Thermo Electron’s NITON Analyzers business unit has released new software with additional features and benefits to assist with RoHS compliance.
NITON Analyzers are portable x-ray fluorescence (XRF) instruments for on-site, nondestructive RoHS screening. Used for testing of polymers, solders and electronic components for RoHS, ELV and WEEE compliance verification screening. Supply easy-to-use and reliable onsite screening and material analysis.
Version 5.1 analyzer software includes an advanced thickness correction for improved direct analysis of polymer materials. For several years, the RoHS analyzers have been used to quantify
restricted elements in plastic matrices down to 5 mm thickness. However, though semi-quantitative testing was done directly, very thin samples typically required folding or layering in order to provide the best analytical results possible. The Thickness Correction algorithm provides the ability to compensate test results for even ultra-thin plastic materials. Is straightforward and easy-to-use.
The new software features six language options, improved analytical accuracy and element additions to already extensive calibration matrices.
Version 5.1 is currently shipping on all new instruments, and is a free upgrade to customers with existing compatible analyzers.
NITON Analyzers are portable x-ray fluorescence (XRF) instruments for on-site, nondestructive RoHS screening. Used for testing of polymers, solders and electronic components for RoHS, ELV and WEEE compliance verification screening. Supply easy-to-use and reliable onsite screening and material analysis.
Version 5.1 analyzer software includes an advanced thickness correction for improved direct analysis of polymer materials. For several years, the RoHS analyzers have been used to quantify
restricted elements in plastic matrices down to 5 mm thickness. However, though semi-quantitative testing was done directly, very thin samples typically required folding or layering in order to provide the best analytical results possible. The Thickness Correction algorithm provides the ability to compensate test results for even ultra-thin plastic materials. Is straightforward and easy-to-use.
The new software features six language options, improved analytical accuracy and element additions to already extensive calibration matrices.
Version 5.1 is currently shipping on all new instruments, and is a free upgrade to customers with existing compatible analyzers.
Thermo Electron Corp., thermo.com
SHELLCASE CF is a wafer-level technology for optical components integrated into electronic products such as miniaturized cameras in camera phones, digital still cameras and video camcorders.
Suitable for image sensors, certain types of MEMS and other optical devices, it protects components from contamination from the initial stage of processing and is compatible with conventional Chip-on-Board (COB) assembly processes.
An immediate application is for CMOS and CCD image sensors used in camera phones. Said to provide up to 40% improvement in yield over existing COB technology. This is realized through the protection of the sensor's active area from contamination and the ability to perform wafer-level image testing prior to module assembly, both of which improve camera module yield and reduce overall cost.
Uses existing wire-bond assembly infrastructure and processes, minimizing the hurdles to rapid adoption.
Unlike COB technology, it encapsulates the image sensor, MEMS or other optical device with a glass cover that is elevated from the silicon surface using cavity walls. The cover design leaves the image sensor bond pads exposed allowing for standard wire-bond assembly. The protected die is then singulated and mounted to the board using standard die attach processes. Provides the flexibility to perform optical testing at the most favorable point of the assembly flow, as defined by their specific requirements and manufacturing environment.
Tessera, tessera.com
SEMICON West, Booth 8622
Dage has developed a computerized tomography (CT) option for its XiDAT XD7600NT digital x-ray inspection system. The CT option further refines performance with volumetric reconstruction of solder joints.
CT is an imaging method employing tomography whereby digital geometric processing is used to generate a 3-D image model of an object from a large series of individual 2-D x-ray images, or slices, taken about a single axis of rotation.
The CT capability is available as an option with new systems and is suited for analytical analysis of interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package. Equipped with this option, the system can quickly and easily convert between 2-D and 3-D modes for different inspection applications, is capable of ultra fast image reconstruction and can reconstructing up to 1,440 image slices.
When operating in 3-D mode, the sample is rotated in the x-ray beam and multiple 2-D digital images are captured. These 2-D images are fed in real-time to a dedicated reconstruction server where a 3-D model is available for viewing.
The reconstruction server can generate 3-D volumes of 2563, 5123 and 1,0243 using a Feldkamp cone beam reconstruction algorithm with either full or sub-volume reconstruction, with all calculations being carried out by 16 dedicated processing units running in parallel.
The reconstructed 3-D image model can be viewed online or off-line with dedicated image hardware allowing real-time manipulation of 3-D models. Image display features include:
Image Manipulation – rotate, pan and zoom
Clip Image – to eliminate unwanted detail
Volume Rendering – for creation of solid surfaces and maximum intensity, and to vary the opacity and color of volumes
Slices – multiple cross section at any orientation and the ability to vary the opacity and color of individual slices
Illumination Models – single light source or two light sources with shadow computation for optimal 3D perception
Image Save – saving 2D images in JPG or TIF formats
Dage Precision Industries, dageinc.com
CT is an imaging method employing tomography whereby digital geometric processing is used to generate a 3-D image model of an object from a large series of individual 2-D x-ray images, or slices, taken about a single axis of rotation.
The CT capability is available as an option with new systems and is suited for analytical analysis of interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package. Equipped with this option, the system can quickly and easily convert between 2-D and 3-D modes for different inspection applications, is capable of ultra fast image reconstruction and can reconstructing up to 1,440 image slices.
When operating in 3-D mode, the sample is rotated in the x-ray beam and multiple 2-D digital images are captured. These 2-D images are fed in real-time to a dedicated reconstruction server where a 3-D model is available for viewing.
The reconstruction server can generate 3-D volumes of 2563, 5123 and 1,0243 using a Feldkamp cone beam reconstruction algorithm with either full or sub-volume reconstruction, with all calculations being carried out by 16 dedicated processing units running in parallel.
