BP Microsystems will display the 4710 automated programming system, in Adaptsys’ booth at Nepcon UK .
Is designed for high density devices and longer programming times, making it the fastest at programming Flash, while also programming Microcontrollers, FPGAs, PLDs and other device types.
Has improved site hardware to program devices with densities up to 4 Gbits. Incorporates high-speed USB 2.0 standard bus for communications. By combining fast universal programming technology — 64 Mb in 15 sec. — and FX4 socket modules, which can program up to four devices simultaneously, it can program up to 44 devices at the same time.
BP Microsystems, www.bpmicro.com
Is designed for high density devices and longer programming times, making it the fastest at programming Flash, while also programming Microcontrollers, FPGAs, PLDs and other device types.
Has improved site hardware to program devices with densities up to 4 Gbits. Incorporates high-speed USB 2.0 standard bus for communications. By combining fast universal programming technology — 64 Mb in 15 sec. — and FX4 socket modules, which can program up to four devices simultaneously, it can program up to 44 devices at the same time.
BP Microsystems, www.bpmicro.com
Booth G30
Zestron, a supplier of high precision cleaning processes and services, will be exhibiting at Nepcon East on May 10 – 11.
The company will be feature its latest products and services for:
PCB Defluxing: Effectively removing all flux residues ranging from rosin-based to synthetic no-clean and from eutectic or lead-free based formulation.
Stencil Cleaning: MPC-based and solvent-based cleaning agents for the removal of solder pastes and SMT-adhesives in a single process.
MPC Technology: Water-based cleaning technology combining the benefits of traditional water as well as solvent-based cleaning agents.
Zestron America
Nepcon East Booth 2040
The company will be feature its latest products and services for:
PCB Defluxing: Effectively removing all flux residues ranging from rosin-based to synthetic no-clean and from eutectic or lead-free based formulation.
Stencil Cleaning: MPC-based and solvent-based cleaning agents for the removal of solder pastes and SMT-adhesives in a single process.
MPC Technology: Water-based cleaning technology combining the benefits of traditional water as well as solvent-based cleaning agents.
Zestron America
Nepcon East Booth 2040
Huntsman Advanced Materials has introduced two halogen-free laminating resins that comply with regulatory requirements for PCB manufacturing.
AZYRAL one- and two-component laminating systems combine versatile processing capabilities with good electrical characteristics and physical properties. Multilayer PCBs and other electrical components fabricated with the materials can withstand exposure to tough operating conditions.
Halogen-free AZYRAL XU8282-1 resin is RoHS compliant for Pb-free soldering operations. This and two-component AZYRAL XTW8291/XTW8293 laminating systems feature easy-to-process, low viscosities for use with FR4 processing. Are nondicy-curing products, meet UL 94 V-O specifications.
Said to produce PCBs with a low dielectric constant, low dissipation factor, good surface resistivity and good volume resistivity.
Resins are high-temperature resistant materials with low moisture absorption, good thermal stability with glass transition temperatures from 320-482ºF, low coefficient of thermal expansion and low shrinkage.
Huntsman, huntsman.com/electronics
AZYRAL one- and two-component laminating systems combine versatile processing capabilities with good electrical characteristics and physical properties. Multilayer PCBs and other electrical components fabricated with the materials can withstand exposure to tough operating conditions.
Halogen-free AZYRAL XU8282-1 resin is RoHS compliant for Pb-free soldering operations. This and two-component AZYRAL XTW8291/XTW8293 laminating systems feature easy-to-process, low viscosities for use with FR4 processing. Are nondicy-curing products, meet UL 94 V-O specifications.
Said to produce PCBs with a low dielectric constant, low dissipation factor, good surface resistivity and good volume resistivity.
Resins are high-temperature resistant materials with low moisture absorption, good thermal stability with glass transition temperatures from 320-482ºF, low coefficient of thermal expansion and low shrinkage.
Huntsman, huntsman.com/electronics
Surclean, a division of SMT, will showcase SMT USC400 at the upcoming Nepcon show and in Birmingham, U.K.
The portable ultrasonic contact type stencil cleaning system can remove difficult high tack residues such as those found with Pb-free solder materials.
Suitable for offline and on-printer cleaning operations. Stencil cleaning can be carried out on the printer without removing the stencil frame. Can be easily moved between work areas or printers.
An optional ultrasonic mini-bath cleans machine accessories such as placement nozzles, glue dispensing needles, test probes, etc.
The portable ultrasonic contact type stencil cleaning system can remove difficult high tack residues such as those found with Pb-free solder materials.
Suitable for offline and on-printer cleaning operations. Stencil cleaning can be carried out on the printer without removing the stencil frame. Can be easily moved between work areas or printers.
An optional ultrasonic mini-bath cleans machine accessories such as placement nozzles, glue dispensing needles, test probes, etc.
Is lightweight for portability, has rugged industrial construction for long service life and is suitable for all stencil materials, even plastic. Suitable for cleaning all printable materials, including paste, inks, resists and SMD adhesives.
Surclean,surclean.co.uk
Nepcon UK, Booth J73
Surclean,surclean.co.uk
Nepcon UK, Booth J73
Essemtec will display SP200-AV, a fine-pitch printer with automatic vision adjustment, at the upcoming Nepcon U.K. show.
The easy-to-operate semiautomatic printing machine controls and regulates all printing parameters. The only manual task is to slide the PCB into the machine. All other operations, including the positioning of the PCB, are fully automatic and reproducible. Designed for serial production but can also be used for small batches.
Benefits include a fast two-point vision system, automatic PCB positioning with vision, automatic printing process, automatic stencil cleanliness check and fast PCB loading with side drawer. Provides an unlimited number of printing programs, an integrated operation manual, simple changeover between jobs and Windows XP software. All printing parameters are programmable.
ESSEMTEC AG, www.essemtec.com
The easy-to-operate semiautomatic printing machine controls and regulates all printing parameters. The only manual task is to slide the PCB into the machine. All other operations, including the positioning of the PCB, are fully automatic and reproducible. Designed for serial production but can also be used for small batches.
Benefits include a fast two-point vision system, automatic PCB positioning with vision, automatic printing process, automatic stencil cleanliness check and fast PCB loading with side drawer. Provides an unlimited number of printing programs, an integrated operation manual, simple changeover between jobs and Windows XP software. All printing parameters are programmable.
ESSEMTEC AG, www.essemtec.com
Nepcon UK Booth D20
Xpress 25 SMT placement system combines high-speed and fine-pitch capabilities within a compact footprint. The twin headed system can place devices ranging from 0201 to 50 x 50 mm QFP (70 x 70 mm QFP and 100 mm connector optional) at a tact time of 0.144 sec (25,000 cph equivalent, IPC: 18,900 cph). Equipped with “smart nozzles” and on the fly vision.
Has feeder capacity of 92 x 8 mm and accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (0.3 mm optional) and a tape size range of 8 to 88 mm.
Options include: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
Europlacer, europlacer.com
Nepcon UK Booth C10
Has feeder capacity of 92 x 8 mm and accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (0.3 mm optional) and a tape size range of 8 to 88 mm.
Options include: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
Europlacer, europlacer.com
Nepcon UK Booth C10
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