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Vertical PC Board Cart is available in a variety of standard sizes, and is infinitely adjustable. Offers custom slotted, ESD-safe plastic panels on the shelves to protect the edges of PCBs and the sheet metal panels attached to high-end PCBs. Feature a “fish mouth” entrance to the slot to make it easy for the operator to slide PCBs into the shelf. Available for single-sided or double-sided applications. Hundreds of PCBs can be stored in the cart; fully enclosed models are available.

Bliss Industries, blissindustries.com
Booth 857
Glenbrook Technologies offers real-time x-ray systems with x-ray microscope technology to meet the demands of both production and laboratory environments for PCB and BGA inspection.
 
RTX series for production monitoring, and the Jewel Box series for process development and failure analysis, help reduce manufacturing costs and feature compact designs.
 
RTX series provides rapid, reliable in-process inspection at high volumes for PCBs with advanced components such as BGAs, micro BGAs and flip chips. Compact size, light weight and wheeled design make it easy to move and position in tight quarters.
 
To support advanced research, process development and failure analysis in the laboratory, Jewel Box series offers high magnification, with continuous zoom from 7x to 2000x. Micro-focus x-ray tubes provide ultra-high resolution and detail. A five-axis positioner allows x-ray imaging from any angle.
 
Glenbrook Technologies, glenbrooktech.com
PCB049 board and kit can evaluate mixed-technology Pb-free assembly. Tests a variety of JEDEC and EIAJ components.
 
Evaluates solder paste wetting and spread, solder paste slump performance, solder preform pin-in-paste performance and wave flux hole fill performance. Helps provide pick-and-place equipment and placement accuracy, reflow process capabilities, effectiveness of cleaning processes, surface insulation resistance (SIR), surface finish interaction factors and lead-free underfill performance. 
 
Four different optional finishes available for 8 x 10" boards: OSP, ImSn, ImAg and ENIG.


Each test kit includes a copy of CircuitCAM and CheckPoint software, ready-to-run CircuitCAM project files (CPFs), assembly documentation samples and templates, installation instructions and user manual.


Practical Components Inc., practicalcomponents.com

Indium Corp., indium.com
A-TEK is the exclusive distributor of the CSR 1200 Stand-Alone Depaneling machine manufactured by Getech Pte Ltd. The depaneler addresses the stringent electrical and safety requirements for CE certification.
 
Stand-alone unit features two independent processing tables for continuous operation and system optimization. Can handle panel sizes up to 13.8 x 13.8” (350 x 350 mm). Larger panels up to 20.8 x 20.8” (528 x 528 mm) can be prcessed on the CSR1280.
 
A-Tek, atekllc.com
Booth 263

A full range of precious metal clad products for fabricating micro-switches, connectors and components used in high-reliability medical, military and consumer products is available from Anomet.
 
They are metallurgically bonded to a core material to meet specific high-reliability requirements for contact and corrosion resistance, biocompatibility or to simply reduce material cost.
 
Fabricated by hot and cold drawing, have a smooth, consistent surface finish. The cladding can be produced thinner than filled and thicker than plated wire or ribbon, and the products are reportedly  more ductile and formable.
 
Functionally equivalent to solid products, available as wire and rod in sizes from 0.002 to 0.125” O.D. and as ribbon up to 1” W, with 2% or more cladding thickness, depending upon desired properties.  Precious metals can include platinum, palladium, gold or silver and related alloys on cores such as stainless steel, copper, Kovar, niobium, nickel-iron, molybdenum, tantalum and titanium. 
 
Anomet Products, www.anometproducts.com
Micro HVR addresses the high-volume rework market  where hundreds of boards must be repaired due either to high value, component scarcity or where manual rework is illogical. For repair challenges arising from component failure, assembly error, device revision and firmware updates, the system automatically sequences the repair steps: component de-solder and discard, residual solder removal, flux dispense (where necessary) and component re-solder.  All steps are automated. 
 
The pivot arm, with component rotation capability, is automated for hands-free placement. Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate. Uses ”single-sweep“ residual solder removal technique. Has placement accuracy better than 10 µm, is suitable for large BGAs to fine-pitch CSPs and flip chips. 

A ”friction-free“ positioning table with x,y planar motor and high-resolution z-axis control is integrated.  An additional fast linear axis accomodates large substrates. 
Features an open data interface structure to the assembly line, and a modular design that is adaptable for different applications.
 
Can be configured with solder paste dispense for 0201 devices.  Can perform for extended periods of time at elevated temperatures.
 
Finetech, finetechusa.com
Booth 1481

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