SEFAR LDS is a laser technology stencil imaging machine for small format screen printing applications. With imaging capabilities between 1700 and 2400 dpi, it reportedly creates precision stencils that adhere to high quality standards, perfectly placed on each screen to ensure consistent color-to-color registration.
Available in two configurations: 1330 (max. screen size 15.5 x 17.5 in. – developed for the optical disc market) and 4060 (max. screen size 25.5 x 27.5 in.). Both systems are said to increase productivity (by removing several prepress steps from stencil making through on-press registration) and reduce costs by eliminating time and expenditures associated with conventional film imaging processes.
Sefar Printing Solutions, sefar.us.
Available in two configurations: 1330 (max. screen size 15.5 x 17.5 in. – developed for the optical disc market) and 4060 (max. screen size 25.5 x 27.5 in.). Both systems are said to increase productivity (by removing several prepress steps from stencil making through on-press registration) and reduce costs by eliminating time and expenditures associated with conventional film imaging processes.
Sefar Printing Solutions, sefar.us.
Christopher Associates announced significant breakthroughs in performance of the NSpec AOI system. With a universal data converter, an enhanced and extensive parts library, and significant performance improvements, programming/debugging time has been reduced by 50% or more depending upon program specifics. Inspection speeds have improved and defect detection capabilities have also been enhanced. The programming speed improvement can be applied to all 3,500 NSpec systems in the field by a simple software update.
Using LED lighting and a telecentric lens with a high resolution color camera, the latest model, the DL, can inspect components, solder joints, full color inspection, 2-D solder paste, text, and 01005 components.
Christopher Associates Inc., christopherweb.com
Using LED lighting and a telecentric lens with a high resolution color camera, the latest model, the DL, can inspect components, solder joints, full color inspection, 2-D solder paste, text, and 01005 components.
Christopher Associates Inc., christopherweb.com
Thermo Electron’s NITON Analyzers business unit has released new software with additional features and benefits to assist with RoHS compliance.
NITON Analyzers are portable x-ray fluorescence (XRF) instruments for on-site, nondestructive RoHS screening. Used for testing of polymers, solders and electronic components for RoHS, ELV and WEEE compliance verification screening. Supply easy-to-use and reliable onsite screening and material analysis.
Version 5.1 analyzer software includes an advanced thickness correction for improved direct analysis of polymer materials. For several years, the RoHS analyzers have been used to quantify
restricted elements in plastic matrices down to 5 mm thickness. However, though semi-quantitative testing was done directly, very thin samples typically required folding or layering in order to provide the best analytical results possible. The Thickness Correction algorithm provides the ability to compensate test results for even ultra-thin plastic materials. Is straightforward and easy-to-use.
The new software features six language options, improved analytical accuracy and element additions to already extensive calibration matrices.
Version 5.1 is currently shipping on all new instruments, and is a free upgrade to customers with existing compatible analyzers.
NITON Analyzers are portable x-ray fluorescence (XRF) instruments for on-site, nondestructive RoHS screening. Used for testing of polymers, solders and electronic components for RoHS, ELV and WEEE compliance verification screening. Supply easy-to-use and reliable onsite screening and material analysis.
Version 5.1 analyzer software includes an advanced thickness correction for improved direct analysis of polymer materials. For several years, the RoHS analyzers have been used to quantify
restricted elements in plastic matrices down to 5 mm thickness. However, though semi-quantitative testing was done directly, very thin samples typically required folding or layering in order to provide the best analytical results possible. The Thickness Correction algorithm provides the ability to compensate test results for even ultra-thin plastic materials. Is straightforward and easy-to-use.
The new software features six language options, improved analytical accuracy and element additions to already extensive calibration matrices.
Version 5.1 is currently shipping on all new instruments, and is a free upgrade to customers with existing compatible analyzers.
Thermo Electron Corp., thermo.com
SHELLCASE CF is a wafer-level technology for optical components integrated into electronic products such as miniaturized cameras in camera phones, digital still cameras and video camcorders.
Suitable for image sensors, certain types of MEMS and other optical devices, it protects components from contamination from the initial stage of processing and is compatible with conventional Chip-on-Board (COB) assembly processes.
An immediate application is for CMOS and CCD image sensors used in camera phones. Said to provide up to 40% improvement in yield over existing COB technology. This is realized through the protection of the sensor's active area from contamination and the ability to perform wafer-level image testing prior to module assembly, both of which improve camera module yield and reduce overall cost.
Uses existing wire-bond assembly infrastructure and processes, minimizing the hurdles to rapid adoption.
Unlike COB technology, it encapsulates the image sensor, MEMS or other optical device with a glass cover that is elevated from the silicon surface using cavity walls. The cover design leaves the image sensor bond pads exposed allowing for standard wire-bond assembly. The protected die is then singulated and mounted to the board using standard die attach processes. Provides the flexibility to perform optical testing at the most favorable point of the assembly flow, as defined by their specific requirements and manufacturing environment.
Tessera, tessera.com
SEMICON West, Booth 8622
Dage has developed a computerized tomography (CT) option for its XiDAT XD7600NT digital x-ray inspection system. The CT option further refines performance with volumetric reconstruction of solder joints.
