PCB Probe Kit provides new or additional test points on PCBs. Engineers attempting to debug an existing system will find this tool useful for hands-free probing and viewing signals on a logic analyzer, oscilloscope, meter or other instrument.
The following components are included: arm probe with a heavy base, spring loaded tip, rotatable head and fine vertical adjustment knob for precise positioning to adjacent test points; small lead clips enabling quick connection to SMD leads from 0.5 to 0.2 mm lead pitch; large lead clips for connection to leads from 1.25 to 0.3 mm lead pitch; SMD clips in four sizes (0201, 0402, 0603, and 0805); SMD clip support with guide wire; and an integrated magnifying glass with tweezers.
OptoTherm, optotherm.com
The following components are included: arm probe with a heavy base, spring loaded tip, rotatable head and fine vertical adjustment knob for precise positioning to adjacent test points; small lead clips enabling quick connection to SMD leads from 0.5 to 0.2 mm lead pitch; large lead clips for connection to leads from 1.25 to 0.3 mm lead pitch; SMD clips in four sizes (0201, 0402, 0603, and 0805); SMD clip support with guide wire; and an integrated magnifying glass with tweezers.
OptoTherm, optotherm.com
FLIP Solder Bath for lead-free reflow soldering features linear induction pumping technology in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, F, per Fleming’s left hand law. The Force moves molten solder upward through nozzles and flow down by gravity. Two induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in selective soldering systems.
Features advantages over other solder bath systems, including less solder used (300 kg, instead of 450 kg) and less solder dross (7 kg vs. 15 kg), after 8 hours of operation.This results in less waste. This feature uses one third less solder for cost savings. Offers ease of maintenance — open space to access inside bath – and easier nozzle cleaning and maintenance. Improved machine reliability and up time is realized — no motors, impeller shafts or belts. Said to feature a quieter, more stable solder wave than impeller motor types. Acid oxidization around the motor spindle is eliminated and a quicker response results.
Tamura H.A. Machinery, tamura-ha.com
Features advantages over other solder bath systems, including less solder used (300 kg, instead of 450 kg) and less solder dross (7 kg vs. 15 kg), after 8 hours of operation.This results in less waste. This feature uses one third less solder for cost savings. Offers ease of maintenance — open space to access inside bath – and easier nozzle cleaning and maintenance. Improved machine reliability and up time is realized — no motors, impeller shafts or belts. Said to feature a quieter, more stable solder wave than impeller motor types. Acid oxidization around the motor spindle is eliminated and a quicker response results.
Tamura H.A. Machinery, tamura-ha.com
Omnify 3.0 enables efficient collaboration in product development and helps companies meet RoHS compliance. Meets compliance objectives for such companies as LuminentOIC, Agfa and Mangrove Systems.
The newest version provides a means of identifying the complete material composition of a part. It classifies compliant and non-compliant parts, provides searching and reporting features, and performs analysis at any level of a product’s structure. Allows manufacturers to store all of the materials declarations/certificates of compliance from suppliers.
Incorporates customer-requested enhancements that accelerate and streamline product development. Customers can achieve faster performance in searching, bill of material loading and engineering change releases in addition to easier importing and exporting of data through XML capabilities.
Improvements include:
Accelerated performance for faster BOM loading, saving, releasing changes and searching;
Vendor part composition fields allowing unlimited vendor attributes;
Enhanced permissions offering extended field/attribute and project level permissions;
Improved document vaulting and new caching options;
Attribute Groups for easy field navigation;
New BOM fields including: balloon/find numbers, alternate items fields and user-defined attribute fields;
Condition-based dynamic workflows to define generic workflows/stages and user assignments based on various field parameters;
XML file formats enabling easy importing and exporting of item and database schema information.
Omnify Software, www.omnifysoft.com
The newest version provides a means of identifying the complete material composition of a part. It classifies compliant and non-compliant parts, provides searching and reporting features, and performs analysis at any level of a product’s structure. Allows manufacturers to store all of the materials declarations/certificates of compliance from suppliers.
Incorporates customer-requested enhancements that accelerate and streamline product development. Customers can achieve faster performance in searching, bill of material loading and engineering change releases in addition to easier importing and exporting of data through XML capabilities.
