Digitaltest GmbH will exhibit at the Nepcon Shanghai show with its distributor, Wacky International (Booth E1 B02), showing test systems and software suited for Asian electronics manufacturing needs.
MTS 300 SIGMA In-Circuit Tester offers flexibility, high fault coverage and easy programming. Features a modular design and range of test methods. Can be optimally configured for current needs without limiting the possibilities of future expansion. Future changes to individual test methods, as well as to the number of test pins, can be easily performed. Incorporates analog and digital in-circuit test capabilities, vectorless testing, functional test, Boundary-Scan (optional) and on-board programming. Capacity is 1000 measurements/sec.
Can emulate existing test programs and fixtures from other platforms like Aeroflex (Marconi) GenRad, Teradyne, Agilent (HP), Rohde & Schwarz. Can also be integrated into a handling system. The press system, driven by a servomotor, allows double-sided fixturing and dual level for both ICT and functional test.
MTS 180 In-Circuit Tester for high volume production. Is equipped with a Press Down Unit and a combination of analog and hybrid in-circuit test pins. Can be equipped with functional test modules to provide fault coverage and satisfy the test requirements of a number of customers. Users can create complex fixtures with features such as double-sided board access, OpensCheck probes from both sides, etc. Can be equipped with up to 1400 analog or 1400 hybrid pins.
Digitaltest GmbH, digitaltest.net
MTS 300 SIGMA In-Circuit Tester offers flexibility, high fault coverage and easy programming. Features a modular design and range of test methods. Can be optimally configured for current needs without limiting the possibilities of future expansion. Future changes to individual test methods, as well as to the number of test pins, can be easily performed. Incorporates analog and digital in-circuit test capabilities, vectorless testing, functional test, Boundary-Scan (optional) and on-board programming. Capacity is 1000 measurements/sec.
Can emulate existing test programs and fixtures from other platforms like Aeroflex (Marconi) GenRad, Teradyne, Agilent (HP), Rohde & Schwarz. Can also be integrated into a handling system. The press system, driven by a servomotor, allows double-sided fixturing and dual level for both ICT and functional test.
MTS 180 In-Circuit Tester for high volume production. Is equipped with a Press Down Unit and a combination of analog and hybrid in-circuit test pins. Can be equipped with functional test modules to provide fault coverage and satisfy the test requirements of a number of customers. Users can create complex fixtures with features such as double-sided board access, OpensCheck probes from both sides, etc. Can be equipped with up to 1400 analog or 1400 hybrid pins.
Digitaltest GmbH, digitaltest.net
DEK has developed processes for depositing silver epoxy and B-stage adhesives for die attach applications, for higher throughput and repeatability as well as enhanced control over deposit characteristics including total thickness variation (TTV).
The process for B-stage epoxy deposition allows application of die attach adhesive at the wafer level, at high rates of throughput. This streamlines package assembly and also allows OEMs to outsource this process to a wafer specialist. The process can deposit a part-cured adhesive layer of nominal thickness 50 micron, with TTV less than ±5 micron, across the back side of the wafer.
For attaching singulated die to a lead-frame or bond pad, the process replaces dispensing to deposit silver-loaded wet epoxy ahead of die attach. Many hundreds of deposits can be made simultaneously, so epoxy deposition can match the speed of die placement. Die placement rates are 40,000 units/hr., with SMT pick-and-place technology.
“Mass imaging delivers the throughput, uniformity and repeatability that commercial producers of advanced semiconductor packages need in order to economically meet market demands for quality and price,” said Clive Ashmore, Global Applied Process Engineer at DEK. “For die attach using B-stage or wet epoxy adhesives, our mass imaging processes outgun legacy techniques in every respect, to deliver a more highly optimized, faster, more repeatable and more cost-effective solution.”
DEK, www.dek.com
The process for B-stage epoxy deposition allows application of die attach adhesive at the wafer level, at high rates of throughput. This streamlines package assembly and also allows OEMs to outsource this process to a wafer specialist. The process can deposit a part-cured adhesive layer of nominal thickness 50 micron, with TTV less than ±5 micron, across the back side of the wafer.
