SinguLign enables the high accuracy mass imaging of multiple materials such as solder paste, solder spheres, flux and adhesive onto singulated substrates or components directly from the carrier, allowing the accurate processing of known good parts down to 20 mm in size.
With an accurate printing platform, specialized tooling, a carrier and a miniaturized print or ball placement head, repeatable and precise deposits can be applied to parts individually. The carrier, which can hold multiple substrates, is transported into the printer where a vacuum tower raises the first substrate or component to print height, secures it in place and aligns the substrate. The substrate is then imaged with the appropriate material for the specific application and is gently lowered back into the carrier. This sequence is repeated for all of the parts and then the carrier is transported to the next process step.
The tooling and parts handling mechanisms allow for maximum print support and enable high-speed processing times for individual parts – as little as 20 sec. for ball placement and less time for other print processes. Said to deliver increased accuracy through the ability to align to substrate features (not package edges); enables ultra fine pitch imaging, providing yield improvement driven by the capability to process only known good parts and supports multiple processes, depositing paste, flux, solder spheres or adhesive. Allows for imaging onto substrates or pre-packaged, 3-D components; permits easy re-deployment for other packaging processes.
Gives packaging specialists the ability to align and image multiple substrates and components at ultra-fine pitch individually.
DEK, www.dek.com
With an accurate printing platform, specialized tooling, a carrier and a miniaturized print or ball placement head, repeatable and precise deposits can be applied to parts individually. The carrier, which can hold multiple substrates, is transported into the printer where a vacuum tower raises the first substrate or component to print height, secures it in place and aligns the substrate. The substrate is then imaged with the appropriate material for the specific application and is gently lowered back into the carrier. This sequence is repeated for all of the parts and then the carrier is transported to the next process step.
The tooling and parts handling mechanisms allow for maximum print support and enable high-speed processing times for individual parts – as little as 20 sec. for ball placement and less time for other print processes. Said to deliver increased accuracy through the ability to align to substrate features (not package edges); enables ultra fine pitch imaging, providing yield improvement driven by the capability to process only known good parts and supports multiple processes, depositing paste, flux, solder spheres or adhesive. Allows for imaging onto substrates or pre-packaged, 3-D components; permits easy re-deployment for other packaging processes.
Gives packaging specialists the ability to align and image multiple substrates and components at ultra-fine pitch individually.
DEK, www.dek.com
Disposable Flextac stencils are an easy, reliable method for stencil printing solder paste on individual BGA component sites for rework. An adhesive side attaches temporarily to the PCB, preventing misalignment and solder paste smearing. Are inexpensive and disposable, help users keep Pb-bearing and Pb-free soldering materials separate, preventing cross-contamination. Are RoHS compliant.
Are part of a complete BGA stencil kit that includes 20 different sizes of BGA rework stencils, a spatula handle and three sizes of spatula blades.
Are laser cut for correct aperture size from high quality, anti-static polymer film with a residue-free adhesive backing. No tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when solder paste is applied. Easy to use and leave no residue on the board surface.
Can be repositioned. The side tabs also serve as solder dams preventing solder paste overspill. Since the residue-free adhesive seals around each BGA pad, one may make as many passes with the squeege as needed to ensure proper aperture filling. The stencil is then peeled off, leaving a perfect deposit of solder on each pad. Disposable, but can be used several times.
CircuitMedic, CircuitMedic.com
Are part of a complete BGA stencil kit that includes 20 different sizes of BGA rework stencils, a spatula handle and three sizes of spatula blades.
Are laser cut for correct aperture size from high quality, anti-static polymer film with a residue-free adhesive backing. No tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when solder paste is applied. Easy to use and leave no residue on the board surface.
Can be repositioned. The side tabs also serve as solder dams preventing solder paste overspill. Since the residue-free adhesive seals around each BGA pad, one may make as many passes with the squeege as needed to ensure proper aperture filling. The stencil is then peeled off, leaving a perfect deposit of solder on each pad. Disposable, but can be used several times.
CircuitMedic, CircuitMedic.com
The Micromex submicron, high-resolution system is optimized for manual and semi-automated solder joint inspection of BGA, CSP, MLF and QFP components. Has an integrated 2 megapixels camera, open 160kV or 180kV submicron x-ray tube and total magnification of up to 13.3X for process control and failure analysis of PCB assemblies.
Comes with new inspection software, quality|assurance 2006. This software automates inspection of PCB assemblies, making pass/fail decisions for BGA, CSP, MLF and QFP without operator interpretations, reducing the numbers of false identifications while speeding throughput and improving efficiency. A powerful algorithm toolbox XE offers solutions for application testing.
Possesses high precision manipulation through its 360° rotation axis and the ability for oblique views up to 70°. A scanning area of 18x14” allows samples with a size up to 26.75 x 25” (680 x 635 mm) with weights of up to 11 lbs. (5 kg).
Comes with new inspection software, quality|assurance 2006. This software automates inspection of PCB assemblies, making pass/fail decisions for BGA, CSP, MLF and QFP without operator interpretations, reducing the numbers of false identifications while speeding throughput and improving efficiency. A powerful algorithm toolbox XE offers solutions for application testing.
Possesses high precision manipulation through its 360° rotation axis and the ability for oblique views up to 70°. A scanning area of 18x14” allows samples with a size up to 26.75 x 25” (680 x 635 mm) with weights of up to 11 lbs. (5 kg).
