Practical Components now supplies the AIM print test board and kit designed to include printing challenges commonly encountered on manufacturers’ assemblies. In addition to BGA and microBGA pads, both have circular and square pad designs to test paste release. AIM has included the standard IPC slump test pattern to further challenge the properties of any product tested. This print pattern is more “real life” and can more accurately predict slump since individual pads are used as opposed to one pad that is common in the “thermometer” method. A number on the board indicates the distances between pads.
Common pad sizes were incorporated into the layout including 1206, 0805, 0402 and 0201 rectangular pads for discrete components. These pads have varying distances between them, allowing users to determine paste solder beading. Four 250 x 250 mil pads are available for use with various aperture styles to allow for wetting tests. There are also several fine-pitch QFP pads designed to check for the propensity of any given product to cause bridging, and to confirm the existence of torn prints, peaking (dog ears) or bridging.
Board material is FR4 170Tg with a standard ImAg finish. Digitized Gerber files are provided by Aegis Software. Available with lead-free components.
Common pad sizes were incorporated into the layout including 1206, 0805, 0402 and 0201 rectangular pads for discrete components. These pads have varying distances between them, allowing users to determine paste solder beading. Four 250 x 250 mil pads are available for use with various aperture styles to allow for wetting tests. There are also several fine-pitch QFP pads designed to check for the propensity of any given product to cause bridging, and to confirm the existence of torn prints, peaking (dog ears) or bridging.
Board material is FR4 170Tg with a standard ImAg finish. Digitized Gerber files are provided by Aegis Software. Available with lead-free components.
Practical Components, practicalcomponents.com
Onyx 29 semi-automated selective soldering machine provides high-performance rework of standard SMD components, but also handles problem components such as 80-mm SMD connection boards.
Has Multiple-Field-Of-View (MFOV) Vision System and an optional variable working height of up to 70 mm. Provides placement precision with standard components such as components down to 01005, flip chips, µBGA, CSP, BGA, LGA, MLF, CCGA, TCP, QFP, Fine Pitch, plug and base, RF-shields.
Has Multiple-Field-Of-View (MFOV) Vision System and an optional variable working height of up to 70 mm. Provides placement precision with standard components such as components down to 01005, flip chips, µBGA, CSP, BGA, LGA, MLF, CCGA, TCP, QFP, Fine Pitch, plug and base, RF-shields.
Zevac AG, zevac.ch
92-XCON OA flux is formulated for Pb-free soldering, and designed to withstand the high temperatures associated with Pb-free processing without breaking down or losing its activity. Said to offer a robust process window and combine freely rinsable, thermally stable synthetic polymers with a well-tuned activator system. Delivers metallurgically sound solder joints with a shiny appearance even under high thermal load. Cleans easily in a straight aqueous process, yielding circuit assemblies with extreme ionic cleanliness. Passes the Silver Chromate test for halides and is categorized as an IPC-Jstd-004 ORH0 product.
Cobar BV, cobar.com
Cobar BV, cobar.com
BPWin 4.58 features new NAND Flash options that will allow users to customize multiple partitions using a single algorithm when programming NAND devices.
Special Spare Area calculations can be added as needed without having to change the algorithm. The user can specify partitions with an arbitrary number of required addresses and specify how they align to the buffer. This feature is available to all NAND Flash devices that support it.
NAND Flash is used in numerous applications that involve the data file to be partitioned. For instance, the file may consist of an initial bootloader, followed by a bootup image, and data partitions. Depending on the application, each partition has a logical address to which it must map for correct functionality. Due to the presence of bad blocks, data on a device can shift, in terms of the actual address, to which it is programmed. It becomes essential that the algorithm used to program the NAND Flash guarantees that each partition starts at the exact specified logical address on the device. NAND Flash options in the BPWin software allow for this functionality.
Spare Area schemes allow fills or ECC (Error Correction Code) calculations “on the fly” during programming and verifying without modifying the buffer.
