CTS Connect air-actuated internal or external connectors for effective sealing on smooth, rough or threaded circular features of a part create a tight, long-lasting seal. New leak test accessory products include:
Digital Vacuum Gauge
Portable Leak Finder
Digital Vacuum/Pressure Gauge
Calibrated Leak/Flow Standards
Calibrated Helium Leak Standards
The company will also exhibit the Sentinel M24 and Sentinel C-20. M24 is a compact, multi-station leak test instrument that provides repeatable, high-resolution tests, fast cycle times, a VFD graphic display and an enhanced operator interface.
C-20 pressure decay leak test instrument is a compact device for simple, fast, economical verification of product leak integrity. “Quik Test” feature enables a shorter test cycle time, as much as 80%, by detecting obvious accept or reject parts early in the test cycle.
Cincinnati Test Systems, cincinnati-test.com
ATE booth 540
Digital Vacuum Gauge
Portable Leak Finder
Digital Vacuum/Pressure Gauge
Calibrated Leak/Flow Standards
Calibrated Helium Leak Standards
The company will also exhibit the Sentinel M24 and Sentinel C-20. M24 is a compact, multi-station leak test instrument that provides repeatable, high-resolution tests, fast cycle times, a VFD graphic display and an enhanced operator interface.
C-20 pressure decay leak test instrument is a compact device for simple, fast, economical verification of product leak integrity. “Quik Test” feature enables a shorter test cycle time, as much as 80%, by detecting obvious accept or reject parts early in the test cycle.
Cincinnati Test Systems, cincinnati-test.com
ATE booth 540
Eunil H.A. Americas has added the PARMI SPI 3-D paste inspection system to its product line.
The in-line solder paste inspection system reportedly provides reliable, accurate, 100% inspection at high speeds. Inspects numerous kinds of solder paste defects after screen printing by measuring height, area and volume in conjunction with the system’s fast and accurate 3-D data.
Can detect printing faults (volume, height, area, registration, bridge) and monitor the printing process, which helps the operator find the printing status quickly on the line. Uses SPC, providing printing process monitoring and control both on- and off-line.
Increases first pass yield by preventing faulty PCBs from going through the next process. Prevents in-circuit test and outdoor failure, provides control of the printing process.
The in-line solder paste inspection system reportedly provides reliable, accurate, 100% inspection at high speeds. Inspects numerous kinds of solder paste defects after screen printing by measuring height, area and volume in conjunction with the system’s fast and accurate 3-D data.
Can detect printing faults (volume, height, area, registration, bridge) and monitor the printing process, which helps the operator find the printing status quickly on the line. Uses SPC, providing printing process monitoring and control both on- and off-line.
Increases first pass yield by preventing faulty PCBs from going through the next process. Prevents in-circuit test and outdoor failure, provides control of the printing process.
Eunil H.A. Americas, parmi.com
440-R SMT Detergent is available in a ready-to-use spray bottle for safe, effective manual cleaning of SMT stencils and related tooling. The stencil-cleaning chemistry is verified for specific parameters of environmental safety, user safety and cleaning efficiency by the U.S. EPA’s Environmental Technology Verification Program.
While ultrasonic technology is effective for removing solder paste from SMT stencils, manual cleaning continues to be common. Stencil cleaning has been identified as the most hazardous process with the greatest potential environmental impact associated with SMT assembly. Flammable and VOC solvents such as alcohol and acetone are commonly used for manual cleaning and poisonous heavy metals such as lead often come in contact with the user. This safe water-soluble detergent cleans effectively, improves print production and eliminates noxious odors and hazards associated with solvent cleaning.
Smart Sonic Corp., smartsonic.com
AT Expo booth 6027
While ultrasonic technology is effective for removing solder paste from SMT stencils, manual cleaning continues to be common. Stencil cleaning has been identified as the most hazardous process with the greatest potential environmental impact associated with SMT assembly. Flammable and VOC solvents such as alcohol and acetone are commonly used for manual cleaning and poisonous heavy metals such as lead often come in contact with the user. This safe water-soluble detergent cleans effectively, improves print production and eliminates noxious odors and hazards associated with solvent cleaning.
Smart Sonic Corp., smartsonic.com
AT Expo booth 6027
Speedline Technologies has added a chemical
isolation option to its Accel MicroCel S2 centrifugal cleaning system. This platform enhancement improves existing
zero-discharge systems and extends the life of mixed-bed deionizing
resins.
The open programming platform and interface are said to make the chemical isolation option simple to set up. The system can be configured as a complete on-board, internal closed-loop recycle system, and as such the option can reduce operating costs.
The chemical isolation option will help minimize the amount of residual chemistry carried from the process chamber to the rinse vessel. The system can then reprocess the used rinse water through the internal closed-loop recycle system without contaminating the mixed bed deionizing resins, then recharge the rinse water to its previous deionized state.
Speedline Technologies, speedlinetech.com
FEINFOCUS HDCT-FOX 2-D/3-D x-ray inspection system combines high-resolution 2-D X-Ray technology and enhanced 3-D computed tomography techniques with Feinfocus HDX-Ray technology for inspection and analysis of complex electronic devices in the third dimension. For thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects and hybrids.
Versatile, combines functionality of a standard microfocus x-ray system with the ability to generate 3-D imagery.
Utilizing HDX-Ray technology, it instantaneously captures high-resolution 2-D images and reconstructs 3-D volume models, providing insight into design and manufacturing processes. Modular hardware- and software-based CT interface accommodates a variety of imaging chains, with automatic configuration of the detector for optimal CT resolution.
Designed for integration with iView technology developed by TeraRecon, allowing instantaneous uploading of sets of 3-D images to a secure Website. This allows F/A service labs to transmit 2-D and CT imagery instantly using a high-speed internet connection. X-ray scanning process can be centralized while the image analysis is decentralized, and vice-versa.
COMET, comet.ch
Versatile, combines functionality of a standard microfocus x-ray system with the ability to generate 3-D imagery.
Utilizing HDX-Ray technology, it instantaneously captures high-resolution 2-D images and reconstructs 3-D volume models, providing insight into design and manufacturing processes. Modular hardware- and software-based CT interface accommodates a variety of imaging chains, with automatic configuration of the detector for optimal CT resolution.
Designed for integration with iView technology developed by TeraRecon, allowing instantaneous uploading of sets of 3-D images to a secure Website. This allows F/A service labs to transmit 2-D and CT imagery instantly using a high-speed internet connection. X-ray scanning process can be centralized while the image analysis is decentralized, and vice-versa.
COMET, comet.ch
UV40 UV curable conformal coating is for high-volume automotive and consumer electronics manufacturers who want the rapid cure of UV products, but require the processing ease of their current coatings. Maintains the speed of cure and environment-friendly chemistry required for electronic fabrication.
Adheres to many commonly used solder resists and offers high resistance to a range of solvents. Provides higher insulation resistance, moisture insulation resistance and a reliable moisture activated secondary cure mechanism. Provides flexibility over a range of temperatures and does not become brittle at lower ranges.
Is 100% solids and meets all ISO 14001, IPC-CC-830 and major H&S/hazardous chemical regulatory requirements.
HumiSeal, humiseal.com
Adheres to many commonly used solder resists and offers high resistance to a range of solvents. Provides higher insulation resistance, moisture insulation resistance and a reliable moisture activated secondary cure mechanism. Provides flexibility over a range of temperatures and does not become brittle at lower ranges.
Is 100% solids and meets all ISO 14001, IPC-CC-830 and major H&S/hazardous chemical regulatory requirements.
HumiSeal, humiseal.com
