Also new is Amkor's tsMLF (Thin Substrate Micro LeadFrame-TAPP), a sub-100 micron flip chip test die, and the redesigned Cookson, Indium and AIM print test boards and kits.

Also new is Amkor's CVBGA very thin ChipArray BGA.

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• Automated site prep (scavenging) system that permits fully automatic, component removal, noncontact, site prep, and placement of components with minimum operator intervention.
• Automatic and vision assisted placement, which facilitates precision placement of high lead count components such as Cu-CGAs. The system uses machine vision components and software to reduce cycle times and, improve yields. The system can be fully manual or manual with visual assist to allow fast and accurate placement of components that, without this benefit, are difficult to align.
• Wide area profile storage compatibility, which permits central storage of processes and profiles. During runtime, the system checks for the most updated profile through the network and downloads the latest process file on demand or automatically. This allows a central process lab to always maintain and distribute the latest data globally.
• New bottom heater and motorized table, including a 4.0 or 5.6 kW bottom heater designed for Pb-free processes. Also new to this table design is the ability to have a bottom heater cooling boost that decreases cycle times and meets maximum time above liquidus constraints.
• Integrated technical documentation. All manuals, help files, schematics and knowledgebase troubleshooting are imbedded in the SierraMate 7.0 application software. This allows operators and engineers to access all information about the machine locally. All GUI documentation, screens, help files and reports can be localized into native languages to ease in new operator learning.