DataFlex Plus thermal transfer overprinter (TTO) provides on-line printing of variable and real-time data, such as expiration dates, batch/lot codes, ingredients/parts listings, bar codes and logos.
 
Direct-drive ribbon technology contains few wearable parts, increasing reliability and minimizing downtime and costs associated with ribbon breaks. Standard 1,000 meter ribbon means less frequent changes and higher production line efficiency. Features simple ribbon cassette
 
Has an intuitive 8.4” SVGA GUI and color touch screen with easy-to-learn, icon-based controls. The standard WYSIWYG job display features a zoom facility to reduce operator error and minimize printing incorrect codes. Has three levels of password protection.
 
Bi-directional ribbon drive allows unused ribbon to be recaptured following each print. This maintains a 1 mm gap between prints for the complete length of the ribbon, creating more prints per roll.
 

Axiom X-1022 Dual-Lane dispensing system maximizes throughput during multi-pass underfill operations. Increases the number of units per hour (UPH) produced in high-volume semiconductor applications such as flip chip and CSP underfill. Allows parallel processing on two lanes for continuous dispensing, eliminating lost time in non-dispensing activities. In some applications, a 60 to 80% increase in throughput over single-lane dispensers can be achieved.
 
Dual-lane capability allows underfill flow-out in one lane while jetting underfill in the opposite lane. Eliminates wait-time by enabling two dispensing processes at the same time.
 
The conveyors are independently controlled, allowing different-sized parts to be processed in lanes one and two. Programmable flat-belt, dual-lane conveyor allows for a variety of process carriers, including Auer boats, lead frames and custom carriers. Conveyor is SMEMA compliant with a fixed first rail and adjustable second, third and fourth rails. 
 
Configured with up to six stations of contact or impingement heating, three stations per lane: pre-heat, dispense and post-heat. The heat stations ensure consistent substrate heating at specified ramp rates for efficient, reliable fluid dispensing.
 
Fluidmove for Windows XP software offers advancements in throughput, fluid management and process control. For example, the board or substrate is sensed in the pre-dispense station and the associated dispensing program is automatically loaded.
 
Mass Flow Control and Calibrated Process Jetting control the critical aspects of the fluid dispensing process in a closed feedback loop.  
 

Model 3500-III flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach and flip chip operations over a 720 sq. in. work area.  Applications include flip chip, stacked die, chip-on-board, fine pitch SMT, MEMs devices, multichip modules, microwave modules, optoelectronic modules and hybrid microcircuits.
 
Capable of automated eutectic die attach using backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets. Pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.
 
Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the sub-micron axis resolution yields placement repeatability of better than ±12 micron (0.5 mil), 3 sigma with fluids, ±5 micron (0.2 mil), 3 sigma with pulse heat eutectic applications. 
 
Placement of the die in relation to a previously placed die can also be tightly controlled through custom automation algorithms. 
 
Machine base is a honeycomb core optical table that provides vibration damping and thermal settling response. Large work area. Cantilever design permits unobstructed, open access on three sides for set-up. Soft touchdown or non-contact laser height sensing mechanisms assist in pickup and placement of fragile devices. Eight-position turret head can rapidly change tools on the fly without a tool dock assembly.  Constructed from an optical breadboard where parts can be bolted down in a myriad of configurations, so any form of presentation such as expanded wafers, waffle or gel packs, tubes, or tape and reel may be used and options for up to three dispensers, hot rails, heat cure stations, hot gas, UV fluid curing systems, and more can be incorporated.  
 
Has infrared light curtain around the open perimeter of the assembly cell. This sends an infrared signature down each inch of the perimeter so that it cannot be fooled by background thermal radiation. When the system is in operation and the safety curtain is violated, the system immediately (within ~ 3 millisec.) shorts the inputs to the digital servo driven motors, stopping all motion.
 
Uses Windows XP.
 
Palomar Technologies, www.palomartechnologies.com

EPM-2493 low-viscosity, thermal interface material meets the challenges of the high-temperature and high-stress operating conditions in electronic packaging. Low outgassing property is ideal for situations, such as electro-optic systems, in which contamination is a concern. Low viscosity provides an easy-to-dispense material that flows easily through dimensionally intricate electronic configurations.
 
NuSil Technology, nusil.com