VIPx (Verifier Image Processor) is a PC/Windows XP-based Image Processor that delivers solder joint, package and PCB board level diagnostic software capabilities for visualization, precise measurement and user defined (pass or fail) analysis of SMT/BGA solder joints, PCBs, components, mechanical parts and electrical interconnections. Suitable for upgrading almost any x-ray inspection system, (manual or semi-automated) with PC-based functionality.
Application centric tool set focuses on key high-use features facilitated by wizard-driven diagnostic helpers. Algorithm-based inspection modules automatically find solder connections and perform measurement and defect detection by operator defined pass/fail analysis criteria. This collective image processing automatically finds failures at the solder joint level or selected regions of interest (voids, opens, shorts, ball size, ball shape, etc.) by color-coded indicators. Data collection and e measurement reporting further isolate, quantify and document faults for corrective action.
Features a number of modules for BGA analysis, SMT analysis, custom analysis, package analysis, PCB analysis or image enhancement.
An extension of the VIP software series offered on Verifier, Concept FX and refurbished Nicolet x-ray equipment products. Can be added to any camera-based x-ray inspection systems offered in the industry.
TSD-100 thermal shock chamber can meet the Mil-Std 883 test method 1010.7 with up to 22 lbs. of samples, such as plastic IC chips. Overall interior volume is 4 cu. ft. (100L), allowing testing of larger products and sub-assemblies, as well as large quantities of components like ICs.
Measurer 44” wide, resulting in a 40% smaller footprint than the ETS4-2CW. Overall power consumption (full-load amps) has been reduced by 60%. Have Copeland brand Scroll refrigeration compressors and touch-screen controller mounted on the door.
Has an interior of 28 x 16”.
STT, or Specimen Temperature Trigger, actively monitors the temperature of the product and only advances the program to the next step once the product has reached the desired temperature. It adjusts the soak period according to how much product is being tested.
Other features include: a flexible cabling tube (for monitoring or powering samples) that comes out the side, rather than a moving pipe that sticks out the top; a cool-down mode; an option for a window to check on the samples r.
Built at ESPEC’s headquarters in Japan and will be stocked at their Michigan factory along with replacement parts. A one-year parts and labor warranty is included.
B2 Benchtop automated optical inspection system for post-reflow PCBs is said to offer up to a three times improvement in inspection speed and improved fusion lighting to provide defect coverage. Features large board handling in a compact package, and complete software/board setup compatibility with the inline F1 series.
Operators typically take less than 30 min. to create a complete inspection program including solder joints. Uses a stand package library to simplify training and ensure program portability across manufacturing lines. Image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms to provide inspection coverage with a low false failure rate.
YESPC software provides real-time process monitoring. Continuously monitors inspection results, so users can immediately react to critical process events. In a networked environment, user defined charts and alarms can be accessed remotely via Web browsers. It can also provide email alerts.
Provides diagnostic and trending analysis of the manufacturing process.
Features a package of SPC charts, including X-bar range, X- moving range, histogram, Pareto analysis, scatter plot, Cp, CpK and other reports that provide real-time alarms for out-of-tolerance conditions. Compatible with YESTech AOI and YTX-5000 combined x-ray/vision system.
MEP 6T servo electric press specializes in the application of compliant pin connectors to PCBs.
Uses a PC-controlled servo drive to control and monitor force, position and speed throughout the press cycle. By monitoring the entire press cycle, it can determine if a connector is being applied incorrectly and stop the process to avoid scrap and rework. Complete press cycle data can be stored for each connector applied to provide full traceability for the entire PCB.
Programming is provided through a Windows interface with database-driven software. Each connector can be pressed to a different level of force or distance without any operator setup.
Connectors can be terminated on force or distance while providing control of the speed of the press cycle, including the ability to dwell for a specified time. Can be used in applications other than press-fit connectors such as PEM nuts, rivets and heat sinks.
Provides up to 6 tons of pressing capacity, can accommodate PCBs up to 24 x 36". The 10" wide press ram allows for the mass-termination of more than one connector (of the same type) in a single press stroke. Options include an air table to allow for easy PCB movement and tooling stack up, tool-in-place sensor to ensure proper tool location and complete turnkey solutions including insertion tooling and PCB fixtures.
The Commercial Products division of Branson introduces support racks for the bottom of the ultrasonic tank. Parts baskets are required to suspend items in the solution, however they are not practical for all ultrasonic cleaning applications. Support racks provide a stable, flat surface upon which parts, fixtures, or containers may be placed. Open design with integral rubberized “feet” will not inhibit chemistry circulation or ultrasonic energy.
Also useful as countertop support racks following cleaning or processing. Hold containers or components off the table to facilitate air circulation and drying. A range of sizes is provided to access the full volume of your tank. Have stainless construction for chemical compatibility, electro-welded design for durability, bright electro polished finish for cleanliness. For use with .5 to 5.5 gal units.