FEINFOCUS HDCT-FOX  2-D/3-D x-ray inspection system combines high-resolution 2-D X-Ray technology and enhanced 3-D computed tomography techniques with Feinfocus HDX-Ray technology for inspection and analysis of complex electronic devices in the third dimension. For thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects and hybrids.
Versatile, combines functionality of a standard microfocus x-ray system with the ability to generate 3-D imagery.

Utilizing HDX-Ray technology, it instantaneously captures high-resolution 2-D images and reconstructs 3-D volume models, providing insight into design and manufacturing processes. Modular hardware- and software-based CT interface accommodates a variety of imaging chains, with automatic configuration of the detector for optimal CT resolution.

Designed for integration with iView technology developed by TeraRecon, allowing instantaneous uploading of sets of 3-D images to a secure Website. This allows F/A service labs to transmit 2-D and CT imagery instantly using a high-speed internet connection. X-ray scanning process can be centralized while the image analysis is decentralized, and vice-versa.

COMET, comet.ch

UV40 UV curable conformal coating is for high-volume automotive and consumer electronics manufacturers who want the rapid cure of UV products, but require the processing ease of their current coatings. Maintains the speed of cure and environment-friendly chemistry required for electronic fabrication.

Adheres to many commonly used solder resists and offers high resistance to a range of solvents. Provides higher insulation resistance, moisture insulation resistance and a reliable moisture activated secondary cure mechanism. Provides flexibility over a range of temperatures and does not become brittle at lower ranges.

Is 100% solids and meets all ISO 14001, IPC-CC-830 and major H&S/hazardous chemical regulatory requirements.
 
HumiSeal, humiseal.com

DEK has developed an equipment and tooling package that coats wafers with ultra-thin die attach materials down to 25 microns in thickness with tolerances of +/- 7 microns using a printing process.
 
Using a Micron-class Galaxy mass imaging system, an ultra-flat pallet, a die attach stencil or screen and a specially designed squeegee, the backside wafer coating process enables ultra-thin, precise deposits of die attach adhesive at high speed with an accurate, flexible screen printing platform. Bondline thickness can be controlled to customer specifications, fillet control is consistent with that of traditional film products without the 20-30% higher cost, UPH is higher than that of dispensing and the coated wafer can be pre-manufactured and stored until required. Ultra-flat pallet provides stability and uniformity required to process wafers as thin as 100 microns and up to 300 mm in diameter; specially engineered squeegee delicately applies the adhesive paste to the backside of the wafer.
 
Other advantages include the elimination of the fillet and subsequent reduction of paste adhesive volume (potentially by a factor of ten on die less than 0.5 x 0.5 mm), improved inventory control by concentrating the application of wet adhesive in the facility’s dedicated print area and streamlining the supply chain by requiring only one paste formulation for various process needs as opposed to the multiple thicknesses and widths necessary with films. Can be used for all wafer-level coating processes including epoxy and wafer-level protective backside coatings as well.
 
Is run on a flexible mass imaging platform, can also re-deployed for other packaging applications such as wafer bumping, DirEKt Ball Placement, thermal interface material (TIM) processing and encapsulation.
 

MFR Soldering/Desoldering systems offer assembly companies a solution tailored to their needs, whatever their size, manufacturing volume, product complexity and budgetary constraints.
 
MFR-DSI and MFR-DSX Systems for desoldering, comprise a compact bench-top MFR power supply and its desolder gun. Equipped with an internal air pump, MFR-DSI is ideal for small manufacturers that do not use compressed air, and for desoldering tasks performed away from the workbench. MFR/DSX uses compressed shop air, making it powerful for high-volume desoldering tasks.
 
Add soldering and rework hand-piece and tip cartridge to the units above to create two soldering, desoldering and rework options: the MFR-SDI with internal air pump, and the MFR-SDX with external compressed air.
 
All four packages use lightweight hand-pieces.
 
The handle of the desoldering tool is fully adjustable from “gun” to “pencil” position, for operator comfort. Incorporates a reactivation switch that senses when it is in use, and that works with “Auto Standby” and “Auto Off” functions to save on energy usage and prolong tip life.
 
Large-capacity chamber that catches molten solder during desoldering is made of thermal plastic and contains a disposable paper filter that, once full, is simply tapped gently out of the chamber for easy substitution. Fume filter traps solder fumes that can harden on cooling and block pumps.
 
Press-fit desoldering tips make changeovers easy. The operator simply handles the tips using a heat-resistant cartridge removal pad. Includes long-reach geometries for access to high-density areas on the PCB.
 
All soldering/desoldering tips are driven by SmartHeat technology, which senses the amount of heat energy needed at the pad.
 
Special LEDs on the power unit show whether the unit or a hand-piece are powered up, in ‘standby’ or ‘off.’ Will flag when the system or a tool are not grounded, and the unit will shut down. 
 
Power units offer two ports to which any of the tools can be attached; for heavier or more varied workloads, multiple units can be slotted together to power as many tools as necessary.
 
OK International, okinternational.com