DEK has developed an equipment and tooling package that coats wafers with ultra-thin die attach materials down to 25 microns in thickness with tolerances of +/- 7 microns using a printing process.
Using a Micron-class Galaxy mass imaging system, an ultra-flat pallet, a die attach stencil or screen and a specially designed squeegee, the backside wafer coating process enables ultra-thin, precise deposits of die attach adhesive at high speed with an accurate, flexible screen printing platform. Bondline thickness can be controlled to customer specifications, fillet control is consistent with that of traditional film products without the 20-30% higher cost, UPH is higher than that of dispensing and the coated wafer can be pre-manufactured and stored until required. Ultra-flat pallet provides stability and uniformity required to process wafers as thin as 100 microns and up to 300 mm in diameter; specially engineered squeegee delicately applies the adhesive paste to the backside of the wafer.
Other advantages include the elimination of the fillet and subsequent reduction of paste adhesive volume (potentially by a factor of ten on die less than 0.5 x 0.5 mm), improved inventory control by concentrating the application of wet adhesive in the facility’s dedicated print area and streamlining the supply chain by requiring only one paste formulation for various process needs as opposed to the multiple thicknesses and widths necessary with films. Can be used for all wafer-level coating processes including epoxy and wafer-level protective backside coatings as well.
Is run on a flexible mass imaging platform, can also re-deployed for other packaging applications such as wafer bumping, DirEKt Ball Placement, thermal interface material (TIM) processing and encapsulation.
Using a Micron-class Galaxy mass imaging system, an ultra-flat pallet, a die attach stencil or screen and a specially designed squeegee, the backside wafer coating process enables ultra-thin, precise deposits of die attach adhesive at high speed with an accurate, flexible screen printing platform. Bondline thickness can be controlled to customer specifications, fillet control is consistent with that of traditional film products without the 20-30% higher cost, UPH is higher than that of dispensing and the coated wafer can be pre-manufactured and stored until required. Ultra-flat pallet provides stability and uniformity required to process wafers as thin as 100 microns and up to 300 mm in diameter; specially engineered squeegee delicately applies the adhesive paste to the backside of the wafer.
Other advantages include the elimination of the fillet and subsequent reduction of paste adhesive volume (potentially by a factor of ten on die less than 0.5 x 0.5 mm), improved inventory control by concentrating the application of wet adhesive in the facility’s dedicated print area and streamlining the supply chain by requiring only one paste formulation for various process needs as opposed to the multiple thicknesses and widths necessary with films. Can be used for all wafer-level coating processes including epoxy and wafer-level protective backside coatings as well.
Is run on a flexible mass imaging platform, can also re-deployed for other packaging applications such as wafer bumping, DirEKt Ball Placement, thermal interface material (TIM) processing and encapsulation.
DEK, dek.com
MFR Soldering/Desoldering systems offer assembly companies a solution tailored to their needs, whatever their size, manufacturing volume, product complexity and budgetary constraints.
MFR-DSI and MFR-DSX Systems for desoldering, comprise a compact bench-top MFR power supply and its desolder gun. Equipped with an internal air pump, MFR-DSI is ideal for small manufacturers that do not use compressed air, and for desoldering tasks performed away from the workbench. MFR/DSX uses compressed shop air, making it powerful for high-volume desoldering tasks.
Add soldering and rework hand-piece and tip cartridge to the units above to create two soldering, desoldering and rework options: the MFR-SDI with internal air pump, and the MFR-SDX with external compressed air.
All four packages use lightweight hand-pieces.
The handle of the desoldering tool is fully adjustable from “gun” to “pencil” position, for operator comfort. Incorporates a reactivation switch that senses when it is in use, and that works with “Auto Standby” and “Auto Off” functions to save on energy usage and prolong tip life.
Large-capacity chamber that catches molten solder during desoldering is made of thermal plastic and contains a disposable paper filter that, once full, is simply tapped gently out of the chamber for easy substitution. Fume filter traps solder fumes that can harden on cooling and block pumps.
Press-fit desoldering tips make changeovers easy. The operator simply handles the tips using a heat-resistant cartridge removal pad. Includes long-reach geometries for access to high-density areas on the PCB.
All soldering/desoldering tips are driven by SmartHeat technology, which senses the amount of heat energy needed at the pad.
Special LEDs on the power unit show whether the unit or a hand-piece are powered up, in ‘standby’ or ‘off.’ Will flag when the system or a tool are not grounded, and the unit will shut down.
Power units offer two ports to which any of the tools can be attached; for heavier or more varied workloads, multiple units can be slotted together to power as many tools as necessary.
