Circuits Assembly Online Magazine - Features

The ProcessMate PM100 vacuum pickup system lifts and positions small or delicate parts in benchtop assembly processes. Designed as a pick-and-place tool for use with Performus fluid dispensers; permits positioning of parts with one hand and application of adhesives, solder pastes and other assembly fluids with the other. Both use the same size cabinet. Options include a double foot pedal that controls the dispenser and vacuum system, and a finger switch for manual operation.

EFD Inc., www.efd-inc.com

SR-37 LFM-22S no-clean cored solder wire is said to enhance cost-efficiency and yield through a range of tip-saving properties. For applications that don’t require silver.

Almit, www.almit.com

Solder cup headers and mating socket connectors terminate discrete wires into a pluggable interconnect. Are said to provide a pluggable, reliable path between your wired applications. Are manufactured using precision-machined brass alloy and beryllium copper contact clips; assembled in high-temperature thermoplastic. Reportedly offer a gas-tight connection when mated with solder cup header pins. Are pre-aligned in the connectors. Are available in single and double rows up to 64 pins.

Mill-Max, www.mill-max.com

The Extech i5 compact IR camera is for thermal imaging, with focus-free viewing and 5000-image miniSD card storage. Monitors and detect the thermal condition of electrical system components. Reportedly can inspect areas that can’t be reached with thermocouples or other contact-based instruments. High-res images pinpoint problems in need of repair. Is said to deliver accuracy of 2% and thermal sensitivity of 0.18°F/0.1°C. Is 12 oz. Features a 2.8" high-res color LCD.

Extech Instruments, www.extech.com

The Nexus System workbench is designed for electronics, research, assembly and technical work. Can be customized. Has heavy-gauge upright frames with notches in the front and back, to mount accessories on either side. Accessories include tool rails, lights, shelves, pivoting arms, and monitor/accessory trays. Electrical and air power attachments can be added as well. Overhead cabinets can be added for storage. Is ergonomically designed.

Lista International Corp., www.listaintl.com

LFM 48 N is a no-clean, Pb-free alternative to gel pastes traditionally used in BGA PoP stacked device applications. Is for holding larger area devices that often exhibit warpage during reflow. Combines ultra-fine solder spheres and a low-voiding, thermally stable flux vehicle. Formulation comprises SAC 305 with a solder powder size of 4 to 24 µm. Features reported open time in a dipping tray 8 hrs. at 23°C and 50% RH, and up to 8 hrs. process window time between dipping and reflow.

Almit Ltd., www.almit.com