M1 AOI system was developed with enhancements to satisfy high-volume manufacturing environments in the Asian market. Has a small footprint and board handling system, is designed for maximum flexibility and can adapt to pre- or post-reflow inspection and a multitude of rework and data tracking scenarios.
Based on proprietary machine vision software, the system provides fast and easy program creation. Powerful inspection algorithms identify all visible component, lead and solder anomalies. Three mega pixel Thin Camera and Fusion Lighting enable defect coverage and low false call rates.
Tapered dispense tips provide fast flow and minimize bubbles when dispensing thick or particle–filled fluids like epoxy, silicone and brazing paste.
Precision molded polyethylene tips feature a tapered hubless design to provide smooth, unrestricted application of thick fluids; reduces rework and rejects by preventing bubbles that could cause variations in the size of fluid deposits.
The color-coded tips are available in six sizes (0.060” to 0.010” ID) to handle a variety of fluids and applications. All sizes feature double-threaded SafetyLok design for secure attachment without the risk of tips blowing off, especially when using higher dispensing pressures for thick fluids.
Available in two styles: UV-blocking translucent tips for benchtop applications, and rigid opaque tips for automated applications or light-sensitive fluids. Both are packaged in lint-free, see-through boxes of 50 that are lot numbered to simplify process control.
ASYS Inc. has launced the Depaneling System ADS 01FR for maxium productivity.
The Turntable system is designed to lower the depaneling cost per product by maximizing throughput. Processes like loading a panel, alignment, cutting and unloading take place at the same time, which increases cycle times. For some products, throughput can be imporoved up to 80%.
The target market for this model is the telecommunication industry with fairly small panel sizes and a high volume, low mix environment.
Unifilm U801 and U801NP are acrylic transfer adhesives that reportedly deliver excellent peel strength and high temperature resistance.
Both are 5 mil acrylic transfer adhesives. U801 is supplied with a 64# printed polycoated kraft release liner, while the polycoated kraft release liner on U801NP is unprinted. Both are said to offer a balance of tack and peel and maintain excellent shear properties at temperatures greater than 375ºF. Adhere to a variety of metals and plastics including polyimide, polyester and ABS.
Designed to bond and protect flexible printed circuits (FPC), the adhesives are also ideal for applications involving nameplates, screen printing and high temperature industrial bonding and assembly.
Model 2200-545-037 two-component Miniature Mix-Dispense Valve precisely dispenses miniature beads and small volumes of low-viscosity pourable materials and abrasive or filled materials. Ideal for low-flow applications typically found in miniature potting, doming, filling and bonding operations. The valve uses No-Drip technology for dispensing solvent-based, moisture-curing and stringy materials such as epoxies, silicones and polyurethanes in difficult product-assembly applications. The pneumatically actuated valve opens and closes its carbide resin- and catalyst-material passages at the mixer entrance to precisely start and stop material flow. Has stainless-steel wetted components, dual carbide ball-and-seat shut-off, safety-closure spring, flow-control adjustment and balancer eye-hook. The valve’s stroke adjuster can set the needle opening to adjust material-flow rates. Wear-resistant fluid seals extend valve life. Precision dowel and screw holes allow easy and accurate mounting. Quarter-turn bayonet mount accommodates many disposable mixer sizes. A typical bayonet-mount mixer used is a 17-element disposable mixer, 0.125” diameter, 2.46” long and 0.030” outlet orifice. Resin and catalyst materials are delivered on-ratio by Servo-Flo metering assembly fed by supply tanks or pumps. Sealant Equipment & Engineering, sealantequipment.com
A.C.E. Production Technologies will exhibit the KISS line of selective soldering systems suitable for Pb-free solders at Nepcon East in booth #6028. A.C. E. will also introduce its Dual Head Fluxer option that facilitates quick changeover of flux types. It is designed to meet the needs of selective soldering applications that demand quick changeover from leaded to no-lead solders, a common concern among electronics assemblers transitioning to Pb-free.
Rugged, reliable and compact, the line consists of the basic KISS 101 system and programmable KISS 102. The systems feature Pb-free compatible solder pots for assembly, prototyping and rework, post-reflow offline assembly and other selective soldering applications such as odd-form devices.
Standard and custom nozzles are available for both machines. Both are bench-top models with optional carriages for stand-alone use. A dual-head fluxing system for the 102 makes it possible to change flux types quickly.
Both can accommodate PCB’s from 2 x 2” up to 18 x 24”, and connectors up to 10” long.