EMA Design Automation has integrated Omnify software into the EMA EDM environment, increasing capabilities to make adherence to RoHS/WEEE compliance directives even easier. “Omnify is a proven technology for managing data,” said Manny Marcano, president and CEO of EMA. “Integrating it into our EDM solution provides five key capabilities that bolster our compliance by design philosophy, allowing companies of any size to have the power of a full EDM system.”
The capabilities include:
Configuration Management
Manages data and controls revision levels on the customer’s entire product.
Bill of Materials (BOM) Management
Manages all revisions and understands the lifecycle of a BOM. Since the BOM items link directly to active part data, customers can analyze and generate compliance reports from any level or from any version of their BOMs.
Document Management
Provides document versioning/vaulting on all documents associated to product or vendor records. Changes made to documents are performed under a user-defined and controlled process.
Change Management
Changes made to product data usually require validation by all affected parties. Provides a controlled change management process that allows users to define product and documentation changes and allow them to vote on suggested changes. Handles the automatic routing to users (via email) and updating of product records when there are changes to products (part replacements, AVL changes, part number changes, availability, etc.). These changes must be captured and performed in an automated fashion.
Enhanced Reporting
Customers can generate reports from any level of the product structure. Can automate the generation and packaging of these reports. Since EDM captures data during product development, these reports can be generated, products can be analyzed and adjustments can be made at design time.
The capabilities include:
Configuration Management
Manages data and controls revision levels on the customer’s entire product.
Bill of Materials (BOM) Management
Manages all revisions and understands the lifecycle of a BOM. Since the BOM items link directly to active part data, customers can analyze and generate compliance reports from any level or from any version of their BOMs.
Document Management
Provides document versioning/vaulting on all documents associated to product or vendor records. Changes made to documents are performed under a user-defined and controlled process.
Change Management
Changes made to product data usually require validation by all affected parties. Provides a controlled change management process that allows users to define product and documentation changes and allow them to vote on suggested changes. Handles the automatic routing to users (via email) and updating of product records when there are changes to products (part replacements, AVL changes, part number changes, availability, etc.). These changes must be captured and performed in an automated fashion.
Enhanced Reporting
Customers can generate reports from any level of the product structure. Can automate the generation and packaging of these reports. Since EDM captures data during product development, these reports can be generated, products can be analyzed and adjustments can be made at design time.
EMA Design Automation, www.ema-eda.com
DesignAdvance Systems announced the latest release of CircuitSpace, its user-assisted PCB component placement software.
This version expands on the tool’s hierarchical approach to PCB design through enhanced auto-clustering and replication technologies. Can expedite the design process by expanding on its capabilities in the areas of template libraries, automatic bypass capacitor assignments, double-sided board placement and intelligent channel and/or port duplication.
“Having seen unsuccessful attempts, I was skeptical of any company claiming to have a product that automates component placement. My opinion on the subject changed since I started using CircuitSpace,” said Mark Dills, 20+ year veteran of the PCB business and a Senior PCB Designer with SofTEQ. “The auto-clustering and replication features alone can save hours, days, even weeks of time off of a design cycle.”
This release adds features to address the challenges associated with managing frequent board design modifications.
The tool guides users through the concurrent board design by:
* Automatically identifying changes to a board design as they arrive through successive netlist imports
* Producing addendum clusters for newly added parts
* Assessing the impact of design changes on component placement and reporting part loss or gain and part type changes
* Reporting on detailed changes from current board design, to quickly adapt to the new requirements and to facilitate feedback to the hardware engineer
DesignAdvance Systems, www.designadvance.com
This version expands on the tool’s hierarchical approach to PCB design through enhanced auto-clustering and replication technologies. Can expedite the design process by expanding on its capabilities in the areas of template libraries, automatic bypass capacitor assignments, double-sided board placement and intelligent channel and/or port duplication.
“Having seen unsuccessful attempts, I was skeptical of any company claiming to have a product that automates component placement. My opinion on the subject changed since I started using CircuitSpace,” said Mark Dills, 20+ year veteran of the PCB business and a Senior PCB Designer with SofTEQ. “The auto-clustering and replication features alone can save hours, days, even weeks of time off of a design cycle.”
This release adds features to address the challenges associated with managing frequent board design modifications.
The tool guides users through the concurrent board design by:
* Automatically identifying changes to a board design as they arrive through successive netlist imports
* Producing addendum clusters for newly added parts
* Assessing the impact of design changes on component placement and reporting part loss or gain and part type changes
* Reporting on detailed changes from current board design, to quickly adapt to the new requirements and to facilitate feedback to the hardware engineer
DesignAdvance Systems, www.designadvance.com
Photo Stencil aquired the AMTX E-Blade electroformed squeegee blade from Xerox. It is said to improve printdeposition, quality, uniformity and consistency. With a rigid, low-friction, hard-nickel edge, the blade provides cleaner prints, reduced stencil wear and less material waste.
"The electroformed E-Blade demonstrated the lowest squeegee pressure of any other squeegee blade I have tested for both SMT and wafer bumping printing," said Rick Lathrop, technical service manager of surface-mount materials at Heraeus. Heraeus recently completed a study on squeegee blades. "With lower print pressures come all of the benefits of reduced understencil wiping frequency and increased stencil life. The lack of paste scooping in large apertures for wafer bumping can only enhance bump coplanarity for automotive and WLCSP applications."