OK International, okinternational.com
MFR-DSI and MFR-DSX Systems for desoldering, comprise a compact bench-top MFR power supply and its desolder gun. Equipped with an internal air pump, MFR-DSI is ideal for small manufacturers that do not use compressed air, and for desoldering tasks performed away from the workbench. MFR/DSX uses compressed shop air, making it powerful for high-volume desoldering tasks.
Add soldering and rework hand-piece and tip cartridge to the units above to create two soldering, desoldering and rework options: the MFR-SDI with internal air pump, and the MFR-SDX with external compressed air.
All four packages use lightweight hand-pieces.
The handle of the desoldering tool is fully adjustable from “gun” to “pencil” position, for operator comfort. Incorporates a reactivation switch that senses when it is in use, and that works with “Auto Standby” and “Auto Off” functions to save on energy usage and prolong tip life.
Large-capacity chamber that catches molten solder during desoldering is made of thermal plastic and contains a disposable paper filter that, once full, is simply tapped gently out of the chamber for easy substitution. Fume filter traps solder fumes that can harden on cooling and block pumps.
Press-fit desoldering tips make changeovers easy. The operator simply handles the tips using a heat-resistant cartridge removal pad. Includes long-reach geometries for access to high-density areas on the PCB.
All soldering/desoldering tips are driven by SmartHeat technology, which senses the amount of heat energy needed at the pad.
Special LEDs on the power unit show whether the unit or a hand-piece are powered up, in ‘standby’ or ‘off.’ Will flag when the system or a tool are not grounded, and the unit will shut down.
Power units offer two ports to which any of the tools can be attached; for heavier or more varied workloads, multiple units can be slotted together to power as many tools as necessary.
OK International, okinternational.com
LMS6000 is a fully functional, closed loop, ytterbium-doped fiber laser system capable of marking a variety of flat label materials and direct marking on specific metallic and plastic substrates. Includes an in-line mark grading system with error detection capability. Features reel-to-reel transportation with integrated fume extraction and vacuum hold-down of the material being marked.
Ytterbium laser provides marking resolution up to 1000 dpi at a marking speed of 2000 mm/sec. Labeling applications include compact bar codes and 2D data-matrices. Effective marking area of 130 x 130 mm can be expanded to 185 x 185 mm for continuous applications; with optional direct part marking module, a 1m2 marking area is possible. Provides fast throughput for cutting, oxidizing, engraving and anodizing.
Specific materials suitable for the system include: AL-AN anodized aluminum tags, ACR Tamper Evident Acrylic, acrylic coated polyester, polyester, Poly-A200 and Poly-A400 Laser Markable Polyesters, NMX Aramid Tags, TTVF Polyvinyl Fluoride, RMK and RMK6 Raymark epoxy coated labels, Stainless Steel, Brown Steel, Duroplast, Copper, Titanium and Carbide as well as polyaramid, PVF, AlumaMARK laser markable aluminum and many others. Other materials can be optimized per application requirements or to specific industry specifications.
Weighs 35Kg and measures 150 x 25 mm, which allows for portability, sharing or on-site work. Integrated software package helps with label designs and connects with many production control software systems.
Tyco Electronics Corporation, www.tycoelectronics.com
Ytterbium laser provides marking resolution up to 1000 dpi at a marking speed of 2000 mm/sec. Labeling applications include compact bar codes and 2D data-matrices. Effective marking area of 130 x 130 mm can be expanded to 185 x 185 mm for continuous applications; with optional direct part marking module, a 1m2 marking area is possible. Provides fast throughput for cutting, oxidizing, engraving and anodizing.
Specific materials suitable for the system include: AL-AN anodized aluminum tags, ACR Tamper Evident Acrylic, acrylic coated polyester, polyester, Poly-A200 and Poly-A400 Laser Markable Polyesters, NMX Aramid Tags, TTVF Polyvinyl Fluoride, RMK and RMK6 Raymark epoxy coated labels, Stainless Steel, Brown Steel, Duroplast, Copper, Titanium and Carbide as well as polyaramid, PVF, AlumaMARK laser markable aluminum and many others. Other materials can be optimized per application requirements or to specific industry specifications.
Weighs 35Kg and measures 150 x 25 mm, which allows for portability, sharing or on-site work. Integrated software package helps with label designs and connects with many production control software systems.
Tyco Electronics Corporation, www.tycoelectronics.com
The electronics group of Henkel has introduced a new process, Accelerated Cooling (AC), to be used with its two flip-chip in package non-conductive paste (NCP) underfill encapsulants. The NCP materials, Hysol FP5000 and Hysol FP5001, provide moisture resistance, thermal cycling resistance, expedite the assembly process and are designed for Pb-free interconnects.
Provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, eliminating the need for flux application, reflow and cleaning.
