AkroMetrix will display its latest product, the LineMoiré automated flatness measurement system, Model J5000, at Semicon West booth #8301.
The high-speed, full-field shadow moiré technique allows for flatness measurement of chip-carriers/substrates, packages and ICs in JEDEC (or similar) trays. Can measure the full contents of a tray simultaneously (with one-sec. data acquisition time per tray), has integrated tray stack/destack and part sorting capabilities. Can measure stacks of trays, replace “bad” parts (i.e., parts that fail a user-specified warpage specification) with known good parts, and then stack good and bad trays separately. This is important for incoming/outgoing inspection of parts. Enables flatness characterization before any value added processing is performed.
COMET has added an upgrade to its Feinfocus Cougar X-Ray platforms: Computerized Numerical Control (CNC). This enables operators to program and automate x-ray inspection procedures, as well as perform 2-D measurements of hidden details during failure analysis without the need for calibration.
CNC provides numerous benefits, facilitating an efficient failure analysis process. With the ability to program the manipulation system of the platform, CNC can automatically position the optical overview camera in the optimal position for inspection. Operators can even program the entire inspection process with CNC, including x-ray parameters and image processing, eliminating costly variables associated with manual control. User-friendly “teach-in” buttons enable easy programming.
The platform provides x-ray inspection for a range of inspection needs, from 2-D failure analysis of manufacturing components to advanced 3-D imaging of complex BGA and wafer-level packages. Has a small, ergonomic design, small footprint (approximately 1 m x 1 m), low system weight (approx. 1,450 kg) and convenient front- and side-door service access. Includes a microfocus x-ray tube up to 160 Kv, standard 5-axes manipulator with Auto Isocentric Motion (AIM) Technology for oblique viewing, CNC Capabilities, HDX-Ray real-time 16-bit image processing, digital flat panel detector and a hardware-driven anti-collision system.
PCB Probe Kit provides new or additional test points on PCBs. Engineers attempting to debug an existing system will find this tool useful for hands-free probing and viewing signals on a logic analyzer, oscilloscope, meter or other instrument.
The following components are included: arm probe with a heavy base, spring loaded tip, rotatable head and fine vertical adjustment knob for precise positioning to adjacent test points; small lead clips enabling quick connection to SMD leads from 0.5 to 0.2 mm lead pitch; large lead clips for connection to leads from 1.25 to 0.3 mm lead pitch; SMD clips in four sizes (0201, 0402, 0603, and 0805); SMD clip support with guide wire; and an integrated magnifying glass with tweezers.
FLIP Solder Bath for lead-free reflow soldering features linear induction pumping technology in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, F, per Fleming’s left hand law. The Force moves molten solder upward through nozzles and flow down by gravity. Two induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in selective soldering systems.
Features advantages over other solder bath systems, including less solder used (300 kg, instead of 450 kg) and less solder dross (7 kg vs. 15 kg), after 8 hours of operation.This results in less waste. This feature uses one third less solder for cost savings. Offers ease of maintenance — open space to access inside bath – and easier nozzle cleaning and maintenance. Improved machine reliability and up time is realized — no motors, impeller shafts or belts. Said to feature a quieter, more stable solder wave than impeller motor types. Acid oxidization around the motor spindle is eliminated and a quicker response results.
Omnify 3.0 enables efficient collaboration in product development and helps companies meet RoHS compliance. Meets compliance objectives for such companies as LuminentOIC, Agfa and Mangrove Systems.
The newest version provides a means of identifying the complete material composition of a part. It classifies compliant and non-compliant parts, provides searching and reporting features, and performs analysis at any level of a product’s structure. Allows manufacturers to store all of the materials declarations/certificates of compliance from suppliers.
Incorporates customer-requested enhancements that accelerate and streamline product development. Customers can achieve faster performance in searching, bill of material loading and engineering change releases in addition to easier importing and exporting of data through XML capabilities.
Improvements include: Accelerated performance for faster BOM loading, saving, releasing changes and searching; Vendor part composition fields allowing unlimited vendor attributes; Enhanced permissions offering extended field/attribute and project level permissions; Improved document vaulting and new caching options; Attribute Groups for easy field navigation; New BOM fields including: balloon/find numbers, alternate items fields and user-defined attribute fields; Condition-based dynamic workflows to define generic workflows/stages and user assignments based on various field parameters; XML file formats enabling easy importing and exporting of item and database schema information.
Promation introduced its latest multi-level belt conveyors, the “SM” series.
Is available in widths from 6 to 24" and lengths from 2 to 20'. Variable speed drives may be left to right or right to left, offering different flow directions for each level.
Side guides prohibit products from falling off, and stopper bars may be used at exit points.