Crossbow connector platform features Crossbow Matrix for orthogonal midplane architectures and Crossbow 2mm+ for standard backplane configurations. The differential connector is optimized for orthogonal midplane configurations, and enables data rates up to 25 Gb/s.
The connector is designed so the differential pairs on each side of the midplane share vias. This direct path approach and the connector's footprint eliminates most electrical problems associated with the traditional backplane via stub, including elimination of cross-talk in the footprint, reflections and impedance mismatches. Said to reduce board layer count by as much as 50% and eliminate the need for backdrilling.
Exhibits less than 0.6% crosstalk at 50 ps and 25 db below transmission across the entire link (past 10GHz). It also demonstrates 100+/- 5% ohms matched impedance across a full link and includes features that compensate for skew.
The 2mm+ connector supports 12.5 Gb/s data rates in a high-density (63 pair/in) configuration. Demonstrates crosstalk less than 1.5% at 50 ps and is designed to complement Crossbow Matrix. Both versions fit on the same rear organizing stiffener, allowing designers to configure a single connector to support orthogonal midplane connections and route high-speed signal lines across the backplane in hybrid architectures.
Incorporates the GbX (R) 0.018" compliant pin and mating interface to ensure mechanical robustness. Both connectors include unique features on the backplane modules that reduce the potential for bent pins.
The Matrix platform includes a 6 x 6 (differential pairs) and 4 x 4 version. The 2mm+ features five differential pairs per column. Both connectors include power and guidance.
Amphenol TCS
ASYS introduced a laser marking island during Apex. The island consists of a Board Destacker, Laser Marker, an optional Flip Station and a Restacker. Can handle a throughput of up to 510 PCBs per hour including code verification. The optional Flip Station, which is completely controlled by the laser marker, can flip the boards for double-sided marking requirements. The marker can handle all industry standard 1-D and 2-D codes, text and graphics in a maximum range of 18 x 18”. The island is less than 8.5 feet long and can be upgraded with multiple options.
ASYS Automation, asys-llc.com
ASYS Automation, asys-llc.com
The Christopher Group has introduced the DaiNippon Screen (Kyoto, Japan) FP 8000 final visual inspection system. Using DaiNippon Screen’s advanced color imaging system, it inspects both sides of the substrate automatically for surface defects including scratches, chips, exposed metal surfaces, discoloration, solder mask on pads, and other surface defects. Can inspect gold, copper, solder mask and legend ink, as well as the underlying patterns. Substrates with multiple surface finishes can also be inspected.
Image capture and processing speed is up to 200% faster than previous models with an inspection time of less than 30 sec. for both sides of an 18 x 20” substrate. Is fully automatic, and programming is simple. Has Windows XP user interface, can be linked to the VS Series verification stations.
The Christopher Group Inc., christopherweb.com
Tyco Electronics recently upgraded its custom and pre-print label product line. New additions include improved adhesive-backed labels for use in industrial, commercial and consumer product applications. The range of materials, adhesives and printing methods make the custom and pre-print labels suitable for use in aerospace, telecom, datacom, electronics, military hardware, shipboard systems, medical equipment, pharmaceuticals and many other industries.
Can be designed by Tyco Electronics or originate from existing customer-specific logos, artwork or brand markings. Color matching, custom shapes and UL & CSA certified materials are available. Tyco Electronics also offers custom data printing for sequential numbering, 2-D data matrix, bar coding and other customization.
Offers four major printing technologies for custom and pre-print labels including: Flexography printing for general-purpose, high-volume, six-color printing; hot foil printing, a three-color process for various materials; thermal transfer for serial and barcode printing needs and laser engraving for the highest level of durability.
Printing substrates include: white polyester, clear polyester, metalized polyester, white vinyl, nylon cloth, vinyl cloth, polyimide film, polyvinvlfluoride, tamper-evident materials, stainless steel, polyolefin cable markers and heat shrinkable markers & sleeves.
Can be designed by Tyco Electronics or originate from existing customer-specific logos, artwork or brand markings. Color matching, custom shapes and UL & CSA certified materials are available. Tyco Electronics also offers custom data printing for sequential numbering, 2-D data matrix, bar coding and other customization.
Offers four major printing technologies for custom and pre-print labels including: Flexography printing for general-purpose, high-volume, six-color printing; hot foil printing, a three-color process for various materials; thermal transfer for serial and barcode printing needs and laser engraving for the highest level of durability.
Printing substrates include: white polyester, clear polyester, metalized polyester, white vinyl, nylon cloth, vinyl cloth, polyimide film, polyvinvlfluoride, tamper-evident materials, stainless steel, polyolefin cable markers and heat shrinkable markers & sleeves.
Tyco Electronics, www.tycoelectronics.com
ALPHA EF-6100 low-solids wave solder flux is the latest addition to Cookson’s EF-Series environmentally-friendly fluxes designed for Pb-free as well as SnPb processes. The no-clean, alcohol-based flux passes all international reliability standards including IPC, Bellcore and JIS.
Leaves minimal colorless, non-tacky, clear flux residue that spreads uniformly over the surface of PCBs. Provides resistance to connector bridging across a range of process conditions. It is compatible with all common pad finish types and improves yield by reducing defects, minimizing rework and increasing throughput.
Cookson Electronics Assembly Materials, cooksonelectronics.com
Leaves minimal colorless, non-tacky, clear flux residue that spreads uniformly over the surface of PCBs. Provides resistance to connector bridging across a range of process conditions. It is compatible with all common pad finish types and improves yield by reducing defects, minimizing rework and increasing throughput.
Cookson Electronics Assembly Materials, cooksonelectronics.com
Servo-Flo 404 System is a compact shot meter and integrated dispense valve for robotic and automated dispensing applications such as bonding, gasketing, filling and sealing operations. The positive rod displacement and servo-motor design can dispense abrasive and filled adhesives and sealants such as epoxies, silicones and urethanes.
Has a quick-change Tip-Seal dispense valve for accurate start-stop of material flow. Can be mounted to a robot wrist, moving automation or fixed mounted. System design selections include volume size, temperature control, valve selection, vision and system integration.
Closed-loop processor provides precise shot volumes, consistent bead diameters and variable bead diameters during the dispense cycle. Using the touch-screen interface, the operator sets flow rates and material volume and the automation selects stored flow-rate and shot-volume programs for different parts.
Has a quick-change Tip-Seal dispense valve for accurate start-stop of material flow. Can be mounted to a robot wrist, moving automation or fixed mounted. System design selections include volume size, temperature control, valve selection, vision and system integration.
Closed-loop processor provides precise shot volumes, consistent bead diameters and variable bead diameters during the dispense cycle. Using the touch-screen interface, the operator sets flow rates and material volume and the automation selects stored flow-rate and shot-volume programs for different parts.
Sealant Equipment & Engineering, sealantequipment.com
