No. 926 is an electrically-heated, 250°F shelf oven from Grieve, currently used for aging electrical components. 12kW installed in Nichrome wire elements provide heat to the load. Workspace measures 68 x 30 x 66”. A 1000 CFM, 1 HP recirculating blower provides horizontal airflow.
Shelf oven features 4” insulated walls, aluminized steel interior and exterior, plus a 20 x 56” double-pane Lexan window in each of the unit’s two doors.
Includes a disposable fresh air filter, digital indicating temperature controller, manual reset excess temperature controller with separate contactors, recirculating blow airflow safety switch and a remote control panel.
The Grieve Corp., www.grievecorp.com
Shelf oven features 4” insulated walls, aluminized steel interior and exterior, plus a 20 x 56” double-pane Lexan window in each of the unit’s two doors.
Includes a disposable fresh air filter, digital indicating temperature controller, manual reset excess temperature controller with separate contactors, recirculating blow airflow safety switch and a remote control panel.
The Grieve Corp., www.grievecorp.com
SSM4A rework machine is suitable for power semiconductors, bobbins, sensors, transformers and other components. Is ergonomically designed, fast and productive, even for semi-skilled operators.
Retrofits for existing SSM 4-, SSM 9- and PCBRM machines are available. Can be equipped with a nitrogen option.
Zevac AG, zevac.ch
Retrofits for existing SSM 4-, SSM 9- and PCBRM machines are available. Can be equipped with a nitrogen option.
Zevac AG, zevac.ch
Tyco Electronics has a new high-current Card Edge connector based on its SEC-II product line. The power connectors are said to increase the current carrying capacity by over 70% compared to traditional card edge connectors. The increased ampacity comes from a triple beam power contact, which increases the cross sectional area of the contact yet maintains the same mating force and contact wipe as the SEC-II signal contacts.
Carries up to 25 Amps per contact and is available in a variety of combinations of power and signal contacts combined in a single molded housing.
Available with three mounting options:
*PCB tails for soldering to plated through-holes
*Compliant press-fit PCB tails
Available with three mounting options:
*PCB tails for soldering to plated through-holes
*Compliant press-fit PCB tails
*Straddle/surface-mount PCB tails for co-planar applications
Are suited for traditional Voltage Regulator Module (VRM) applications.
Tyco Electronics, tycoelectronics.com
Are suited for traditional Voltage Regulator Module (VRM) applications.
Tyco Electronics, tycoelectronics.com
Max-Kleen Heavy-Duty Degreasers are industrial degreasers formulated to tackle demanding cleaning jobs. The degreasers provide fast, easy removal of grease, tar, asphalt, oil and grime in industrial degreasing operations, including manufacture and maintenance of armatures, compressors, electrical motors and equipment, bearings, gear drives, brakes, springs and flywheels.
Xtreme degreaser is the most aggressive cleaner in the line. It is non-flammable, non-corrosive and non-conductive. It evaporates quickly, leaving behind no residue.
Lectro-Solv degreaser is best for electrical degreasing applications. Is non-flammable, non-corrosive and non-conductive. It has a dielectric breakdown of 30,000 volts.
Citrus degreaser dissolves oxidized grease, oil, wax tar and sludge. Contains no chlorinated solvents, and has a flash point above 100o F. Has an orange odor.
Xtreme degreaser is the most aggressive cleaner in the line. It is non-flammable, non-corrosive and non-conductive. It evaporates quickly, leaving behind no residue.
Lectro-Solv degreaser is best for electrical degreasing applications. Is non-flammable, non-corrosive and non-conductive. It has a dielectric breakdown of 30,000 volts.
Citrus degreaser dissolves oxidized grease, oil, wax tar and sludge. Contains no chlorinated solvents, and has a flash point above 100o F. Has an orange odor.
ITW Chemtronics, chemtronics.com
Kester will provide lead-free resources, technologies and products during Nepcon China this week.
The company will feature numerous products from its Lead-Free Solutions (products and services) portfolio to help companies beat the July 1, 2006 RoHS Directive deadline. Featured products are EnviroMark 907 lead-free no-clean paste and its low-cost Ultrapure K100 lead-free bar solder alloy, along with technical services to help manufacturers assemble lead-free.
EM907 reportedly exceeds customers’ expectations for high-yield Pb-free manufacturing, and was designed for the higher thermal demands of assembling with higher melting temperature Pb-free alloys. Featuring a long stencil life, the solder paste is said to offer Pb-free joints that closely resemble those achieved with Sn/Pb solder paste.
K100 is a near-eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint. This improves joint reliability and virtually eliminates common defects such as icicling and bridging. The improved grain structure also results in completely filled and shinier solder joints than traditional lead-free alloy alternatives.
Kester, kester.com
Nepcon China booth 2E48http://www.kester.com
The company will feature numerous products from its Lead-Free Solutions (products and services) portfolio to help companies beat the July 1, 2006 RoHS Directive deadline. Featured products are EnviroMark 907 lead-free no-clean paste and its low-cost Ultrapure K100 lead-free bar solder alloy, along with technical services to help manufacturers assemble lead-free.
EM907 reportedly exceeds customers’ expectations for high-yield Pb-free manufacturing, and was designed for the higher thermal demands of assembling with higher melting temperature Pb-free alloys. Featuring a long stencil life, the solder paste is said to offer Pb-free joints that closely resemble those achieved with Sn/Pb solder paste.
K100 is a near-eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint. This improves joint reliability and virtually eliminates common defects such as icicling and bridging. The improved grain structure also results in completely filled and shinier solder joints than traditional lead-free alloy alternatives.
Kester, kester.com
Nepcon China booth 2E48http://www.kester.com
Creative Materials, a supplier of electrically conductive inks, coatings, adhesives and encapsulants, announced an electrically conductive adhesive, GPC-251A/B, and a thermally conductive underfill epoxy, 123-38A/B187, designed for flip-chip assembly.
Flip-chip replaces wire bonding as the electrical connection of electronic components onto substrates or circuit boards. A process long used in the automotive industry, flip-chip assembly is growing in popularity among makers of cell phones, handheld electronic devices and microprocessors.
GPC-251A/B is a silver filled, electrically conductive, two-part, room-temperature curing adhesive used to connect the bumps on the underside of circuit boards. It cures in 24 hr. at 25°C, 60 min. at 65°C and in five min. at 120°C.
123-38A/B-187 is a thermally conductive underfill epoxy that strengthens the chip package, protecting it from moisture while adding mechanical strength. Is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. Low viscosity makes it ideal for underfilling applications.
Creative Materials, creativematerials.com
