SP003 semiautomatic stencil printer is now available as SP003-V with vision for faster control and alignment correction.
Features trans-stencil vision, a motorized print head and vertical stencil separation. Can accommodate stencils or screens up to 29 x 29".
Said to achieve precise printing by controlling all important print parameters including squeegee pressure, angle of squeegee, print speed, stencil position and stencil separation after printing.
Available with different print mounts, giving it numerous applications ¾ vacuum table, groove table, flat table or magnetic table. The magnetic table is used mostly with single- and double-sided boards, and is flexible.
Easy to operate and control, for small- and medium-volume production. Print alignment is accomplished by clearance-free, fine-pitch thread screws, and other print parameters can be adjusted on the front panel.
Designed for stencil printing, screen printing, print/print, print/flood and flood/print; can print a max. of 400 x 410 mm, features two cameras (both adjustable) and is 700 x 800 x 500 mm (without optional substructure).
ESSEMTEC, essemtec.com
Features trans-stencil vision, a motorized print head and vertical stencil separation. Can accommodate stencils or screens up to 29 x 29".
Said to achieve precise printing by controlling all important print parameters including squeegee pressure, angle of squeegee, print speed, stencil position and stencil separation after printing.
Available with different print mounts, giving it numerous applications ¾ vacuum table, groove table, flat table or magnetic table. The magnetic table is used mostly with single- and double-sided boards, and is flexible.
Easy to operate and control, for small- and medium-volume production. Print alignment is accomplished by clearance-free, fine-pitch thread screws, and other print parameters can be adjusted on the front panel.
Designed for stencil printing, screen printing, print/print, print/flood and flood/print; can print a max. of 400 x 410 mm, features two cameras (both adjustable) and is 700 x 800 x 500 mm (without optional substructure).
ESSEMTEC, essemtec.com
NITON XLt 898He is a nondestructive portable analysis tool for light element content in alloy material. Provides fast, laboratory-quality chemical analysis of light element content in aluminum and titanium alloys, as well as nickels, superalloys, stainless steels and more.
NITON X-Ray Fluorescence analyzers quickly and reliably provide accurate alloy material verification.
System fills the interior of the measurement head with pure helium, purging atmospheric air from the x-ray analysis path, and allowing light element x-rays to contact the high-resolution x-ray detector. As a result, operators can measure light element alloy content with the same analyzer that they use to test high-temp alloys.
NITON X-Ray Fluorescence analyzers quickly and reliably provide accurate alloy material verification.
System fills the interior of the measurement head with pure helium, purging atmospheric air from the x-ray analysis path, and allowing light element x-rays to contact the high-resolution x-ray detector. As a result, operators can measure light element alloy content with the same analyzer that they use to test high-temp alloys.
Thermo Electron, thermo.com
EP62-1MED is a two-component epoxy adhesive system featuring chemical and temperature resistance. Designed to withstand repeated cycles of steam, ethylene oxide, radiation and chemical sterilization.
Cures at moderately elevated temperatures (150° to 200°F) and offers a long working life at room temperatures. Contains no solvents or volatiles and has a 100 to 10 mix ratio by weight.
Said to have bond strength to metals, glass, ceramics, wood and most plastics. Durable and serviceable up to 400°F. Shrinkage upon cure is low (<0.06%). The color of part A is clear and part B is brown. Available in pint, quart, gallon and five-gallon kits. Also available in gun applicators.
Cures at moderately elevated temperatures (150° to 200°F) and offers a long working life at room temperatures. Contains no solvents or volatiles and has a 100 to 10 mix ratio by weight.
Said to have bond strength to metals, glass, ceramics, wood and most plastics. Durable and serviceable up to 400°F. Shrinkage upon cure is low (<0.06%). The color of part A is clear and part B is brown. Available in pint, quart, gallon and five-gallon kits. Also available in gun applicators.
Master Bond Inc., masterbond.com
Series 150 Vertical Flow Modular Plenum Sections consist of full ceiling, HEPA filter plenum sections that provide filtered laminar flow air to clean areas. Designed to deliver filtered air through 100% of the ceiling’s available surface area.
