demands. Each include a pick-and-place machine, stencil printer and Pb-free reflow oven, with conveyors and board-handling equipment available. Lines include high-mix, mid to high-speed, as well as low-volume starter and lab.

Manncorp, www.manncorp.com/turnkey

The SV-100 Slider Valve for solder paste dispensing is said to be up to 20% faster than standard auger dispensers; reportedly achieves 20,000 dots per hr. (on 1 mm grid) while delivering dots of less than 300 µm (0.012") for solder paste types 4, 5 and 6. Dots as small as 125 µm (0.005") in diameter can be achieved with type 6 paste. Dispenses dots and lines of pastes and fluids that contain metal additives with minimal clogging. Is compatible with Pb-free and no-clean solder pastes and silver-filled epoxies. Is for solder paste dots for passive components smaller than 0603, rework of BGA and QFN electrical connections, lines and patterns for RF shield attach, low-volume/high-mix applications, and unique patterns of conductive epoxy.

Asymtek, www.asymtek.com

Loctite 5210 is a fast-cure thixotropic silicone material said to be ideal for devices in harsh environments. Offers alternative to hot-melt glues. Is a non-corrosive room temperature vulcanization silicone material designed for wire tacking, selective sealing, vibration dampening, and rework/repair applications. Reportedly has dispense times as little as 31 sec. for two connectors and a tack free time of fewer than 5 min. Offers a high UPH alternative. Material reportedly will hold its form and will not spread or migrate to other locations. Cures at room temperature.

Henkel Corp., www.henkel.com/electronics

Circuit Suds biodegradable cleaner was formulated to be environmental friendly. Is said to be suitable for no-clean, rosin, and Pb-free processes. No special handling or disposal reportedly required in the majority of applications; is non-flammable and non-volatile. Can be disposed of as ordinary wastewater with few exceptions. For hand-cleaning through automated lines. Comes in 1 gal., 5gal. and larger containers.

Circuit Suds, www.circuitsuds.com