BP Microsystems will highlight the latest addition to its Helix automated device programmer at the upcoming NEPCON South China exhibition and conference in Shenzhen.
As a desktop automated system, the Helix comes with two precision-designed tray input and output handling systems with a reject location. The updated system is designed to have the same dph and is based on the Helix-TU-10 design. The tray version uses the same core programming technology, as well as the same socket modules as the standard BP Microsystems automated line. The pressure plates are exchangeable between the tray version and the Helix-TU-10 units.
Integrated in the handler are two Enhanced 7th Generation programming sites with FX4 socket module capability. This allows for programming up to four devices simultaneously per site. Designed to handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date.
BP Microsystems, www.bpmicro.com
Nepcon Shenzhen booth 52C01
As a desktop automated system, the Helix comes with two precision-designed tray input and output handling systems with a reject location. The updated system is designed to have the same dph and is based on the Helix-TU-10 design. The tray version uses the same core programming technology, as well as the same socket modules as the standard BP Microsystems automated line. The pressure plates are exchangeable between the tray version and the Helix-TU-10 units.
Integrated in the handler are two Enhanced 7th Generation programming sites with FX4 socket module capability. This allows for programming up to four devices simultaneously per site. Designed to handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date.
BP Microsystems, www.bpmicro.com
Nepcon Shenzhen booth 52C01
Blakell Europlacer Ltd. will display the new Tornado head at the upcoming NEPCON South China trade show and exhibition.
The head features 12 position turret nozzles. Available on the Xpress range. Xpress 15 equipped with a Tornado head becomes Xpress 15T and the Xpress 25 becomes Xpress 25T. The speed of the machines is reportedly increased by 10%.
Xpress 25T combines high-speed and fine-pitch capabilities within a compact footprint. Twin heads can place devices ranging from 0201 to 50 x 50 mm QFP (70 x 70mm QFP and 100 mm connector optional) at a tact time of 0.128 sec (28,000 cph equivalent). Equipped with “smart nozzles” and on the fly vision.
Europlacer, europlacer.com
Nepcon Shenzhen booth 2M05
The head features 12 position turret nozzles. Available on the Xpress range. Xpress 15 equipped with a Tornado head becomes Xpress 15T and the Xpress 25 becomes Xpress 25T. The speed of the machines is reportedly increased by 10%.
Xpress 25T combines high-speed and fine-pitch capabilities within a compact footprint. Twin heads can place devices ranging from 0201 to 50 x 50 mm QFP (70 x 70mm QFP and 100 mm connector optional) at a tact time of 0.128 sec (28,000 cph equivalent). Equipped with “smart nozzles” and on the fly vision.
Europlacer, europlacer.com
Nepcon Shenzhen booth 2M05
FINETECH will highlight the compact rework system Fineplacer CRS10 at Nepcon South China on Aug. 29 to Sept. 1.
The rework station handles the complete rework process and supports automated component placement and lift-off. Has user-friendly Chinese software. Better than 10 µm placement accuracy allows for rework of high density packaged boards. Large field of view accommodates large component alignment (e.g., super BGAs with side lengths of up to 45 mm), without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE". Typical applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components such as 0201, 0402, 0603 and connectors, RF-shields, shielding frames, flip chip rework and customized applications.
FINETECH, www.finetech.de
Nepcon Shenzhen booth 2G71
The rework station handles the complete rework process and supports automated component placement and lift-off. Has user-friendly Chinese software. Better than 10 µm placement accuracy allows for rework of high density packaged boards. Large field of view accommodates large component alignment (e.g., super BGAs with side lengths of up to 45 mm), without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE". Typical applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components such as 0201, 0402, 0603 and connectors, RF-shields, shielding frames, flip chip rework and customized applications.
FINETECH, www.finetech.de
Nepcon Shenzhen booth 2G71
ESSEMTEC AG will highlight CSM7100, a flexible pick-and-place system with intelligent feeders for high-mix/low-volume production, at the upcoming NEPCON South China exhibition and conference.
Features large feeder capacity, intelligent feeders and easy-to-use operation software. Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
Ooffers a wide application range, feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
Includes machine operation software Lightplacer. Barcode labels on feeders and components guarantee the correct and quick feeder setup using a barcode reader.
Footprint is 80 x 80 cm.
ESSEMTEC, essemtec.com
Nepcon South China booth 2C50
Features large feeder capacity, intelligent feeders and easy-to-use operation software. Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
Ooffers a wide application range, feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
Includes machine operation software Lightplacer. Barcode labels on feeders and components guarantee the correct and quick feeder setup using a barcode reader.