The blade also addresses issues caused by Pb-free printing. Pb-free solder paste requires higher squeegee pressures for a clean wipe of the stencil. The E-Blade prints at 33% of the squeegee pressure of other popular squeegee blades. High squeegee pressures result in "smear mode" printing whereas low squeegee pressure allows "sheer mode" printing.
Photo Stencil, www.photostencil.com
Almit Technology will debut a new Pb-free paste at Nepcon UK this April, created specifically for printing at up to four-times the normal printer excursion speed. LFM-48 TM HP solder paste reportedly enables increased productivity, allowing European assemblers to bid successfully against competitors in low labor cost countries.
The paste is said to exhibit good wetting, high definition printing with long screen and tack life. It is approved and adopted by major manufacturers worldwide for open blade printing and enclosed print head systems.
For through-hole assembly and rework, Almit has also introduced cored solder wire featuring 96.5%Sn-3%Ag-0.5%Cu alloy. KR-19SH RMA wire retains the benefits of the original product to deliver wetting, high reliability and low residue. It is available in diameters from 0.3 to 1.6 mm on 0.5Kg reels – and in selected sizes on anti-static Handy Reels.
Almit Technology Ltd., almit.com
Visit Stand C2 at Nepcon UK
Tyco Electronics’ Global Application Tooling Division (GATD) has collaboratively worked with Graphic Solutions International (GSI) to provide them with an RFID Inlay assembly system. This equipment will assemble semiconductor chips, surface-mount devices and printed batteries onto a continuous web of printed antennas, adding RFID capability to tags and labels.
Working closely with GSI, Tyco provided a reel to reel system that allows GSI to mount flip-chips, SMDs and printed batteries on a continuous web of printed antennas and conductive traces. The system is capable of the high-speed mounting of electronic components on a 6,000'+ (1,800+ m) roll of 20" wide material. After conductive printing, the roll is fed into the Tyco machine where components are added along with one or two printed batteries. Upon completion, the roll can be slit into individual streams and rolled, or supplied in production web width rolls for delivery. A typical circuit is inlaid with batteries, an RFID chip and a printed antenna. Its speed allows for production levels up to 26 million inlays per year.
The continuous web assembly system produces inlays that offer performance improvements over conventional PCBs. The system allows mounting flip chips for almost any purpose, as well as the ability to mount most standard SMDs along with GSI’s printed batteries. Can mount on paper, PET or other flexible substrates, and features a variable width capability up to 20" wide. Can accommodate printed substrates from 0.002" to 0.005" thick, mount on continuous rolls with a repeat pitch of 0.8" and position chips to micron accuracy.
Graphic Solutions International, graphicsolutionsinc.com
Tyco Electronics, tycoelectronics.com.
SFX-TAP(x)/FXT, transceivers are additional components to the JTAG/Boundary Scan hardware platform Scanflex. The TAP transceivers (SFX transceivers) were developed for integration into in-circuit testers (ICT) and optionally offer 2, 4, 6 and 8 parallel, independent TAPs as well as additional resources and special functions.
In contrast to previous Scanflex TAP transceivers, the new models’ TAP Interface Cards (TIC) type 02 are no longer integrated but are differentially coupled with an up to 2 metres long IDC or Wire Wrap cable. Even at high frequency signal transitions, a TAP signal transmission to the TIC02 modules of up to 80 MHz is guaranteed. The low-cost modules provide externally programmable input and output voltage per TAP as well as relays for the galvanic isolation from the UUT. Furthermore, there is a mechanism to adapt the interface to various driver requirements. For each TAP there is a programmable delay compensation combined with stepwise (250Hz/1MHz) programmable TCK frequency to 80MHz.
Features include 32 voltage programmable dynamic I/O, two analog I/O channels and three statistic I/O and trigger lines.
Has a slot for coupling with Scanflex I/O modules. Alternatively, various SFX I/O modules can be connected via an SFX/LS interface. These extensions allow the configuration of almost unlimited additional analog or digital resources.
GÖPEL electronic, www.goepel.com
In contrast to previous Scanflex TAP transceivers, the new models’ TAP Interface Cards (TIC) type 02 are no longer integrated but are differentially coupled with an up to 2 metres long IDC or Wire Wrap cable. Even at high frequency signal transitions, a TAP signal transmission to the TIC02 modules of up to 80 MHz is guaranteed. The low-cost modules provide externally programmable input and output voltage per TAP as well as relays for the galvanic isolation from the UUT. Furthermore, there is a mechanism to adapt the interface to various driver requirements. For each TAP there is a programmable delay compensation combined with stepwise (250Hz/1MHz) programmable TCK frequency to 80MHz.
Features include 32 voltage programmable dynamic I/O, two analog I/O channels and three statistic I/O and trigger lines.
Has a slot for coupling with Scanflex I/O modules. Alternatively, various SFX I/O modules can be connected via an SFX/LS interface. These extensions allow the configuration of almost unlimited additional analog or digital resources.
GÖPEL electronic, www.goepel.com
