Syon electrically conductive adhesive solders can be used to form conductive paths in applications where hot soldering would be ineffective or impractical. The epoxy and epoxide formulations mix and pour easily, fill voids and cure with minimal air entrapment. Reportedly provide environmental and impact resistance.
Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is one to three hours. Cure time is 72 hours at 75° F or 2 hours at 130° F. Can be used in service temperatures from -65° to 200° F.
Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications where a conductive bond is required and where hot soldering is impractical. Can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. Is also for applications requiring high thermal conductivity and meets federal specification MMM-A-1931, Types I and II. Pot life is one hour; cure time is 24 hrs at room temperature. Can be used in temperatures from -65° to 200° F.
Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive. An economical alternative to silver-filled products, this nonsagging paste can be used in place of hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding as well as in heat-sink applications. Has a pot life of 45 min. Although it cures at room temperature, heating the adhesive to 150° F for 2 hours speeds curing and ensures electrical conductivity. Can be used in temps from -65° to 200° F.
Devcon, devcon.com
Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is one to three hours. Cure time is 72 hours at 75° F or 2 hours at 130° F. Can be used in service temperatures from -65° to 200° F.
Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications where a conductive bond is required and where hot soldering is impractical. Can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. Is also for applications requiring high thermal conductivity and meets federal specification MMM-A-1931, Types I and II. Pot life is one hour; cure time is 24 hrs at room temperature. Can be used in temperatures from -65° to 200° F.
Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive. An economical alternative to silver-filled products, this nonsagging paste can be used in place of hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding as well as in heat-sink applications. Has a pot life of 45 min. Although it cures at room temperature, heating the adhesive to 150° F for 2 hours speeds curing and ensures electrical conductivity. Can be used in temps from -65° to 200° F.
Devcon, devcon.com
Imbera engineers used Flotherm thermal simulation software from Flomerics to optimize the thermal management of a series of Integrated Module Boards (IMBs) that use a unique production process. The thermal properties of the new technology were difficult to determine since there is no standard for defining the thermal resistance of a PCB in which an IC is embedded. Simulations provided fundamental information about the thermal behavior of the structure, such as the heat flow path. This made it possible for several thermal enhancement methods to be evaluated.
Imbera is a joint venture of Aspocomp Group Oyj and Elcoteq Network Corp. that is developing a production process that integrates active components inside the PCB structure. PCB manufacturing, component packaging, and assembly are incorporated into a single manufacturing process. All interconnections between the IC and substrate are processed simultaneously.
The thermal properties of the new technology were challenging to define because the technology is so new and is developing very rapidly. Tight schedules limited the number of prototyping runs that could be executed. Flotherm software from Flomerics is suited to this type of complicated electronics cooling problem because it is designed for electronic cooling applications. It provides a number of thermal model libraries for existing components and tools that allow users to assemble models from libraries.
Imbera engineers used Flotherm to model two types of IMB structures, BGA modules and ICs embedded in motherboards, in a standard still air environment. Simulations provided fundamental information about the behavior of the structure. The simulation results made it possible for Imbera engineers to optimize the various methods afforded by IMB technology to keep the product operating temperature within specifications.
The simulation models were validated by performing measurements with MicReD’s “T3Ster” thermal tester. It can test up to eight components at one time and analyze the results as the test is being performed.
Flomerics, flomerics.com
Auto-Shield Metal-In ESD Bags on a roll, primarily for use on automatic bagging machines, help increase packaging efficiency. Bags are printed with ESD warning symbol, manufacturer name and date/lot code for traceability. Meet MIL-PRF-81705D Type III and are testable to S20.20, S11.11 and S11.31. Are RoHS compliant. Bag film thickness is 3.1mil. Stock item 49400 is a bag size of 2.5 x 5” with 1,250 bags on the roll.
Custom sizes and custom printing are available.
Protektive Pak, protektivepak.com
Custom sizes and custom printing are available.
Protektive Pak, protektivepak.com
Kester announces that it will highlight its Pb-free products in Hall 8, Stand 315 at the upcoming SMT/Hybrid/Packaging exhibition.
