ELC-200 applies labels on PCBs or final products, and can print barcodes in 1- and 2-D onto PCBs. Operated by PC control, features an extruded aluminum frame with painted vanity panels and a transparent cover.
 
Features the ability to handle PCBs from 50 x 50 mm to 330 x 250 mm, three-color light tower lamp with audible alarm, conforms to SMEMA Spec.1.2, mechanical front stopper and clamper, and more.
 
Has a maximum fixed conveyor speed of 200 mm/sec., and a maximum processing speed average of 8 sec./label. With a 15" LCD monitor, the system features left to right travel with the front rail fixed, labeling head rotation of 90°/180°, and attaches by vacuum pick-up and blow. Robot control on the x-axis is 600 mm and 400 mm on the y-axis, and cylinder control is 300 mm on the z-axis. The label printer is a 300 dpi Zebra 110X13.
 
Printer features include a maximum print area of 99 x 100 mm, 300 dpi resolution (12 dots per mm), 22 kg weight and the following media specs: label and liner width of 20 to 114 mm, and ribbon width of 20 to 110 mm.
 
Options include a barcode reader, a 15" LCD touch-screen monitor, ESD grounding receptacles, auto-Z axis adjust, auto-width adjust and a 600 dpi printer.
 
Eunil H.A. Americas, eunil.com

Hysol QMI536NB is a new die attach material for stacked die applications that require extremely low stress and robust mechanical properties. The material is qualified for Pb-free environments and provides an alternative to film die attach. Enables users to qualify a single material for stacked die packages. (Traditionally, different die attach materials are used for the various layers of a stacked package to avoid damage to the die passivation of the first die.)  With its protective and low-bleed formulation, the novel material can be used for both mother and daughter die.
 
Accelerated Cooling (AC) process for flip-chip manufacturing is used in conjunction with Henkel’s non-conductive paste (NCP) underfill encapsulants, Hysol FP5000 and Hysol FP5001. It enables rapid cooling of the device prior to any excessive heat exposure; is said to reduce warpage and voids while improving cycle time by nearly 50% over that of previous thermal compression processes. 
 
Hysol QMI529LS and Hysol GR828A material set is a die attach and mold compound combination designed specifically for thin and ultra-thin surface mount device applications. Both are optimized for Pb-free environments and provide the thin, yet reliable, materials characteristics required for low-profile consumer electronics.
 
Henkel Corp., electronics.henkel.com

Merit Sensor has received its first Alphasem EasyLine 8088 “Sensor Bonder.” The machine will play a role in the ramp-up of its new production site in Utah. The sensors to be produced at this site are mainly for medical applications (such as blood pressure sensors.)
 
According to a press release, the process control and high throughput of the machine were decisive selling points, as were the handling of ceramic substrates and the die technology. The machine enables Merit to boost pressure sensor output.
 
The equipment is based on the EasyLine platform and features high-speed air bearing pick-and -place, closed-loop linear motor pick tool for bond line thickness control and fully automatic wafer handling system. To meet demands in the field of MEMS and sensors, an active Theta control of the bond head has been implemented.
 
Merit Sensor Systems, www.merit-sensor.com

Ultrasonic Systems will demonstrate the Prism System coating microBGA and flip chip substrates at Semicon West. The system uses ultrasonic technology with a 60 khz titanium spray head and digitally controlled liquid delivery system.  The flux coating thickness ranges from sub-micron to 3 microns.
 
Includes a XYZ gantry with ball screw drives and closed loop servo controls.  Windows XP software allows for easy programming and operator interface to the machine.  Available as batch mode or conveyorized configuration.
 
Ultrasonic Systems, ultraspray.com
Semicon West Booth 8007