Improvements include:
Accelerated performance for faster BOM loading, saving, releasing changes and searching;
Vendor part composition fields allowing unlimited vendor attributes;
Enhanced permissions offering extended field/attribute and project level permissions;
Improved document vaulting and new caching options;
Attribute Groups for easy field navigation;
New BOM fields including: balloon/find numbers, alternate items fields and user-defined attribute fields;
Condition-based dynamic workflows to define generic workflows/stages and user assignments based on various field parameters;
XML file formats enabling easy importing and exporting of item and database schema information.
Omnify Software, www.omnifysoft.com
Promation introduced its latest multi-level belt conveyors, the “SM” series.
Is available in widths from 6 to 24" and lengths from 2 to 20'. Variable speed drives may be left to right or right to left, offering different flow directions for each level.
Side guides prohibit products from falling off, and stopper bars may be used at exit points.
Promation, pro-mation-inc.com
Visitors to DEK’s booth at Semicon West show will see live demonstrations of the company’s DirEKt Ball Placement process. Utilizing two in-line Micron-class platforms, this technology enables the placement of solder balls as small as 0.3 mm in diameter onto substrates or wafers at repeatable first-pass yields better than 99%. The first in-line system, a Europa, uses flux imaging technology to deposit flux precisely at each interconnect site. The second machine, a Galaxy, then uses a fully enclosed ball transfer head capable of holding up to 50 million solder balls to guide each solder ball directly to the surface of the stencil and seat each ball in the flux. Process cycle time is fast, regardless of I/O count.
The platform is not limited to ball placement and wafer bumping processes. It hosts a variety of advanced packaging applications such as backside wafer coating, thermal interface materials (TIM) deposition and encapsulation. Some applications include high-speed backside wafer coating of die attach materials, epoxies and protective coatings as thin as 25 microns and singulated substrate printing that allows for the individual alignment and imaging of multiple substrates or components down to 20mm.
DEK, dek.com
Semicon West Booth #7139
The platform is not limited to ball placement and wafer bumping processes. It hosts a variety of advanced packaging applications such as backside wafer coating, thermal interface materials (TIM) deposition and encapsulation. Some applications include high-speed backside wafer coating of die attach materials, epoxies and protective coatings as thin as 25 microns and singulated substrate printing that allows for the individual alignment and imaging of multiple substrates or components down to 20mm.
DEK, dek.com
Semicon West Booth #7139
CSS4050 SMD Tower can store up to 546 reels and trays protected against electrostatic damage in an area of 1 sq. m. Each component can be stored or taken out in less than 10 sec. Can prepare a complete batch with one mouse click; saves search and setup time.
Storage is reportedly easy and secure. Each reel and tray is characterized by a bar code. The operator puts the container on the input/output plate, where bar code and dimension are automatically checked. A robot picks up the container and stores it in a free place. Components that are often moved will be placed in an easily accessible area.
Control software takes over all storing tasks. It supervises the stock and ensures the “first in first out” principle. Each component can be assigned to a moisture class (IPC-Standard 033A) and the allowable operation time in a wet surrounding is controlled. Offers a variety of statistical functions and can include external storage places.
Within the Tower, sensitive components are secure. The materials in use guarantee full electrostatic, temperature and moisture protection.
Can be used in low- or high-volume production. If batch sizes are low and changeovers are frequent, the automatic storage system saves time and reduces search trouble. Can be expanded with additional SMD Towers. The database can be connected to existing ERP systems or to MIS optimization setup software.
ESSEMTEC, essemtec.com
Storage is reportedly easy and secure. Each reel and tray is characterized by a bar code. The operator puts the container on the input/output plate, where bar code and dimension are automatically checked. A robot picks up the container and stores it in a free place. Components that are often moved will be placed in an easily accessible area.
Control software takes over all storing tasks. It supervises the stock and ensures the “first in first out” principle. Each component can be assigned to a moisture class (IPC-Standard 033A) and the allowable operation time in a wet surrounding is controlled. Offers a variety of statistical functions and can include external storage places.
Within the Tower, sensitive components are secure. The materials in use guarantee full electrostatic, temperature and moisture protection.
Can be used in low- or high-volume production. If batch sizes are low and changeovers are frequent, the automatic storage system saves time and reduces search trouble. Can be expanded with additional SMD Towers. The database can be connected to existing ERP systems or to MIS optimization setup software.
ESSEMTEC, essemtec.com