Phoenix X-ray Systems + Services Inc., phoenix-xray.com
Henkel has developed a die attach and mold compound material set that is Pb-free compatible and designed for thin and ultra-thin surface-mount device applications.
Combined, the Hysol QMI529LS die attach material and Hysol GR828A mold compound deliver the thin, yet highly reliable, materials properties necessary for packages in low-profile products such as cell phones, PDAs, portable music players and entertainment devices .
When manufacturing TSOP, TSSOP and TQFP packages with Au-plated and Ag-plated lead frames, use of the die attach adhesive with the “Green” mold compound reportedly produces superior material set reliability and performance. QMI529LS’ formulation provides hydrophobic properties, while delivering stability at high temperatures. GR828A is a low stress molding compound that exhibits excellent gate leakage performance. Testing of this materials combination to JEDEC Level 1, 260°C has confirmed robust performance even in demanding Pb-free manufacturing conditions.
Henkel,is one of the world’s leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across electronics.henkel.com
Combined, the Hysol QMI529LS die attach material and Hysol GR828A mold compound deliver the thin, yet highly reliable, materials properties necessary for packages in low-profile products such as cell phones, PDAs, portable music players and entertainment devices .
When manufacturing TSOP, TSSOP and TQFP packages with Au-plated and Ag-plated lead frames, use of the die attach adhesive with the “Green” mold compound reportedly produces superior material set reliability and performance. QMI529LS’ formulation provides hydrophobic properties, while delivering stability at high temperatures. GR828A is a low stress molding compound that exhibits excellent gate leakage performance. Testing of this materials combination to JEDEC Level 1, 260°C has confirmed robust performance even in demanding Pb-free manufacturing conditions.
Henkel,is one of the world’s leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across electronics.henkel.com
Model 325 Electrostatic Voltmeter, an ultra-sensitive instrument which is ideal for noncontacting electrostatic voltage measurement and monitoring in applications within high-tech, semiconductor, materials processing, materials science and R&D sectors.
Designed for applications that require highly accurate, low noise, noncontacting measurement of electrostatic voltages from millivolts to +/- 40 V over a range of probe-to-surface distances.
Applications include electrostatic monitoring of devices sensitive to ESD, and testing of the reliability and characteristics of dielectric materials and films in electronic applications.
In semiconductors, is designed to measure the surface potential of bare or processed wafers to analyze doping and thin film characteristics. Also useful for measurements of polarization, residual charge and characterization of electrostatic chucks.
Can monitor electrostatic charge where the build-up of such charge can cause productivity or yield problems, as in high-end processing of paper, plastic, textile or other film products.
In materials science and R&D, applications include contact potential (surface work function) determination, materials evaluation and electret studies.
Features include sensitivity of 1 mV, speed of response less than 3 ms and accuracy better than 0.05% of full scale. Low impedance probe sensor assures measurement accuracy which is essentially independent of probe-to-test-surface spacing while eliminating the external environmental effects of high humidity and contamination on measurement accuracy. Contaminants include airborne dust, ions, chemicals and other particulates.
Offers a higher performance alternative to Model 320C Electrostatic Voltmeter with faster speed of response, lower noise and higher accuracy. Smaller probe also increases the unit’s utility in space-constrained environments. Designed to address demanding semiconductor parameters for permittivity, oxide thickness and integrity, contact potentials and higher-speed automated voltage profile scanning.
Special features allow tuning the performance of the unit to compensate for specific test conditions. Can be operated as a bench top unit or in a standard rack (with optional hardware).
TREK, Inc., trekinc.com
Designed for applications that require highly accurate, low noise, noncontacting measurement of electrostatic voltages from millivolts to +/- 40 V over a range of probe-to-surface distances.
Applications include electrostatic monitoring of devices sensitive to ESD, and testing of the reliability and characteristics of dielectric materials and films in electronic applications.
In semiconductors, is designed to measure the surface potential of bare or processed wafers to analyze doping and thin film characteristics. Also useful for measurements of polarization, residual charge and characterization of electrostatic chucks.
Can monitor electrostatic charge where the build-up of such charge can cause productivity or yield problems, as in high-end processing of paper, plastic, textile or other film products.
In materials science and R&D, applications include contact potential (surface work function) determination, materials evaluation and electret studies.
Features include sensitivity of 1 mV, speed of response less than 3 ms and accuracy better than 0.05% of full scale. Low impedance probe sensor assures measurement accuracy which is essentially independent of probe-to-test-surface spacing while eliminating the external environmental effects of high humidity and contamination on measurement accuracy. Contaminants include airborne dust, ions, chemicals and other particulates.
Offers a higher performance alternative to Model 320C Electrostatic Voltmeter with faster speed of response, lower noise and higher accuracy. Smaller probe also increases the unit’s utility in space-constrained environments. Designed to address demanding semiconductor parameters for permittivity, oxide thickness and integrity, contact potentials and higher-speed automated voltage profile scanning.
Special features allow tuning the performance of the unit to compensate for specific test conditions. Can be operated as a bench top unit or in a standard rack (with optional hardware).
TREK, Inc., trekinc.com
K-Alpha materials characterization instrument uses x-ray photoelectron spectroscopy to quantitatively determine the surface chemical composition of the top few nanometers of solid materials. Insulators, semiconductors and metals can be analyzed in a user-friendly, reliable and automated way. An integral ion source provides a high-resolution depth profiling capability, thus facilitating true 3D analysis. For high-throughput sample analysis.
Thermo Electron Corp., thermo.com/surfaceanalysis
Thermo Electron Corp., thermo.com/surfaceanalysis
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