AC process heats the device while it is secured by the flip-chip bonder head and then is rapidly cooled during compression onto the NCP-coated substrate. This rapid cooling enables assembly completion prior to any excess heat exposure and, consequently, reduces package warpage, voids caused by moisture and assembly cycle time. Cuts typical cycle time in half (cycle times average 7 sec.).
Henkel, electronics.henkel.com
Provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, eliminating the need for flux application, reflow and cleaning.
AC process heats the device while it is secured by the flip-chip bonder head and then is rapidly cooled during compression onto the NCP-coated substrate. This rapid cooling enables assembly completion prior to any excess heat exposure and, consequently, reduces package warpage, voids caused by moisture and assembly cycle time. Cuts typical cycle time in half (cycle times average 7 sec.).
Henkel, electronics.henkel.com
DataFlex Plus thermal transfer overprinter (TTO) provides on-line printing of variable and real-time data, such as expiration dates, batch/lot codes, ingredients/parts listings, bar codes and logos.
Direct-drive ribbon technology contains few wearable parts, increasing reliability and minimizing downtime and costs associated with ribbon breaks. Standard 1,000 meter ribbon means less frequent changes and higher production line efficiency. Features simple ribbon cassette
Has an intuitive 8.4” SVGA GUI and color touch screen with easy-to-learn, icon-based controls. The standard WYSIWYG job display features a zoom facility to reduce operator error and minimize printing incorrect codes. Has three levels of password protection.
Bi-directional ribbon drive allows unused ribbon to be recaptured following each print. This maintains a 1 mm gap between prints for the complete length of the ribbon, creating more prints per roll.
Direct-drive ribbon technology contains few wearable parts, increasing reliability and minimizing downtime and costs associated with ribbon breaks. Standard 1,000 meter ribbon means less frequent changes and higher production line efficiency. Features simple ribbon cassette
Has an intuitive 8.4” SVGA GUI and color touch screen with easy-to-learn, icon-based controls. The standard WYSIWYG job display features a zoom facility to reduce operator error and minimize printing incorrect codes. Has three levels of password protection.
Bi-directional ribbon drive allows unused ribbon to be recaptured following each print. This maintains a 1 mm gap between prints for the complete length of the ribbon, creating more prints per roll.
Videojet Technologies Inc., videojet.com
Axiom X-1022 Dual-Lane dispensing system maximizes throughput during multi-pass underfill operations. Increases the number of units per hour (UPH) produced in high-volume semiconductor applications such as flip chip and CSP underfill. Allows parallel processing on two lanes for continuous dispensing, eliminating lost time in non-dispensing activities. In some applications, a 60 to 80% increase in throughput over single-lane dispensers can be achieved.
Dual-lane capability allows underfill flow-out in one lane while jetting underfill in the opposite lane. Eliminates wait-time by enabling two dispensing processes at the same time.
The conveyors are independently controlled, allowing different-sized parts to be processed in lanes one and two. Programmable flat-belt, dual-lane conveyor allows for a variety of process carriers, including Auer boats, lead frames and custom carriers. Conveyor is SMEMA compliant with a fixed first rail and adjustable second, third and fourth rails.
Configured with up to six stations of contact or impingement heating, three stations per lane: pre-heat, dispense and post-heat. The heat stations ensure consistent substrate heating at specified ramp rates for efficient, reliable fluid dispensing.
Fluidmove for Windows XP software offers advancements in throughput, fluid management and process control. For example, the board or substrate is sensed in the pre-dispense station and the associated dispensing program is automatically loaded.
Mass Flow Control and Calibrated Process Jetting control the critical aspects of the fluid dispensing process in a closed feedback loop.
Dual-lane capability allows underfill flow-out in one lane while jetting underfill in the opposite lane. Eliminates wait-time by enabling two dispensing processes at the same time.
The conveyors are independently controlled, allowing different-sized parts to be processed in lanes one and two. Programmable flat-belt, dual-lane conveyor allows for a variety of process carriers, including Auer boats, lead frames and custom carriers. Conveyor is SMEMA compliant with a fixed first rail and adjustable second, third and fourth rails.
Configured with up to six stations of contact or impingement heating, three stations per lane: pre-heat, dispense and post-heat. The heat stations ensure consistent substrate heating at specified ramp rates for efficient, reliable fluid dispensing.
Fluidmove for Windows XP software offers advancements in throughput, fluid management and process control. For example, the board or substrate is sensed in the pre-dispense station and the associated dispensing program is automatically loaded.
Mass Flow Control and Calibrated Process Jetting control the critical aspects of the fluid dispensing process in a closed feedback loop.
Asymtek, asymtek.com