The reconstructed 3-D image model can be viewed online or off-line with dedicated image hardware allowing real-time manipulation of 3-D models. Image display features include:
Image Manipulation – rotate, pan and zoom
Clip Image – to eliminate unwanted detail
Volume Rendering – for creation of solid surfaces and maximum intensity, and to vary the opacity and color of volumes
Slices – multiple cross section at any orientation and the ability to vary the opacity and color of individual slices
Illumination Models – single light source or two light sources with shadow computation for optimal 3D perception
Image Save – saving 2D images in JPG or TIF formats
Dage Precision Industries, dageinc.com
SchmartBoard has released two boards that address tiny discrete surface-mount components.
EZ Discrete #1 supports 0201, 0603, 0805, 1206,1210, 1608, 1812, 2010, 2512, & CAES-A, B, and C. EZ Discrete #2 supports SOT23-3, 5, 6, SC70-5,6, DPAK, D2PAK, SOT223, TO263-7, SOT89, 0805, 1206, & CASE-A, B, C, D and E. Many of these components are very small and require a magnifying glass to see, let alone hand-solder without creating shorts. The boards lock the component in place on the board, and are hand-soldered by touching the board with the soldering iron next to the component.
The SchmartBoard|ez line of prototyping boards was launched in September 2005. The technology makes it possible for novices to hand-solder difficult components quickly and flawlessly the first time they pick up a soldering iron. The family of boards allow engineers, students and hobbyists to hand solder surface-mount components and expanded their capabilities in creating electronic circuit projects.
SchmartBoard, schmartboard.com
EZ Discrete #1 supports 0201, 0603, 0805, 1206,1210, 1608, 1812, 2010, 2512, & CAES-A, B, and C. EZ Discrete #2 supports SOT23-3, 5, 6, SC70-5,6, DPAK, D2PAK, SOT223, TO263-7, SOT89, 0805, 1206, & CASE-A, B, C, D and E. Many of these components are very small and require a magnifying glass to see, let alone hand-solder without creating shorts. The boards lock the component in place on the board, and are hand-soldered by touching the board with the soldering iron next to the component.
The SchmartBoard|ez line of prototyping boards was launched in September 2005. The technology makes it possible for novices to hand-solder difficult components quickly and flawlessly the first time they pick up a soldering iron. The family of boards allow engineers, students and hobbyists to hand solder surface-mount components and expanded their capabilities in creating electronic circuit projects.
SchmartBoard, schmartboard.com
INOCART material handling system and INOKIT software are designed to improve inventory accuracy and reduce material handling labor cost.
The products revolutionize the process of kitting and reloading SMT lines. The custom-configurable material handling solution allows numerous package types to be stored in a secure, controlled manner, whether that be reels, tubes, feeders or PCBs. The cart and software together increase inventory accuracy. Allows material to be received directly from the dock to stock/kits, eliminating non-value-added labor and the efforts of moving/transacting material into another stockroom after receipt.
The software was developed based on years of industry experience to deal with MRP systems that fall short of managing work in process. Uses “1 Package, 1 Location” technology to minimize machine setup/tear down and reload while maintaining accuracy of work in process inventory.
The supply chain management software increases visibility, presents actionable data, minimizes inventory liabilities and reduces cost. Helps increase SMT machine utilization accuracy and reduce unplanned material shortages by improving the inventory accuracy.
An SMT line can be loaded directly from INOCART on the line, eliminating kitting and staging of jobs prior to running on the SMT lines. Can hold feeders so kits can be presented to the SMT equipment ready to go.
Inovaxe Corp., inovaxe.com
Flowserve Guardian 3000 electronics cooling pump is designed to cool computer processors and graphics chips in high-end consumer personal computers.
Measuring approximately 90 mm in length and 36 mm in diameter, it is the smallest pump the company has ever developed. While the largest pump built by Flowserve has an impeller diameter of 4.24 m and would fill an Olympic size swimming pool in 25 sec., the Guardian 3000 has an impeller diameter of less than an inch and would take nearly three min. to fill a kitchen sink.
It addresses a daunting challenge facing manufacturers today – how to cool computer electronic components within limited dimensional, cost and power budgets. An overhung centrifugal, nonmetallic, magnetic-drive, seal-less pump, its patented motor technology and design achieve the small form factor necessary to fit microcomputer and other electronic package applications.
Is powered by a brushless 12-volt DC motor, designed for a minimum five-year maintenance-free life. Collaboratively designed and manufactured by the company's Memphis, TN; Vernon, CA; and Dayton, OH facilities, has successfully completed tens of thousands of hours of endurance testing and more than 40,000 cycles of on/off tests.
Flowserve Corp., flowserve.com
Measuring approximately 90 mm in length and 36 mm in diameter, it is the smallest pump the company has ever developed. While the largest pump built by Flowserve has an impeller diameter of 4.24 m and would fill an Olympic size swimming pool in 25 sec., the Guardian 3000 has an impeller diameter of less than an inch and would take nearly three min. to fill a kitchen sink.
It addresses a daunting challenge facing manufacturers today – how to cool computer electronic components within limited dimensional, cost and power budgets. An overhung centrifugal, nonmetallic, magnetic-drive, seal-less pump, its patented motor technology and design achieve the small form factor necessary to fit microcomputer and other electronic package applications.
Is powered by a brushless 12-volt DC motor, designed for a minimum five-year maintenance-free life. Collaboratively designed and manufactured by the company's Memphis, TN; Vernon, CA; and Dayton, OH facilities, has successfully completed tens of thousands of hours of endurance testing and more than 40,000 cycles of on/off tests.
Flowserve Corp., flowserve.com