Kester will feature numerous products from its Lead-Free Solutions (products and services) portfolio to help companies beat the July 1, 2006, RoHS Directive deadline. Among them are: EnviroMark 907 and 918 Pb-free no-clean pastes, Ultrapure K100 lead-free bar solder alloy, 979 and 979VT VOC-free organic no-clean flux formulations, 959T no-clean flux, 275 no-clean wire and TSF-6592 tacky soldering fluxes, along with Kester’s technical services.
Kester, kester.com
SMT Nurnberg Hall 8, Stand 315
Kester will feature numerous products from its Lead-Free Solutions (products and services) portfolio to help companies beat the July 1, 2006, RoHS Directive deadline. Among them are: EnviroMark 907 and 918 Pb-free no-clean pastes, Ultrapure K100 lead-free bar solder alloy, 979 and 979VT VOC-free organic no-clean flux formulations, 959T no-clean flux, 275 no-clean wire and TSF-6592 tacky soldering fluxes, along with Kester’s technical services.
Kester, kester.com
SMT Nurnberg Hall 8, Stand 315
MicroClimate is a 3 ft3 reach-in chamber designed to simulate a full range of temperature and/or humidity conditions. The environmental chamber provides a compact chamber for testing small components and products for a variety of industries. Each chamber simulates a range of temperature and humidity conditions from -73° to 190°C and from 10% to 95% RH.
Features include:
Programmable Controller;
RS-232 Computer Interface ;
2" Access Port ;
Demineralizer filter purifies water and electronic humidity sensor provides accuracy and reliability with minimal maintenance on humidity models ;
Compact size;
Easy installation with no special electrical connections needed;
Each unit runs on a standard 115V ;
Includes a one year part and labor warranty.
Features include:
Programmable Controller;
RS-232 Computer Interface ;
2" Access Port ;
Demineralizer filter purifies water and electronic humidity sensor provides accuracy and reliability with minimal maintenance on humidity models ;
Compact size;
Easy installation with no special electrical connections needed;
Each unit runs on a standard 115V ;
Includes a one year part and labor warranty.
Cincinnati Sub-Zero, cszindustrial.com/products/tempchambers/MicroClimate3.htm
HCT-900 Hand Held Convection Tool is a low-cost rework system with the flexibility to handle a range of thermally demanding production and rework applications, including Pb-free. Typical applications for the 300W unit include removal or replacement of QFPs, PLCCs, SOPs and TSOP devices. It can also provide heating and reflow for touch-up work as well as heat shrink and other local heating applications.
Closed-loop thermocouple feedback regulates output temperatures, and control temperatures can be set in the range 100º to 500ºC. The user sets the heat and airflow control dials to the required values for the application. Unit maintains the required temperature automatically, even if airflow is adjusted.
The low-noise pump (less than 45 db) provides precision airflow control. A power-off, cool-down function retains the airflow as the unit powers down for efficient heater cooling and reduction of thermal stress.
A range of nozzles are available for general purpose applications or specific SO and TSOP packages, or PLCC, BQFP and QFP devices. Also accepts many industry standard nozzles.
Three versions are available to suit input voltages of 115VAC (HCT-900-11), 230VAC (HCT-900-21) or 100VAC (HCT-900-10).
Closed-loop thermocouple feedback regulates output temperatures, and control temperatures can be set in the range 100º to 500ºC. The user sets the heat and airflow control dials to the required values for the application. Unit maintains the required temperature automatically, even if airflow is adjusted.
The low-noise pump (less than 45 db) provides precision airflow control. A power-off, cool-down function retains the airflow as the unit powers down for efficient heater cooling and reduction of thermal stress.
A range of nozzles are available for general purpose applications or specific SO and TSOP packages, or PLCC, BQFP and QFP devices. Also accepts many industry standard nozzles.
Three versions are available to suit input voltages of 115VAC (HCT-900-11), 230VAC (HCT-900-21) or 100VAC (HCT-900-10).
OK International, okinternational.com
Press Releases
- Q Source Strengthens Partnership with PACE Worldwide, Showcasing Advanced Soldering and Rework Solutions
- Kimball Electronics Releases 2024 Annual Sustainability Report; Richard Phillips Comments
- Hon Hai Technology Group (Foxconn) Completes Independent Audits At 9 More Manufacturing Sites
- ROCKA Solutions Mexico Partners with MIRTEC to Offer Leading Inspection Systems Exclusively in Mexico, Brazil and Argentina; Brian D’Amico and Rodrigo Cacho Comment