Units with blowers on top are the Series 152. With legs added, these become the Series 552. The Series 552 is a building suspended filter plenum. The blower and motor are mounted directly on top of the Series152 filter plenum and blow directly into it. The Series 552 can be supplied with or without soft wall curtains and can also be supported with legs.
The Series 151 and Series 152 are designed to hang from a building, or they may be installed on a custom frame. The Series 551 and Series 552 are designed to be freestanding.
Available in a number of configurations. Units with blowers on the end are the Series 151. With legs added, these become the Series 551 – a fully functional cleanroom that consists of legs and soft wall vinyl curtains that are mounted to the Series 151 low-profile filter plenum. The low-profile plenum extends beyond the end of the cleanroom. The Series 551 can be building suspended with or without curtains.
Units with blowers on top are the Series 152. With legs added, these become the Series 552. The Series 552 is a building suspended filter plenum. The blower and motor are mounted directly on top of the Series152 filter plenum and blow directly into it. The Series 552 can be supplied with or without soft wall curtains and can also be supported with legs.
The Series 151 and Series 152 are designed to hang from a building, or they may be installed on a custom frame. The Series 551 and Series 552 are designed to be freestanding.
Clean Air Products, cleanairproducts.com
ECV-100 Coolveyor is a cooling fan conveyor used post-reflow; without proper cooling, damage can occur to Flash programming IC and other temperature-sensitive components. Pb-free soldering, in particular, requires a high-temperature process.
Can efficiently reduce the temperature of a board (PCB and components) with a well-insulated unit that uses a cooling compressor to maintain the interior temperature of 5° to 10°C with a fan. Equipped with an anti-static transparent viewing window.
Benefits include room temperature setting, the capability to accommodate PCBs from 50 x 50 to 250 x 330, air is cooled by the cooling unit, insulated case structure unit with viewing window and conveyor speed control of 1 to 2 m/min. Measures 800 x 1,000 x 1,500 and weighs 310 kg. When setting at 5° to 10°C, the temperature of the board surface drops at 2°C/sec.
Eunil H.A. Americas, eunil.com
Can efficiently reduce the temperature of a board (PCB and components) with a well-insulated unit that uses a cooling compressor to maintain the interior temperature of 5° to 10°C with a fan. Equipped with an anti-static transparent viewing window.
Benefits include room temperature setting, the capability to accommodate PCBs from 50 x 50 to 250 x 330, air is cooled by the cooling unit, insulated case structure unit with viewing window and conveyor speed control of 1 to 2 m/min. Measures 800 x 1,000 x 1,500 and weighs 310 kg. When setting at 5° to 10°C, the temperature of the board surface drops at 2°C/sec.
Eunil H.A. Americas, eunil.com
Adding to its series of recently introduced optimized material sets, Henkel has announced a materials combination designed for stacked CSP (SCSP) devices. Uniting die attach material Hysol QMI536NB with mold compound Hysol GR9820, this material set reportedly delivers JEDEC Level 1/260° reflow performance.
Both materials perform well in Pb-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. GR9820 is a versatile epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations. The low-stress, “green” mold compound exhibits ultra low warpage in a matrix package format, with the ability to alter the mold compound resin components to counter-correct “smiling face” or “crying face” warpage in a range of package types.
QMI536NB is one-material solution for thin stacked die applications. Traditionally, different die attach materials are used for each of the various layers of a stacked package so as to avoid damage to the die passivation of the first die. This protective and low-bleed formulation can be used for both mother and daughter die, enabling packaging specialists to qualify a single material.
Henkel, www.electronics.henkel.com
Both materials perform well in Pb-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. GR9820 is a versatile epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations. The low-stress, “green” mold compound exhibits ultra low warpage in a matrix package format, with the ability to alter the mold compound resin components to counter-correct “smiling face” or “crying face” warpage in a range of package types.
QMI536NB is one-material solution for thin stacked die applications. Traditionally, different die attach materials are used for each of the various layers of a stacked package so as to avoid damage to the die passivation of the first die. This protective and low-bleed formulation can be used for both mother and daughter die, enabling packaging specialists to qualify a single material.
Henkel, www.electronics.henkel.com