Special Spare Area calculations can be added as needed without having to change the algorithm. The user can specify partitions with an arbitrary number of required addresses and specify how they align to the buffer. This feature is available to all NAND Flash devices that support it.
NAND Flash is used in numerous applications that involve the data file to be partitioned. For instance, the file may consist of an initial bootloader, followed by a bootup image, and data partitions. Depending on the application, each partition has a logical address to which it must map for correct functionality. Due to the presence of bad blocks, data on a device can shift, in terms of the actual address, to which it is programmed. It becomes essential that the algorithm used to program the NAND Flash guarantees that each partition starts at the exact specified logical address on the device. NAND Flash options in the BPWin software allow for this functionality.
Spare Area schemes allow fills or ECC (Error Correction Code) calculations “on the fly” during programming and verifying without modifying the buffer.
BP Microsystems, bpmicro.com
A.C.E. Production Technologies introduces a Dual Head Fluxer option that facilitates quick changeover of flux types.
Is designed to meet the needs of selective soldering applications that demand quick changeover from leaded to no-lead solders, a common concern among electronics assemblers transitioning to Pb-free. The feature enhances the flexible KISS 102 programmable selective soldering system. The dual head fluxing system makes it possible to change flux types quickly and complements a fast solder pot changeover time.
Is a spray-type, system, with controllable spray point size, pattern and deposition volume. The maintenance-free spray head is controllable down to a spot size of 2 mm.
Rugged, reliable and compact, the programmable KISS 102 features a Pb-free compatible solder pot and is ideal for assembly, prototyping and rework, post-reflow offline assembly and other soldering applications such as odd-form devices.
Is designed to meet the needs of selective soldering applications that demand quick changeover from leaded to no-lead solders, a common concern among electronics assemblers transitioning to Pb-free. The feature enhances the flexible KISS 102 programmable selective soldering system. The dual head fluxing system makes it possible to change flux types quickly and complements a fast solder pot changeover time.
Is a spray-type, system, with controllable spray point size, pattern and deposition volume. The maintenance-free spray head is controllable down to a spot size of 2 mm.
Rugged, reliable and compact, the programmable KISS 102 features a Pb-free compatible solder pot and is ideal for assembly, prototyping and rework, post-reflow offline assembly and other soldering applications such as odd-form devices.
A.C.E. Production Technologies, ace-protech.com
Promation has released its latest version of the ELM-700AYL Laser Marking system for PCBs.
The software enhancements now allow for all standard True Type Windows based fonts to be used through an easy-to-navigate interface.
It also allows for easy import of JPEG, GIF and BMP raster formats and DXF, WME and PLT vector formats. The GUI has the look and feel of most Windows-based systems.
Other features include: WYSIWYG drawing editor; zoom in, zoom out and panning; inch, millimeter or centimeter units; unlimited multilevel undo and redo; Virtual Laser Marking; adjustable field size (square or rectangular); rotating of entire mark field (one-degree increments); rotate, scale, translate and mirror all text; and more.
The software enhancements now allow for all standard True Type Windows based fonts to be used through an easy-to-navigate interface.
It also allows for easy import of JPEG, GIF and BMP raster formats and DXF, WME and PLT vector formats. The GUI has the look and feel of most Windows-based systems.
Other features include: WYSIWYG drawing editor; zoom in, zoom out and panning; inch, millimeter or centimeter units; unlimited multilevel undo and redo; Virtual Laser Marking; adjustable field size (square or rectangular); rotating of entire mark field (one-degree increments); rotate, scale, translate and mirror all text; and more.
Promation, Pro-mation-Inc.com
Press Releases
- TopLine to Sponsor IMAPS Wire Bonding Workshop in San Diego Feb 3 & 4
- Indium Corporation to Showcase Precision Gold Solder Solutions at MD&M West 2025
- Incap India Enhances Share of Renewable Energy by Installing Solar Panels
- SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025