Photo Stencil aquired the AMTX E-Blade electroformed squeegee blade from Xerox. It is said to improve printdeposition, quality, uniformity and consistency. With a rigid, low-friction, hard-nickel edge, the blade provides cleaner prints, reduced stencil wear and less material waste.
"The electroformed E-Blade demonstrated the lowest squeegee pressure of any other squeegee blade I have tested for both SMT and wafer bumping printing," said Rick Lathrop, technical service manager of surface-mount materials at Heraeus. Heraeus recently completed a study on squeegee blades. "With lower print pressures come all of the benefits of reduced understencil wiping frequency and increased stencil life. The lack of paste scooping in large apertures for wafer bumping can only enhance bump coplanarity for automotive and WLCSP applications."
The blade also addresses issues caused by Pb-free printing. Pb-free solder paste requires higher squeegee pressures for a clean wipe of the stencil. The E-Blade prints at 33% of the squeegee pressure of other popular squeegee blades. High squeegee pressures result in "smear mode" printing whereas low squeegee pressure allows "sheer mode" printing.
Photo Stencil, www.photostencil.com
Almit Technology will debut a new Pb-free paste at Nepcon UK this April, created specifically for printing at up to four-times the normal printer excursion speed. LFM-48 TM HP solder paste reportedly enables increased productivity, allowing European assemblers to bid successfully against competitors in low labor cost countries.
The paste is said to exhibit good wetting, high definition printing with long screen and tack life. It is approved and adopted by major manufacturers worldwide for open blade printing and enclosed print head systems.
For through-hole assembly and rework, Almit has also introduced cored solder wire featuring 96.5%Sn-3%Ag-0.5%Cu alloy. KR-19SH RMA wire retains the benefits of the original product to deliver wetting, high reliability and low residue. It is available in diameters from 0.3 to 1.6 mm on 0.5Kg reels – and in selected sizes on anti-static Handy Reels.
Almit Technology Ltd., almit.com
Visit Stand C2 at Nepcon UK
Tyco Electronics’ Global Application Tooling Division (GATD) has collaboratively worked with Graphic Solutions International (GSI) to provide them with an RFID Inlay assembly system. This equipment will assemble semiconductor chips, surface-mount devices and printed batteries onto a continuous web of printed antennas, adding RFID capability to tags and labels.
Working closely with GSI, Tyco provided a reel to reel system that allows GSI to mount flip-chips, SMDs and printed batteries on a continuous web of printed antennas and conductive traces. The system is capable of the high-speed mounting of electronic components on a 6,000'+ (1,800+ m) roll of 20" wide material. After conductive printing, the roll is fed into the Tyco machine where components are added along with one or two printed batteries. Upon completion, the roll can be slit into individual streams and rolled, or supplied in production web width rolls for delivery. A typical circuit is inlaid with batteries, an RFID chip and a printed antenna. Its speed allows for production levels up to 26 million inlays per year.
The continuous web assembly system produces inlays that offer performance improvements over conventional PCBs. The system allows mounting flip chips for almost any purpose, as well as the ability to mount most standard SMDs along with GSI’s printed batteries. Can mount on paper, PET or other flexible substrates, and features a variable width capability up to 20" wide. Can accommodate printed substrates from 0.002" to 0.005" thick, mount on continuous rolls with a repeat pitch of 0.8" and position chips to micron accuracy.
Graphic Solutions International, graphicsolutionsinc.com
Tyco Electronics, tycoelectronics.com.
SFX-TAP(x)/FXT, transceivers are additional components to the JTAG/Boundary Scan hardware platform Scanflex. The TAP transceivers (SFX transceivers) were developed for integration into in-circuit testers (ICT) and optionally offer 2, 4, 6 and 8 parallel, independent TAPs as well as additional resources and special functions.
In contrast to previous Scanflex TAP transceivers, the new models’ TAP Interface Cards (TIC) type 02 are no longer integrated but are differentially coupled with an up to 2 metres long IDC or Wire Wrap cable. Even at high frequency signal transitions, a TAP signal transmission to the TIC02 modules of up to 80 MHz is guaranteed. The low-cost modules provide externally programmable input and output voltage per TAP as well as relays for the galvanic isolation from the UUT. Furthermore, there is a mechanism to adapt the interface to various driver requirements. For each TAP there is a programmable delay compensation combined with stepwise (250Hz/1MHz) programmable TCK frequency to 80MHz.