Footprint is 80 x 80 cm.
ESSEMTEC, essemtec.com
Nepcon South China booth 2C50
KIC will showcase its 24/7 Process Monitor at the upcoming Nepcon South China exhibition and conference in Shenzhen.
24/7 Process Monitoring brings automation to the thermal process: Automatic profiling of each product, around-the-clock monitoring, SPC charting, analysis, documentation and production traceability -- all in a single, intuitive product. Continuous tracking occurs in the background, never interrupting production. Real-time process data enables engineers to make crucial cost containment and quality control decisions.
Uses custom probes installed inside the oven at the product level to gather and record real-time thermal process data for every product. Automatically charts all critical process specs: peak temperature, soak time, time above liquidous, etc. The data is plotted on real-time control charts and process capability (Cpk) is calculated for each specification. The overall process window index (PWI) is charted, providing a real-time Cpk for the entire process. Any process drift outside of control limits or defined Cpk value will immediately trigger an alarm. Real-time Cpk tracking provides a zero-defect, fail-safe system that automatically identifies potential defects before they occur.
KIC, kicthermal.com
Nepcon South China booth 2D58
24/7 Process Monitoring brings automation to the thermal process: Automatic profiling of each product, around-the-clock monitoring, SPC charting, analysis, documentation and production traceability -- all in a single, intuitive product. Continuous tracking occurs in the background, never interrupting production. Real-time process data enables engineers to make crucial cost containment and quality control decisions.
Uses custom probes installed inside the oven at the product level to gather and record real-time thermal process data for every product. Automatically charts all critical process specs: peak temperature, soak time, time above liquidous, etc. The data is plotted on real-time control charts and process capability (Cpk) is calculated for each specification. The overall process window index (PWI) is charted, providing a real-time Cpk for the entire process. Any process drift outside of control limits or defined Cpk value will immediately trigger an alarm. Real-time Cpk tracking provides a zero-defect, fail-safe system that automatically identifies potential defects before they occur.
KIC, kicthermal.com
Nepcon South China booth 2D58
3-D engineering models for all DEK printer subassemblies can now be downloaded over the Internet, allowing machine owners to examine components in detail without taking a machine offline, and to verify and order new parts or upgrades quickly and easily.
The 3-D Find-a-Part service is free to all DEK machine owners, and is accessible 24/7 via the secure technical support account pages at www.dek.com.
Models are the actual CAD models used by DEK engineers, and are accurate, fully detailed and up to date. Customers can rotate the models in three axes, measure dimensions, zoom in or zoom out, isolate and inspect individual sub-components, and find part numbers using context sensitive keys. Price and availability, as well as online ordering, are also supported.
Because of the large file size for each model, DEK has installed extra, dedicated Internet infrastructure to support the service, so customers can view any model on screen in the time it takes to download the file.
“This service is valuable for customers needing to quickly inspect any subassembly or optional unit, such as a print head or underscreen cleaner, and also streamlines ordering of replacement or upgrade parts,” said Jon Howell, Customer Service Group manager. “As well as providing a more powerful troubleshooting solution than hard copy general assembly drawings, customers no longer have to spend time describing a required component to DEK sales or support staff. Examining a component and finding the part number now requires just a few simple mouse clicks.”
DEK, www.dek.com
The 3-D Find-a-Part service is free to all DEK machine owners, and is accessible 24/7 via the secure technical support account pages at www.dek.com.
Models are the actual CAD models used by DEK engineers, and are accurate, fully detailed and up to date. Customers can rotate the models in three axes, measure dimensions, zoom in or zoom out, isolate and inspect individual sub-components, and find part numbers using context sensitive keys. Price and availability, as well as online ordering, are also supported.
Because of the large file size for each model, DEK has installed extra, dedicated Internet infrastructure to support the service, so customers can view any model on screen in the time it takes to download the file.
“This service is valuable for customers needing to quickly inspect any subassembly or optional unit, such as a print head or underscreen cleaner, and also streamlines ordering of replacement or upgrade parts,” said Jon Howell, Customer Service Group manager. “As well as providing a more powerful troubleshooting solution than hard copy general assembly drawings, customers no longer have to spend time describing a required component to DEK sales or support staff. Examining a component and finding the part number now requires just a few simple mouse clicks.”
DEK, www.dek.com
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