ADS 02M offline depaneling system is designed with an X/Y/Z gantry and features a rotary table, so the operator can load a panel while the system is cutting the next one. This is said to reduce overall cycle time.
Visit the EASi Line for a live demonstration of the High Speed Laser Marking System ALS 03. Features code verification with 1-D/2-D scanner, FIS dataconverter and repeatability +/- 100 micron at 6 sigma.
ASYS, asys-group.com
ATE Booth 5201
Visit the EASi Line for a live demonstration of the High Speed Laser Marking System ALS 03. Features code verification with 1-D/2-D scanner, FIS dataconverter and repeatability +/- 100 micron at 6 sigma.
ASYS, asys-group.com
ATE Booth 5201
X-Tek Group will announce the addition of Computerised Tomography (CT), a 3-D imaging capability, to the Revolution microfocus system at Nepcon Shenzhen. The system features true concentric imaging, the highest degree of off axis tilt available and NanoTech open tube technology for unparalleled resolution and magnification. Visitors can also find out more about the group’s new operation in Hong Kong.
CT produces high resolution 3-D data sets which can be viewed at any angle, sliced in any direction and measured to enable detailed analysis of the internal structure of a wide range of components and objects.
Offers a viewing angle of up to 75o, just 15o to the plane of the board. This allows for maximum magnification (up to 6000x) at all angles over the entire 16 x 16” (410 x 410mm) manipulator scan area, for 100% BGA, µBGA, multilayer board and PCB solder joint inspection, with quick analysis of BGA ball wetting, attachment, cracks and delaminations. NanoTech source offers improved defect detection due to feature recognition in the submicron range.
Has advanced triple-mode programming interface incorporating off-line, teach-repeat and high level library function for program building.
X-Tek, xtekxray.com
Nepcon Shenzhen Stand 2B73
CT produces high resolution 3-D data sets which can be viewed at any angle, sliced in any direction and measured to enable detailed analysis of the internal structure of a wide range of components and objects.
Offers a viewing angle of up to 75o, just 15o to the plane of the board. This allows for maximum magnification (up to 6000x) at all angles over the entire 16 x 16” (410 x 410mm) manipulator scan area, for 100% BGA, µBGA, multilayer board and PCB solder joint inspection, with quick analysis of BGA ball wetting, attachment, cracks and delaminations. NanoTech source offers improved defect detection due to feature recognition in the submicron range.
Has advanced triple-mode programming interface incorporating off-line, teach-repeat and high level library function for program building.
X-Tek, xtekxray.com
Nepcon Shenzhen Stand 2B73
YTV F1-Series AOI system delivers fastest inspection and an intuitive interface for automated PCB inspection. For high-volume manufacturing environments. Off-line programming maximizes machine utilization with real-time SPC monitoring, and provides east configuration across multiple manufacturing lines.
YESPC software is a fully compatible enhancement to the AOI onlne. Provides diagnostic and trending analysis of the manufacturing process. Real-time monitoring and reporting allows management to immediately react to critical process events in SMT production processes
YESTech, yestechinc.com
ATE Booth 5303
YESPC software is a fully compatible enhancement to the AOI onlne. Provides diagnostic and trending analysis of the manufacturing process. Real-time monitoring and reporting allows management to immediately react to critical process events in SMT production processes
YESTech, yestechinc.com
ATE Booth 5303
CyberOptics Corp. will highlight SE 300 Ultra, its 3-D solder paste inspection system, in booth 2D21 at the upcoming NEPCON South China exhibition and conference in Shenzhen.
The 100% inspection system reportedly provides accurate, repeatable results at speeds that keep up with increasing line cycle times. Incorporates the field-proven technology and reliable features of the SE 300 along with new features.
Features a conveyor that accommodates panel sizes from 101 x 35 mm (4 x 1.4") to 508 x 508 mm (20 x 20"), flexible conveyor rail options — rear or front-fixed rail, program call-up using a bar code reader, and the ability to read skip marks and exclude data from inspection results.
Can handle odd-shaped pads, has paste height accuracy (each measurement calculated using 200k reference points) and an XML file format output for easy integration to shop floor control systems. Features paste height, area and volume measurements with Gage R&R <10%.
New features include 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits , easy-to-use Operator Interface and Defect Review and conveyor auto-width adjustment.
The 100% inspection system reportedly provides accurate, repeatable results at speeds that keep up with increasing line cycle times. Incorporates the field-proven technology and reliable features of the SE 300 along with new features.
Features a conveyor that accommodates panel sizes from 101 x 35 mm (4 x 1.4") to 508 x 508 mm (20 x 20"), flexible conveyor rail options — rear or front-fixed rail, program call-up using a bar code reader, and the ability to read skip marks and exclude data from inspection results.
Can handle odd-shaped pads, has paste height accuracy (each measurement calculated using 200k reference points) and an XML file format output for easy integration to shop floor control systems. Features paste height, area and volume measurements with Gage R&R <10%.
New features include 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits , easy-to-use Operator Interface and Defect Review and conveyor auto-width adjustment.
CyberOptics, www.cyberoptics.com
KISS 103 ‘Stretch’ large-format selective soldering system with 3” nozzles will be exhibited at the upcoming ATExpo in Rosemont, IL.
Offers the popular features found in the KISS 101 and 102 systems, but handles larger PCBs and panelized boards. Provides a 26 x 19" work area. The user can place more boards in the work area and take advantage of the Step-and-Repeat feature of the operating program.
3" nozzles are a new option, designed to increase throughput as well as close the gap between selective, or secondary soldering, and full wave soldering. Enables quick conversion from a leaded to a no-lead solder process. By "painting" the solder side of a circuit with the 3" wide wave, can deliver productivity that approaches that of standard wave soldering tools. Can be easily integrated with A.C.E.’s line of preheat modules.
A.C.E.products, www.ace-protech.com
Offers the popular features found in the KISS 101 and 102 systems, but handles larger PCBs and panelized boards. Provides a 26 x 19" work area. The user can place more boards in the work area and take advantage of the Step-and-Repeat feature of the operating program.
3" nozzles are a new option, designed to increase throughput as well as close the gap between selective, or secondary soldering, and full wave soldering. Enables quick conversion from a leaded to a no-lead solder process. By "painting" the solder side of a circuit with the 3" wide wave, can deliver productivity that approaches that of standard wave soldering tools. Can be easily integrated with A.C.E.’s line of preheat modules.
A.C.E.products, www.ace-protech.com
ATExpo Booth 5811
EFD’s Solder Paste Group introduces an improved no-clean solder paste product family specifically formulated for SAC 305. Pb-free formulations are known to leave dull, matte finishes, but the new clear, colorless no-clean flux residue allows the solder joint to sparkle. For applications requiring a shiny, cosmetic finish. Said to ease inspection and improve wetting capabilities for SMT, mechanical, electronic and electro-mechanical soldering applications.
EFD, www.efdsolder.com