For attaching singulated die to a lead-frame or bond pad, the process replaces dispensing to deposit silver-loaded wet epoxy ahead of die attach. Many hundreds of deposits can be made simultaneously, so epoxy deposition can match the speed of die placement. Die placement rates are 40,000 units/hr., with SMT pick-and-place technology.
“Mass imaging delivers the throughput, uniformity and repeatability that commercial producers of advanced semiconductor packages need in order to economically meet market demands for quality and price,” said Clive Ashmore, Global Applied Process Engineer at DEK. “For die attach using B-stage or wet epoxy adhesives, our mass imaging processes outgun legacy techniques in every respect, to deliver a more highly optimized, faster, more repeatable and more cost-effective solution.”
DEK, www.dek.com
M1 AOI system was developed with enhancements to satisfy high-volume manufacturing environments in the Asian market. Has a small footprint and board handling system, is designed for maximum flexibility and can adapt to pre- or post-reflow inspection and a multitude of rework and data tracking scenarios.
Based on proprietary machine vision software, the system provides fast and easy program creation. Powerful inspection algorithms identify all visible component, lead and solder anomalies. Three mega pixel Thin
Camera and Fusion Lighting enable defect coverage and low false call
rates.
YESTech, yestechinc.com
Based on proprietary machine vision software, the system provides fast and easy program creation. Powerful inspection algorithms identify all visible component, lead and solder anomalies. Three mega pixel Thin
Camera and Fusion Lighting enable defect coverage and low false call
rates.
YESTech, yestechinc.com
Tapered dispense tips provide fast flow and minimize bubbles when dispensing thick or particle–filled fluids like epoxy, silicone and brazing paste.
Precision molded polyethylene tips feature a tapered hubless design to provide smooth, unrestricted application of thick fluids; reduces rework and rejects by preventing bubbles that could cause variations in the size of fluid deposits.
The color-coded tips are available in six sizes (0.060” to 0.010” ID) to handle a variety of fluids and applications. All sizes feature double-threaded SafetyLok design for secure attachment without the risk of tips blowing off, especially when using higher dispensing pressures for thick fluids.
Available in two styles: UV-blocking translucent tips for benchtop applications, and rigid opaque tips for automated applications or light-sensitive fluids. Both are packaged in lint-free, see-through boxes of 50 that are lot numbered to simplify process control.
EFD, efd-inc.com
EFD, efd-inc.com
ASYS Inc. has launced the Depaneling System ADS 01FR for maxium productivity.
The Turntable system is designed to lower the depaneling cost per product by maximizing throughput. Processes like loading a panel, alignment, cutting and unloading take place at the same time, which increases cycle times. For some products, throughput can be imporoved up to 80%.
The target market for this model is the telecommunication industry with fairly small panel sizes and a high volume, low mix environment.
The Turntable system is designed to lower the depaneling cost per product by maximizing throughput. Processes like loading a panel, alignment, cutting and unloading take place at the same time, which increases cycle times. For some products, throughput can be imporoved up to 80%.
The target market for this model is the telecommunication industry with fairly small panel sizes and a high volume, low mix environment.
ASYS, asys-group.com
Unifilm U801 and U801NP are acrylic transfer adhesives that reportedly deliver excellent peel strength and high temperature resistance.
Both are 5 mil acrylic transfer adhesives. U801 is supplied with a 64# printed polycoated kraft release liner, while the polycoated kraft release liner on U801NP is unprinted. Both are said to offer a balance of tack and peel and maintain excellent shear properties at temperatures greater than 375ºF. Adhere to a variety of metals and plastics including polyimide, polyester and ABS.
Designed to bond and protect flexible printed circuits (FPC), the adhesives are also ideal for applications involving nameplates, screen printing and high temperature industrial bonding and assembly.
Both are 5 mil acrylic transfer adhesives. U801 is supplied with a 64# printed polycoated kraft release liner, while the polycoated kraft release liner on U801NP is unprinted. Both are said to offer a balance of tack and peel and maintain excellent shear properties at temperatures greater than 375ºF. Adhere to a variety of metals and plastics including polyimide, polyester and ABS.
Designed to bond and protect flexible printed circuits (FPC), the adhesives are also ideal for applications involving nameplates, screen printing and high temperature industrial bonding and assembly.
