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FINETECH will highlight the compact rework system Fineplacer CRS10 at Nepcon South China on Aug. 29 to Sept. 1.
 
The rework station handles the complete rework process and supports automated component placement and lift-off. Has user-friendly Chinese software. Better than 10 µm placement accuracy allows for rework of high density packaged boards. Large field of view accommodates large component alignment (e.g., super BGAs with side lengths of up to 45 mm), without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE". Typical applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components such as 0201, 0402, 0603 and connectors, RF-shields, shielding frames, flip chip rework and customized applications.
 
FINETECH, www.finetech.de
Nepcon Shenzhen booth 2G71
ESSEMTEC AG will highlight CSM7100, a flexible pick-and-place system with intelligent feeders for high-mix/low-volume production, at the upcoming NEPCON South China exhibition and conference.
 
Features large feeder capacity, intelligent feeders and easy-to-use operation software. Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
 
Ooffers a wide application range, feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
 
Includes machine operation software Lightplacer. Barcode labels on feeders and components guarantee the correct and quick feeder setup using a barcode reader.
 
Footprint is 80 x 80 cm.
 
 
ESSEMTEC, essemtec.com
Nepcon South China booth 2C50
KIC will showcase its 24/7 Process Monitor at the upcoming Nepcon South China exhibition and conference in Shenzhen.
 
24/7 Process Monitoring brings automation to the thermal process: Automatic profiling of each product, around-the-clock monitoring, SPC charting, analysis, documentation and production traceability -- all in a single, intuitive product. Continuous tracking occurs in the background, never interrupting production. Real-time process data enables engineers to make crucial cost containment and quality control decisions.
 
Uses custom probes installed inside the oven at the product level to gather and record real-time thermal process data for every product. Automatically charts all critical process specs: peak temperature, soak time, time above liquidous, etc. The data is plotted on real-time control charts and process capability (Cpk) is calculated for each specification. The overall process window index (PWI) is charted, providing a real-time Cpk for the entire process. Any process drift outside of control limits or defined Cpk value will immediately trigger an alarm. Real-time Cpk tracking provides a zero-defect, fail-safe system that automatically identifies potential defects before they occur.
 
KIC, kicthermal.com
Nepcon South China booth 2D58
3-D engineering models for all DEK printer subassemblies can now be downloaded over the Internet, allowing machine owners to examine components in detail without taking a machine offline, and to verify and order new parts or upgrades quickly and easily.
 
The 3-D Find-a-Part service is free to all DEK machine owners, and is accessible 24/7 via the secure technical support account pages at www.dek.com.
 
Models are the actual CAD models used by DEK engineers, and are accurate, fully detailed and up to date. Customers can rotate the models in three axes, measure dimensions, zoom in or zoom out, isolate and inspect individual sub-components, and find part numbers using context sensitive keys. Price and availability, as well as online ordering, are also supported.
 
Because of the large file size for each model, DEK has installed extra, dedicated Internet infrastructure to support the service, so customers can view any model on screen in the time it takes to download the file.
 
“This service is valuable for customers needing to quickly inspect any subassembly or optional unit, such as a print head or underscreen cleaner, and also streamlines ordering of replacement or upgrade parts,” said Jon Howell, Customer Service Group manager. “As well as providing a more powerful troubleshooting solution than hard copy general assembly drawings, customers no longer have to spend time describing a required component to DEK sales or support staff. Examining a component and finding the part number now requires just a few simple mouse clicks.”
 
DEK, www.dek.com
 
Servo-Flo 305 System is a mid-sized shot meter for robotic and automated dispensing applications such as bonding, gasketing, filling and sealing operations. The robust positive rod displacement and servo-motor design will dispense abrasive and filled one-component adhesives and sealants such as epoxies, silicones, urethanes and mastics.
 
Delivers a precise flow rate of material to a Snuf-Bak, Tip-Seal or No-Drip dispense valve for accurate start-stop of material flow. Can be floor-, pedestal- or robot-mounted for automation or manual applications. System-design selections include meter-volume size, material-temperature control, operator interface, dispense valve, material supply and system integration.
 
Closed-loop processor ensures precise shot volumes, consistent bead diameters and variable bead diameters during the dispense cycle. Using the touch-screen interface, the operator sets flow rates and material volume and the automation selects stored flow-rate and shot-volume programs for different parts.
 
Sealant Equipment & Engineering, sealantequipment.com

The Solder Paste Group of EFD and Leister Technologies will jointly market an automated tabletop solder paste reflow system.

 
The soldering system combines EFD’s auger valve and Ultra TT tabletop dispensing robot with Leister’s Novolas diode laser. Uses EFD’s SolderPlus solder paste. The solder paste formulations available are fast, clog-free and designed to support the sub-second reflow cycles times common with laser heating.
 
The package system includes SolderPlus paste, the Ultra TT robot, EFD ProcessMate 6500 temperature control system and the diode laser, all housed in a laser-safe certified cabinet. These system components can also be bought individually.
                                                                                                  
EFD and Leister have aimed the marketing of their system at users requiring discreet, precise, rapid heating and controlled non-spatter high-yield solder performance.
 
The package is ideal for processes requiring non-contact point-to-point soldering of temperature-sensitive parts, especially component manufacturers serving the automotive and medical industries. Heat damage to temperature-sensitive plastics is said to be eliminated with the system.
 
www.efdsolder.com or www.leisterlaser.com

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