Model 2200-545-037 two-component Miniature Mix-Dispense Valve precisely dispenses miniature beads and small volumes of low-viscosity pourable materials and abrasive or filled materials. Ideal for low-flow applications typically found in miniature potting, doming, filling and bonding operations. The valve uses No-Drip technology for dispensing solvent-based, moisture-curing and stringy materials such as epoxies, silicones and polyurethanes in difficult product-assembly applications. The pneumatically actuated valve opens and closes its carbide resin- and catalyst-material passages at the mixer entrance to precisely start and stop material flow. Has stainless-steel wetted components, dual carbide ball-and-seat shut-off, safety-closure spring, flow-control adjustment and balancer eye-hook. The valve’s stroke adjuster can set the needle opening to adjust material-flow rates. Wear-resistant fluid seals extend valve life. Precision dowel and screw holes allow easy and accurate mounting. Quarter-turn bayonet mount accommodates many disposable mixer sizes. A typical bayonet-mount mixer used is a 17-element disposable mixer, 0.125” diameter, 2.46” long and 0.030” outlet orifice. Resin and catalyst materials are delivered on-ratio by Servo-Flo metering assembly fed by supply tanks or pumps. Sealant Equipment & Engineering, sealantequipment.com
A.C.E. Production Technologies will exhibit the KISS line of selective soldering systems suitable for Pb-free solders at Nepcon East in booth #6028. A.C. E. will also introduce its Dual Head Fluxer option that facilitates quick changeover of flux types. It is designed to meet the needs of selective soldering applications that demand quick changeover from leaded to no-lead solders, a common concern among electronics assemblers transitioning to Pb-free.
Rugged, reliable and compact, the line consists of the basic KISS 101 system and programmable KISS 102. The systems feature Pb-free compatible solder pots for assembly, prototyping and rework, post-reflow offline assembly and other selective soldering applications such as odd-form devices.
Standard and custom nozzles are available for both machines. Both are bench-top models with optional carriages for stand-alone use. A dual-head fluxing system for the 102 makes it possible to change flux types quickly.
Both can accommodate PCB’s from 2 x 2” up to 18 x 24”, and connectors up to 10” long.
TNC 320 is a full function control that incorporates the features of the iTNC 530 control, including the ability to control five axes, but at a lower cost. Has analog drive interface, good for interfacing to existing drive systems on retrofit applications. Its one-piece construction minimizes cable runs.
Features a 15” TFT color flat-panel display (1024 x 768 pixels) for programming graphics and on-screen user support. Main computer has a large number of onboard cycles to simplify machining operations, from drilling and milling to workpiece probing. Conversational programming is standard and G-code programming is now possible with an added USB keyboard. The compact flash memory card stores the PLC program, commissions information and offers more user memory for NC files. Data interfaces include RS 232 as well as USB and ETHERNET.
Based on the new NC Kernel software platform. Benefits include a powerful interface between PLC and NC, eliminating redundant operations. Detailed help can by called for each parameter by pressing a button. Has expandable I/O capabilities making it viable for more complex machine applications.
The control will make its North American debut during the WESTEC show, March 27-30.
Master Bond Supreme 3HT-80 is a one-component heat curing epoxy adhesive. It reportedly exhibits high shear and high peel strength. Offers resistance to impact, thermal shock, vibration and stress fatigue cracking. No-mix compound, has an unlimited working life and cures within 30 min. at 175°F (80°C).
Said to have excellent adhesion to metals, glass, ceramics, wood, vulcanized rubbers and most plastics. It forms bonds that are resistant to water, oil, fuels and most organic solvents even upon prolonged exposures. Operates at -100° to +350°F. Is 100% reactive and does not contain any solvents.
Available in half-pint, pint, quart, gallon and five-gallon containers. Also available in convenient cartridge applicators.
BP Microsystems will showcase the latest addition to its automated device programmer family, the Helix, in Wong Kong King (WKK)’s booth 1F15 at Nepcon China/EMT China, scheduled to take place April 4-7, in Shanghai.
With the introduction of the Helix programming system, device programming customers can get the quality of automated device handling at a lower price point than traditionally available.
The desktop automated system comes with two precision-designed tube input and output handling systems. Integrated in the handler are two BP Micro Enhanced 7th Generation programming sites with FX4 socket module capability. This technology can program up to four devices simultaneously per site. Can handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date.
The operational sequence of the machine picks the part from tube input, transfers the part to the programming socket, programs the part and returns the part to tube output. Integrated motors open and close programming sites in synchronization with the placement and retrieval of parts. The tooling head requires no vision system for handling fine-pitched parts, for an overall throughput of 800 devices/hr. One computer and software interface controls both BPWin software and handler control operations.
Elektrobit Group will highlight the Display Tester in booth E1A04 during Nepcon China/EMT China in April. It provides automated testing on in-line or stand-alone test systems, and features software for the testing of small LCD displays, keyboards and housings of electronics equipment. The tester offers display defect detection through an immunity to significant variations in illumination, party orientation and display protection tape.
Features an Easy Test Case generation with GUI and does not require programming. It integrates easily through COM interface. It also supports a range of Firewire (IEEE-1394) and USB 2.0 cameras. Run-time version with calibration features is also available. Features include unlimited maximum resolution, support for up to 254 cameras, test cases controllable with separate customer-specific applications and image processing in a computer with no extra hardware. No third-party low-level image processing libraries are needed. Has tools for display location and alignment as well as for pixel defect and contrast identification. It performs the measurements for pattern matching, colour and greyscale illumination and keypad backlight. Inspects the icon presence and measures the keypad distance and size. The calibration tool uses pixel grid or checkerboard pattern method. Focus analysis tool extends usage to camera module testing.