Visitors to DEK’s booth at Semicon West show will see live demonstrations of the company’s DirEKt Ball Placement process. Utilizing two in-line Micron-class platforms, this technology enables the placement of solder balls as small as 0.3 mm in diameter onto substrates or wafers at repeatable first-pass yields better than 99%. The first in-line system, a Europa, uses flux imaging technology to deposit flux precisely at each interconnect site.  The second machine, a Galaxy, then uses a fully enclosed ball transfer head capable of holding up to 50 million solder balls to guide each solder ball directly to the surface of the stencil and seat each ball in the flux. Process cycle time is fast, regardless of I/O count.
 
The platform is not limited to ball placement and wafer bumping processes. It hosts a variety of advanced packaging applications such as backside wafer coating, thermal interface materials (TIM) deposition and encapsulation. Some applications include high-speed backside wafer coating of die attach materials, epoxies and protective coatings as thin as 25 microns and singulated substrate printing that allows for the individual alignment and imaging of multiple substrates or components down to 20mm. 
 
DEK, dek.com
Semicon West Booth #7139

CSS4050 SMD Tower can store up to 546 reels and trays protected against electrostatic damage in an area of 1 sq. m. Each component can be stored or taken out in less than 10 sec. Can prepare a complete batch with one mouse click; saves search and setup time.
 
Storage is reportedly easy and secure. Each reel and tray is characterized by a bar code. The operator puts the container on the input/output plate, where bar code and dimension are automatically checked. A robot picks up the container and stores it in a free place. Components that are often moved will be placed in an easily accessible area.
 
Control software takes over all storing tasks. It supervises the stock and ensures the “first in first out” principle. Each component can be assigned to a moisture class (IPC-Standard 033A) and the allowable operation time in a wet surrounding is controlled. Offers a variety of statistical functions and can include external storage places.
 
Within the Tower, sensitive components are secure. The materials in use guarantee full electrostatic, temperature and moisture protection.
 
Can be used in low- or high-volume production. If batch sizes are low and changeovers are frequent, the automatic storage system saves time and reduces search trouble. Can be expanded with additional SMD Towers. The database can be connected to existing ERP systems or to MIS optimization setup software.
 
ESSEMTEC, essemtec.com
           

ELC-200 applies labels on PCBs or final products, and can print barcodes in 1- and 2-D onto PCBs. Operated by PC control, features an extruded aluminum frame with painted vanity panels and a transparent cover.
 
Features the ability to handle PCBs from 50 x 50 mm to 330 x 250 mm, three-color light tower lamp with audible alarm, conforms to SMEMA Spec.1.2, mechanical front stopper and clamper, and more.
 
Has a maximum fixed conveyor speed of 200 mm/sec., and a maximum processing speed average of 8 sec./label. With a 15" LCD monitor, the system features left to right travel with the front rail fixed, labeling head rotation of 90°/180°, and attaches by vacuum pick-up and blow. Robot control on the x-axis is 600 mm and 400 mm on the y-axis, and cylinder control is 300 mm on the z-axis. The label printer is a 300 dpi Zebra 110X13.
 
Printer features include a maximum print area of 99 x 100 mm, 300 dpi resolution (12 dots per mm), 22 kg weight and the following media specs: label and liner width of 20 to 114 mm, and ribbon width of 20 to 110 mm.
 
Options include a barcode reader, a 15" LCD touch-screen monitor, ESD grounding receptacles, auto-Z axis adjust, auto-width adjust and a 600 dpi printer.
 
Eunil H.A. Americas, eunil.com

Hysol QMI536NB is a new die attach material for stacked die applications that require extremely low stress and robust mechanical properties. The material is qualified for Pb-free environments and provides an alternative to film die attach. Enables users to qualify a single material for stacked die packages. (Traditionally, different die attach materials are used for the various layers of a stacked package to avoid damage to the die passivation of the first die.)  With its protective and low-bleed formulation, the novel material can be used for both mother and daughter die.
 
Accelerated Cooling (AC) process for flip-chip manufacturing is used in conjunction with Henkel’s non-conductive paste (NCP) underfill encapsulants, Hysol FP5000 and Hysol FP5001. It enables rapid cooling of the device prior to any excessive heat exposure; is said to reduce warpage and voids while improving cycle time by nearly 50% over that of previous thermal compression processes. 
 
Hysol QMI529LS and Hysol GR828A material set is a die attach and mold compound combination designed specifically for thin and ultra-thin surface mount device applications. Both are optimized for Pb-free environments and provide the thin, yet reliable, materials characteristics required for low-profile consumer electronics.
 
Henkel Corp., electronics.henkel.com