The 15th version of GerbTool has a host of new features and technology, such as HyperNETLIST generation, that have been handed down from VisualCAM. It increases netlist generation performance over competitive tools by 5 to 10X.
• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
WISE Software Solutions, wssi.com
This release contains a series of enhancements to help users increase throughput.
• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
WISE Software Solutions, wssi.com
Universal Instruments will demonstrate its latest platform placement system, the AdVantis XS, at Semicon West. Designed for the convergence of semiconductor and standard surface-mount assembly, the system deploys Universal’s VRM linear motors for accuracy and repeatability.
The linear-motor-driven system has high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. Is Class 1000 clean room compatible.
Universal Instruments, uic.com
Semicon West Booth 7039
AdVantis XS evolved from the GSMxs, delivering similar accuracies of +/-9 microns at +/- 3 sigma, but with a 25% increase in feeder capacity for on-machine inventory and a 15% speed improvement. Advanced materials engineering and optimized design offers customers a price some 25% lower than its predecessor, with backward compatibility, shared resources and common interfaces.
The linear-motor-driven system has high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. Is Class 1000 clean room compatible.
Universal Instruments, uic.com
Semicon West Booth 7039
Practical Components Inc., a distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, has added Thin Array Plastic Package (TAPP) to its selection.
Packaging companies Amkor Technology and ASAT Holdings entered into a multi-year cross-licensing agreement to provide Amkor with a license for its TAPP semiconductor package technology.
“Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fueled in part by the success of Amkor’s proprietary MicroLeadFrame package technology and ASAT’s Leadless Plastic Chip Carrier package. We look forward to integrating ASAT’s TAPP with our MicroLeadFrame family of packages to support our growing base of customers requiring innovative QFN package solutions,” said Jim Fusaro, Amkor’s corporate VP for product management, in a statement.
Available TAPP solder finishes are eutectic Sn/Pb and Pb-free with lead counts from 28 to 208. The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics.
Practical Components is the exclusive distributor of mechanical samples for Amkor Technology as well as distributing components from most other manufacturers.
Practical Components Inc., practicalcomponents.com
Packaging companies Amkor Technology and ASAT Holdings entered into a multi-year cross-licensing agreement to provide Amkor with a license for its TAPP semiconductor package technology.
“Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fueled in part by the success of Amkor’s proprietary MicroLeadFrame package technology and ASAT’s Leadless Plastic Chip Carrier package. We look forward to integrating ASAT’s TAPP with our MicroLeadFrame family of packages to support our growing base of customers requiring innovative QFN package solutions,” said Jim Fusaro, Amkor’s corporate VP for product management, in a statement.
Available TAPP solder finishes are eutectic Sn/Pb and Pb-free with lead counts from 28 to 208. The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics.
Practical Components is the exclusive distributor of mechanical samples for Amkor Technology as well as distributing components from most other manufacturers.
Practical Components Inc., practicalcomponents.com
Syon electrically conductive adhesive solders can be used to form conductive paths in applications where hot soldering would be ineffective or impractical. The epoxy and epoxide formulations mix and pour easily, fill voids and cure with minimal air entrapment. Reportedly provide environmental and impact resistance.
Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is one to three hours. Cure time is 72 hours at 75° F or 2 hours at 130° F. Can be used in service temperatures from -65° to 200° F.
Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications where a conductive bond is required and where hot soldering is impractical. Can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. Is also for applications requiring high thermal conductivity and meets federal specification MMM-A-1931, Types I and II. Pot life is one hour; cure time is 24 hrs at room temperature. Can be used in temperatures from -65° to 200° F.
Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive. An economical alternative to silver-filled products, this nonsagging paste can be used in place of hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding as well as in heat-sink applications. Has a pot life of 45 min. Although it cures at room temperature, heating the adhesive to 150° F for 2 hours speeds curing and ensures electrical conductivity. Can be used in temps from -65° to 200° F.
Devcon, devcon.com
Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is one to three hours. Cure time is 72 hours at 75° F or 2 hours at 130° F. Can be used in service temperatures from -65° to 200° F.
Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications where a conductive bond is required and where hot soldering is impractical. Can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. Is also for applications requiring high thermal conductivity and meets federal specification MMM-A-1931, Types I and II. Pot life is one hour; cure time is 24 hrs at room temperature. Can be used in temperatures from -65° to 200° F.
Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive. An economical alternative to silver-filled products, this nonsagging paste can be used in place of hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding as well as in heat-sink applications. Has a pot life of 45 min. Although it cures at room temperature, heating the adhesive to 150° F for 2 hours speeds curing and ensures electrical conductivity. Can be used in temps from -65° to 200° F.
Devcon, devcon.com
Imbera engineers used Flotherm thermal simulation software from Flomerics to optimize the thermal management of a series of Integrated Module Boards (IMBs) that use a unique production process. The thermal properties of the new technology were difficult to determine since there is no standard for defining the thermal resistance of a PCB in which an IC is embedded. Simulations provided fundamental information about the thermal behavior of the structure, such as the heat flow path. This made it possible for several thermal enhancement methods to be evaluated.
Imbera is a joint venture of Aspocomp Group Oyj and Elcoteq Network Corp. that is developing a production process that integrates active components inside the PCB structure. PCB manufacturing, component packaging, and assembly are incorporated into a single manufacturing process. All interconnections between the IC and substrate are processed simultaneously.
The thermal properties of the new technology were challenging to define because the technology is so new and is developing very rapidly. Tight schedules limited the number of prototyping runs that could be executed. Flotherm software from Flomerics is suited to this type of complicated electronics cooling problem because it is designed for electronic cooling applications. It provides a number of thermal model libraries for existing components and tools that allow users to assemble models from libraries.
Imbera engineers used Flotherm to model two types of IMB structures, BGA modules and ICs embedded in motherboards, in a standard still air environment. Simulations provided fundamental information about the behavior of the structure. The simulation results made it possible for Imbera engineers to optimize the various methods afforded by IMB technology to keep the product operating temperature within specifications.
The simulation models were validated by performing measurements with MicReD’s “T3Ster” thermal tester. It can test up to eight components at one time and analyze the results as the test is being performed.
Flomerics, flomerics.com
Auto-Shield Metal-In ESD Bags on a roll, primarily for use on automatic bagging machines, help increase packaging efficiency. Bags are printed with ESD warning symbol, manufacturer name and date/lot code for traceability. Meet MIL-PRF-81705D Type III and are testable to S20.20, S11.11 and S11.31. Are RoHS compliant. Bag film thickness is 3.1mil. Stock item 49400 is a bag size of 2.5 x 5” with 1,250 bags on the roll.
Custom sizes and custom printing are available.
Protektive Pak, protektivepak.com
Custom sizes and custom printing are available.
Protektive Pak, protektivepak.com
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