IBIS, the Interferometric Bump Inspection System, offers production volume solder bump inspection on chip carriers. It inspects and reports on the position, height and shape of solder bumps on the die-attach side of chip carriers, ensuring that carriers are within specification for chip attachment.
Uses massively parallel digital signal processing technology coupled with true white light interferometry to reportedly offer 20 to 30X improvement over existing interferometry systems. This technology will be transportable to wafer and chip solder bump measurement in the future.
Lloyd Doyle Ltd., lloyd-doyle.com
Booth 2086
Uses massively parallel digital signal processing technology coupled with true white light interferometry to reportedly offer 20 to 30X improvement over existing interferometry systems. This technology will be transportable to wafer and chip solder bump measurement in the future.
Lloyd Doyle Ltd., lloyd-doyle.com
Booth 2086
CDS6250 automatic system can dispense up to 150 drops/sec. (540,000 drops/hr.). Nanojet dispensing valve produces dots down to 2 nl. Three-axis system is programmable and can dispense adhesives with and without filler, pastes, oils, lubricants, colors, lacquer, flux, solder resist, conformal coating and more. Almost all media with a viscosity between 50 and 200,000 mPas can be dispensed.
Unlike other needle-based dispensing systems, the gap between the jet valve and the substrate can vary. As a result, the dispenser can travel at a fixed height while the substrate’s height changes.
Very thin ropes can be dispensed by jetting one drop next to the other, or by dispensing into a thin needle. The valve can dispense media under pressure (up to 100 bar) at high temperatures up to 100°C.
Features RO-CONTROL software for increased process simulation and control. The software offers many of the same features as thermal profilers.
The high air volume of guarantees equal heating rates in all the components and the substrate, which leads to a minimum Delta-T. Options for the 80" long oven include: chain conveyor for double-sided boards, computer control and an N2 option.
Can be used for prototypes, small batches and production runs up to 700 boards in an eight-hour shift.
Essemtec, essemtec.com
Apex booth 2433
Unlike other needle-based dispensing systems, the gap between the jet valve and the substrate can vary. As a result, the dispenser can travel at a fixed height while the substrate’s height changes.
Very thin ropes can be dispensed by jetting one drop next to the other, or by dispensing into a thin needle. The valve can dispense media under pressure (up to 100 bar) at high temperatures up to 100°C.
RO300FC full convection reflow oven is said to allow fast, homogenous heating. The integrated convection technology has a vertical hot air stream that evenly heats the complete PCB. Both standard and Pb-free pastes can be used.
Features RO-CONTROL software for increased process simulation and control. The software offers many of the same features as thermal profilers.
The high air volume of guarantees equal heating rates in all the components and the substrate, which leads to a minimum Delta-T. Options for the 80" long oven include: chain conveyor for double-sided boards, computer control and an N2 option.
The temperature of the pre-heat and the peak zones along with the conveyor speed are programmable to obtain the required soldering profile. Measuring the zone temperatures directly in the convection airflow guarantees reproducible results with Delta-T values at ±2°C. Different profiles for solder and glue are integrated in the microprocessor control.
Can be used for prototypes, small batches and production runs up to 700 boards in an eight-hour shift.
Essemtec, essemtec.com
Apex booth 2433
Auto-Focus software automatically selects the best reflow oven recipe for new products without running a profile by evaluating a database of previously setup products and extrapolating a new oven recipe based on product and oven characteristics. Instead of relying on a technician’s guess, the user enters the product’s length, width and weight. After a dozen products that cover the required range have been set up properly, the accuracy and quality of the oven recipes developed is so high that most users may no longer find it necessary to run a verification profile.
Valuable to high-mix facilities, high-value assemblers and facilities that want to minimize setup times. Reduces downtime for oven setup.
KIC, kicthermal.com
Booth 363
Valuable to high-mix facilities, high-value assemblers and facilities that want to minimize setup times. Reduces downtime for oven setup.
KIC, kicthermal.com
Booth 363
The manual version of Fineplacer Lambda is used for sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. Placement accuracy is ± 0.5 µm for the A6 and A6V models, or better than ± 0.5 µm for the A7V l. Can be equipped with different viewing equipment including a LEICA microscope or a camera-monitor magnification system.
Features an FA7 heating plate with a 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per sec.; thermal conductivity; low thermal expansion; and optional heated inert gas integration.
The automated configuration is equipped with the automatic module package, consisting of the Automatic Bonding Force Module, Motorized Microscope Movement, and PC Control and Bonding WIN Flip Chip Software. Provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.
Advantages of the automated configuration include hands-off die placement; improved process repeatability ¾ pilot production worthy; places die with dimensions that exceed the optical field of view; provides up to 10 programmable microscope positions; upgradeable with integrated microscope; and features a measurement function as well as a placement mask generator.
Finetech Inc., finetechusa.com
Booth 1481
Features an FA7 heating plate with a 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per sec.; thermal conductivity; low thermal expansion; and optional heated inert gas integration.
The automated configuration is equipped with the automatic module package, consisting of the Automatic Bonding Force Module, Motorized Microscope Movement, and PC Control and Bonding WIN Flip Chip Software. Provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.
Advantages of the automated configuration include hands-off die placement; improved process repeatability ¾ pilot production worthy; places die with dimensions that exceed the optical field of view; provides up to 10 programmable microscope positions; upgradeable with integrated microscope; and features a measurement function as well as a placement mask generator.
Finetech Inc., finetechusa.com
Booth 1481
CX-1 is capable of placing advanced packages such as SiP, MCM and other mixed-technology applications. Features high-accuracy applications as well as standard SMT. Is built on the base of a standard SMT machine, but with highly accurate glass linear encoders. Special software periodically checks and calibrates to ensure accuracy.
With traditional lines, four machines are necessary; however, here only three systems accomplish the same production levels. Addresses the industry challenge of increasing use of bare die and flip chips mixed with standard SMT (such as cell phones, PDAs, etc.).
Compatible with existing feeders and line control software (HLC). Features HMS II to measure board surface height and flatness and placement flatness and the placement force control.
Comes standard with four placement heads capable of laser/vision centering, with independent x and theta motors, that can handle boards up to 330 x 250 mm and feature a standard 27 mm FOV high-resolution camera.
The system offers two modes -- high accuracy and standard accuracy. High-accuracy features speeds of 1,300 (vision) and 1,600 (laser), and an accuracy of ±20 mm. Standard mode features a speed of
11,000 cph and an accuracy of ±40 mm.
Juki Automation Systems, jas-smt.com
Booth 1069
MS2 molten solder surfactant eliminates dross in wave soldering. Available for both leaded and lead-free processes, does not mix with the metal but forms a thin floating layer that covers the entire solder surface except the wave, which it does not disturb. Prevents dross from forming on the surface and immediately converts any dross generated by the wave back into usable metal. Said to reduce solder usage by as much as 40 to 75% and result in other dross-related cost savings.
P. Kay Metal, pkaymetal.com
Apex booth 2635
P. Kay Metal, pkaymetal.com
Apex booth 2635
