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EFD’s Solder Paste Group introduces an improved no-clean solder paste product family specifically formulated for SAC 305. Pb-free formulations are known to leave dull, matte finishes, but the new clear, colorless no-clean flux residue allows the solder joint to sparkle. For applications requiring a shiny, cosmetic finish. Said to ease inspection and improve wetting capabilities for SMT, mechanical, electronic and electro-mechanical soldering applications. 
 
EFD, www.efdsolder.com

WaveMax 7000 thermoset composite material features enhanced durability for pallets used in high-temperature wave solder applications. Is made from an epoxy resin and random mat glass substrate. The ratio of glass to epoxy is high to maximize flexural strength and rigidity. Increased durability is critical for high-temperature, high-volume production runs that require a solder pallet to maintain strength at temperatures up to 315°C, for as many as 5000 soldering cycles.  
 
Has flexural strength of 59,000 psi, as well as flexural strength to 39,000 psi at elevated temperatures.
 
Norplex-Micarta, norplex-micarta.com
SigmaQuest software helps OEMs track the quality and performance of products that have been revamped to adhere to the RoHS Directive.
 
SigmaSure on-demand, Web-based software features several modules where the impact of moving to RoHS compliance can be checked. Through its Manufacturing and Test Insight software, users can continuously monitor their manufacturing chain’s product quality data, and OEMs can measure the impact of how new, RoHS-compliant components affect their end products. The Supplier Quality Insight module tracks the quality of core suppliers’ components, including those modified for RoHS compliance, before committing to the assembly of broader product offerings. RMA Insight module delivers knowledge about defects, trends and the root cause of failures on products returned by end customers. OEMs can quickly learn when products are not conforming to specifications along with the cause of product quality issues. 
 
The software also helps to provide “due diligence” information by creating technical files that are loaded with supporting documentation that confirms “RoHS compliance.”  This information is built into the manufacturing process and is systematically quality controlled. Can also provide auditable data about what a company has done to make sure non-compliance is identified in the manufacturing process. 
 
SigmaQuest, www.SigmaQuest.com
‘Advantage X’ enhancement package is said to boost placement rates by 15%. The retrofittable upgrade is suitable for all MIMOT pick-and-place machines; it combines hardware and software advances. Beneficial for high-mix pick-and-place systems, bringing the cph rate to 24,000 for devices from chip components to fine pitch.
 
Features an intelligent nozzle vacuum sensor, automatic polarity checks for feeder setup and other software help tools.
 
Will be a standard feature on all new Advantage Systems.
 
MIMOT, mimot.com
Blue Thunder Technologies will distribute Loctite Multicore product line. The company has been supplying consumables such as GREEN MONSTER! stencil wiping rolls, lint-free wipes, pre-saturated wipes, ESD items, gloves and more to the electronics industry for several years. 

Blue Thunder is now distributing Loctite’s electronic products including but not limited to solder paste, Pb-free solder paste, solder bar, solder wire, underfills, encapsulants, flux materials, surface-mount adhesives, circuit board protection and low-pressure molding.  

BP Microsystems will highlight the latest addition to its Helix automated device programmer at the upcoming NEPCON South China exhibition and conference in Shenzhen.
 
As a desktop automated system, the Helix comes with two precision-designed tray input and output handling systems with a reject location. The updated system is designed to have the same dph and is based on the Helix-TU-10 design. The tray version uses the same core programming technology, as well as the same socket modules as the standard BP Microsystems automated line. The pressure plates are exchangeable between the tray version and the Helix-TU-10 units.
 
Integrated in the handler are two Enhanced 7th Generation programming sites with FX4 socket module capability. This allows for programming up to four devices simultaneously per site. Designed to handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date. 
 
BP Microsystems, www.bpmicro.com
Nepcon Shenzhen booth 52C01

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