CT is an imaging method employing tomography whereby digital geometric processing is used to generate a 3-D image model of an object from a large series of individual 2-D x-ray images, or slices, taken about a single axis of rotation.
The CT capability is available as an option with new systems and is suited for analytical analysis of interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package. Equipped with this option, the system can quickly and easily convert between 2-D and 3-D modes for different inspection applications, is capable of ultra fast image reconstruction and can reconstructing up to 1,440 image slices.
When operating in 3-D mode, the sample is rotated in the x-ray beam and multiple 2-D digital images are captured. These 2-D images are fed in real-time to a dedicated reconstruction server where a 3-D model is available for viewing.
The reconstruction server can generate 3-D volumes of 2563, 5123 and 1,0243 using a Feldkamp cone beam reconstruction algorithm with either full or sub-volume reconstruction, with all calculations being carried out by 16 dedicated processing units running in parallel.
The reconstructed 3-D image model can be viewed online or off-line with dedicated image hardware allowing real-time manipulation of 3-D models. Image display features include:
Image Manipulation – rotate, pan and zoom
Clip Image – to eliminate unwanted detail
Volume Rendering – for creation of solid surfaces and maximum intensity, and to vary the opacity and color of volumes
Slices – multiple cross section at any orientation and the ability to vary the opacity and color of individual slices
Illumination Models – single light source or two light sources with shadow computation for optimal 3D perception
Image Save – saving 2D images in JPG or TIF formats
Dage Precision Industries, dageinc.com
CT is an imaging method employing tomography whereby digital geometric processing is used to generate a 3-D image model of an object from a large series of individual 2-D x-ray images, or slices, taken about a single axis of rotation.
The CT capability is available as an option with new systems and is suited for analytical analysis of interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package. Equipped with this option, the system can quickly and easily convert between 2-D and 3-D modes for different inspection applications, is capable of ultra fast image reconstruction and can reconstructing up to 1,440 image slices.
When operating in 3-D mode, the sample is rotated in the x-ray beam and multiple 2-D digital images are captured. These 2-D images are fed in real-time to a dedicated reconstruction server where a 3-D model is available for viewing.
The reconstruction server can generate 3-D volumes of 2563, 5123 and 1,0243 using a Feldkamp cone beam reconstruction algorithm with either full or sub-volume reconstruction, with all calculations being carried out by 16 dedicated processing units running in parallel.
The reconstructed 3-D image model can be viewed online or off-line with dedicated image hardware allowing real-time manipulation of 3-D models. Image display features include:
Image Manipulation – rotate, pan and zoom
Clip Image – to eliminate unwanted detail
Volume Rendering – for creation of solid surfaces and maximum intensity, and to vary the opacity and color of volumes
Slices – multiple cross section at any orientation and the ability to vary the opacity and color of individual slices
Illumination Models – single light source or two light sources with shadow computation for optimal 3D perception
Image Save – saving 2D images in JPG or TIF formats
Dage Precision Industries, dageinc.com
SchmartBoard has released two boards that address tiny discrete surface-mount components.
EZ Discrete #1 supports 0201, 0603, 0805, 1206,1210, 1608, 1812, 2010, 2512, & CAES-A, B, and C. EZ Discrete #2 supports SOT23-3, 5, 6, SC70-5,6, DPAK, D2PAK, SOT223, TO263-7, SOT89, 0805, 1206, & CASE-A, B, C, D and E. Many of these components are very small and require a magnifying glass to see, let alone hand-solder without creating shorts. The boards lock the component in place on the board, and are hand-soldered by touching the board with the soldering iron next to the component.
The SchmartBoard|ez line of prototyping boards was launched in September 2005. The technology makes it possible for novices to hand-solder difficult components quickly and flawlessly the first time they pick up a soldering iron. The family of boards allow engineers, students and hobbyists to hand solder surface-mount components and expanded their capabilities in creating electronic circuit projects.
SchmartBoard, schmartboard.com
EZ Discrete #1 supports 0201, 0603, 0805, 1206,1210, 1608, 1812, 2010, 2512, & CAES-A, B, and C. EZ Discrete #2 supports SOT23-3, 5, 6, SC70-5,6, DPAK, D2PAK, SOT223, TO263-7, SOT89, 0805, 1206, & CASE-A, B, C, D and E. Many of these components are very small and require a magnifying glass to see, let alone hand-solder without creating shorts. The boards lock the component in place on the board, and are hand-soldered by touching the board with the soldering iron next to the component.
The SchmartBoard|ez line of prototyping boards was launched in September 2005. The technology makes it possible for novices to hand-solder difficult components quickly and flawlessly the first time they pick up a soldering iron. The family of boards allow engineers, students and hobbyists to hand solder surface-mount components and expanded their capabilities in creating electronic circuit projects.
SchmartBoard, schmartboard.com
Press Releases
- Amtech Announces Recent Enhancements Focused on Continuous Improvement and Customer Excellence
- Aven to Debut ProVue MAX Series and E-Z Grip Tweezers at MD&M West
- Cetec ERP to Showcase ERP Solutions for Regulatory Compliance and Efficiency at MD&M West 2025
- VJ Electronix Welcomes Don Morgenstern as Eastern Regional Sales Manager