Features include 32 voltage programmable dynamic I/O, two analog I/O channels and three statistic I/O and trigger lines.
Has a slot for coupling with Scanflex I/O modules. Alternatively, various SFX I/O modules can be connected via an SFX/LS interface. These extensions allow the configuration of almost unlimited additional analog or digital resources.
GÖPEL electronic, www.goepel.com
In contrast to previous Scanflex TAP transceivers, the new models’ TAP Interface Cards (TIC) type 02 are no longer integrated but are differentially coupled with an up to 2 metres long IDC or Wire Wrap cable. Even at high frequency signal transitions, a TAP signal transmission to the TIC02 modules of up to 80 MHz is guaranteed. The low-cost modules provide externally programmable input and output voltage per TAP as well as relays for the galvanic isolation from the UUT. Furthermore, there is a mechanism to adapt the interface to various driver requirements. For each TAP there is a programmable delay compensation combined with stepwise (250Hz/1MHz) programmable TCK frequency to 80MHz.
Features include 32 voltage programmable dynamic I/O, two analog I/O channels and three statistic I/O and trigger lines.
Has a slot for coupling with Scanflex I/O modules. Alternatively, various SFX I/O modules can be connected via an SFX/LS interface. These extensions allow the configuration of almost unlimited additional analog or digital resources.
GÖPEL electronic, www.goepel.com
Compact Desktop System S2088 provides automated optical inspection of paste print and pre/post reflow. Suited for serial production during shift work, prototype programming, prototype laboratory development or as testing support for new assemblies.
Covers all inspection stages – paste print, pre and post reflow. Features a new high-resolution color camera. The illumination is compatible with existing Viscom systems, the software and programming environment is identical. Programs can be imported to in-line. The loading is carried out via a PCB drawer with single-button operation. PCBs up to 17.7 x 15.7” can be handled.
System processor, axis control and all other important components are integrated into the compact design. This makes external cabling unnecessary. Has precise linear drives with high resolution measuring systems. Mmachine capability tests can be carried out.
Viscom will have a booth at the SMT/Hybrid/Packaging Show, Hall 7, Stand 7-211.
Viscom, viscom.com
Covers all inspection stages – paste print, pre and post reflow. Features a new high-resolution color camera. The illumination is compatible with existing Viscom systems, the software and programming environment is identical. Programs can be imported to in-line. The loading is carried out via a PCB drawer with single-button operation. PCBs up to 17.7 x 15.7” can be handled.
System processor, axis control and all other important components are integrated into the compact design. This makes external cabling unnecessary. Has precise linear drives with high resolution measuring systems. Mmachine capability tests can be carried out.
Viscom will have a booth at the SMT/Hybrid/Packaging Show, Hall 7, Stand 7-211.
Viscom, viscom.com
Lead Eliminator uses a combination of chelating agents and other ingredients to lift and remove lead and heavy metals from a variety of surfaces such as Formica (commonly found in workbenches), stainless steel and aluminum, Lexan and other polymers, as well as materials found in and around SMT manufacturing lines, including painted surfaces and flooring. Has low toxicity.
Employs a combined proprietary chemistry and wipe technology that picks up and remediates lead and other heavy metals from work surfaces, tools, etc. Dual action remediation wipes and sprays remove heavy metals, soil and residue from affected surfaces.
Is part of the GlobalTech family of environmentally responsible products. Available in saturated wipes with one abrasive side and one smooth side in 100-count canisters of 6 x 9” wipes, or in one-pint spray bottles. Sold separately or as part of a lead remediation kit.
Employs a combined proprietary chemistry and wipe technology that picks up and remediates lead and other heavy metals from work surfaces, tools, etc. Dual action remediation wipes and sprays remove heavy metals, soil and residue from affected surfaces.
Is part of the GlobalTech family of environmentally responsible products. Available in saturated wipes with one abrasive side and one smooth side in 100-count canisters of 6 x 9” wipes, or in one-pint spray bottles. Sold separately or as part of a lead remediation kit.
JNJ Industries, Inc., jnj-industries.com
