The PalletPal Rotator can be used to rotate fully loaded pallets, replace broken pallets, and switch to or from in-house/shipping pallets, transfer loads to slip sheets, and replace damaged goods at the bottom of a load without the need for manual restacking.

Handles loads up to 48 x 48 x 60" with capacities up to 4400 lbs. Loads rotate a full 180° on a massive anti-friction turret bearing and can be stopped at any point during rotation.

Southworth Products, www.Southworthproducts.com

UV15DC80 UV- and heat-curable epoxy is designed for bonding, sealing, coating and potting applications. Is low-viscosity, environmentally-friendly and is easy to apply and requires no mixing. Reportedly cures in shadowed areas by supplemental heat curing at 80°C for 15 to 30 min. Comes in half-pint, pint, quart, gallon, and five-gallon pail containers, and in syringe applicators.

Master Bond, www.masterbond.com

The FlashCORE family of manual and automated programming solutions has been adapted and optimized to program mDOC H3 devices at very high speeds. This enables mass adoption of mDOC H3 in mobile handsets and consumer electronics devices. mDOC H3 is the first multi-source embedded flash drive specifically designed for mobile handset vendors and consumer electronics manufacturers.

DOC H3 products from msystems, Hynix and Toshiba will be available in quantities suitable for mass production later this year.

Data I/O, www.dataio.com.

msystems, www.m-systems.com

VShare product lifecycle management toolset supports DfM collaboration between PCB design and engineering by means of a centralized, scalable platform that offers secure access to important design information and DfM issues. The tool’s dashboard is said to capture all relevant DfM data in a centralized environment so that all users can work in real-time with the same, graphically-rich data set. Runs using standard Internet browsers within a secure, Web-based environment. Can import DfM results other Valor tools and attach graphical or text objects. Generates reports on critical steps, project status and details, and approvals. The platform starts at $25,000 for a company-wide package.

Valor Computerized Systems, valor.com

The open-source Interconnector design suite enables design and testing of chip-to-chip interconnections supporting signaling rates of up to 25Gbps. The software can be used to assemble a system, select ICs, channels and connectors; test components to analyze performance; and trigger the signal generator to create source and sink data.

The first version is offered to solicit user feedback to help shape the production version. Future versions will use S-parameter data from tests of actual materials and structures.

SiliconPipe, www.SiliconPipe.com

Circuitmedic’s Flextac Wire Dots, for wire tacking, consist of pre-cut shapes of a thin, flexible polymer film, membrane coated on one side with a high performance sensitive adhesive.

Flextac Wire Dots are said to apply instantly to a clean PCB surface with no curing time and no bonding to skin or clothes or difficult cleanup. They reportedly maintain their hold across a wide range of process and operating temperatures, and will hold securely after exposure to numerous chemicals. Will hold securely through a typical PCB hot water wash. Are RoHS/WEEE compliant.