FLX2010-LCV flexible pick-and-place system is designed for high-mix/low-volume production. The company claims to feature the largest board size and feeder capacity in the industry while also taking up one of the smallest footprints.
FLX series offers changeover without downtime, via intelligent feeders, large feeder capacity and offline programming and job planning. Start at 5,000 CPH with 150 feeders inline and can expand to 15,000 CPH with over 470 feeders.
Can accept nearly any kind of feeding system, even an independent unit such as a vibratory bowl feeder for bulk components with no electrical connection to the machine. Equipped with laser and vision alignment systems.
FLX series offers changeover without downtime, via intelligent feeders, large feeder capacity and offline programming and job planning. Start at 5,000 CPH with 150 feeders inline and can expand to 15,000 CPH with over 470 feeders.
MIS software offers production planning, inventory control, quality control through bar code verification and traceability of lots. Offline setup gives the ability to produce without downtime. Requires only 110 V of power.
Can accept nearly any kind of feeding system, even an independent unit such as a vibratory bowl feeder for bulk components with no electrical connection to the machine. Equipped with laser and vision alignment systems.
Essemtec, essemtec.com
Booth 2433
Booth 2433
PRO 1S and PRO 1Sm are single nozzle, selective soldering stations that solder components individually or in groups. The nozzle is surrounded by a nitrogen blanket.
The 30-lb. solder pot is Pb-free compliant and comes with a solder replenishment system and automatic spray fluxer system. PCBs or pallets enter the work cell on an in-line conveyor system. Programs may be set up through a data management system or overhead laser pointer. Once the x/y parameters are established, the z motion can maneuver around bottom-side components.
Promation, pro-mation-inc.com
Booth 915
PRO-8b Selective Laser Soldering system provides an economical means to selective solder tin/lead and Pb-free alloys within minimal startup costs and ongoing maintenance, lower power consumption, and reduced environmental impact.
60-W Diode Laser Cell in-line soldering station combines easy-to-use software and precision movement to selective solder most bottom-side applications. Offers over 10,000 hours of useful soldering life and does not require that the solder remain preheated during non-soldering times. Equipped with a precision four-axis Cartesian robot with enhanced Adept motion and vision guidance (with fiducial recognition system and dynamic compensation).
End effector allows the soldering head and automatic solder feeder to be independently adjustable. Variable beam selection ranges from 0.7 to 2.5 mm. Approach and angle are controlled through software.
Pin-to-pin acceleration can be as aggressive as 0.1 sec. Can move 1.2 meter/sec. at 1G acceleration; however, most soldering is accomplished at 50% of this level. The vision system may be programmed to look for known fiducial points, analyze them and automatically center to that point. Variable beam size allows operators to program in desired size (from 0.7 to 2.5 mm.
Promation, www.Pro-mation-Inc.com
Apex booth 915
Apex booth 915
SMT USC400 is a portable ultrasonic contact type stencil cleaning system.
The operator moves the hand tool over the stencil after spraying with cleaning fluid. The tranducer vibrates the contamination through even small stencil apertures. Residues are collected on disposable wipe material under the stencil. Removes difficult high tack residues such as those found with Pb-free solder materials.
Suitable for offline and on-printer cleaning operations. Stencil cleaning can be carried out on the printer without removing the stencil frame.
An optional ultrasonic mini-bath is available to clean machine accessories such as placement nozzles, glue dispensing needles, test probes, etc.
Suitable for offline and on-printer cleaning operations. Stencil cleaning can be carried out on the printer without removing the stencil frame.
An optional ultrasonic mini-bath is available to clean machine accessories such as placement nozzles, glue dispensing needles, test probes, etc.
Is lightweight, has rugged industrial construction and is suitable for all stencil materials, even plastic. Suitable for all printable materials, including paste, inks, resists and SMD adhesives. Advanced Transducer Autotuning system results in optimum cleaning performance.
Surclean, a division of SMT, info@smt.uk.com
FLIP Solder Bath for Pb-free reflow soldering features Linear Induction Pumping, in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, which moves molten solder upward through nozzles and flow down by gravity. Two induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in reflow and selective solder systems.
Uses 300 kg of solder, instead of 450 kg, and generates less solder dross: 7 kg, instead of 15 kg, after 8 hours of operation. Offers open space to access inside side bath and easy nozzle cleaning and maintenance. Does not have motors, impeller shafts or belts. Said to feature a quieter, more stable solder wave than impeller motor types.
Tamura H.A. Machinery Inc., tamura-ha.com
Uses 300 kg of solder, instead of 450 kg, and generates less solder dross: 7 kg, instead of 15 kg, after 8 hours of operation. Offers open space to access inside side bath and easy nozzle cleaning and maintenance. Does not have motors, impeller shafts or belts. Said to feature a quieter, more stable solder wave than impeller motor types.
Tamura H.A. Machinery Inc., tamura-ha.com
Booth 1251
Model 1800A adds a motor-controlled board support table to facilitate automated, hands-free site scavenging on the Summit 1800 rework system. Supports automated alignment and reduces operator intervention. Options include component print station, cooling boost, sliding board support, 17" LCD monitor and 22 x 30" board size upgrade.
Features standard board handling of 18 x 22", placement accuracy of 0.0005 to 0.001" and magnification capability from 2 to 40X.
VJ Electronix Inc., vjelectronix.com
Has Windows-based SierraMate 7.0 software with Advanced Auto Profile for rules-based process development.
Automatic prism shuttle facilitates accurate and repeatable component alignment. Simultaneously looks up at the component and down at the board, providing a composite alignment view. Digital split image allows the operator to see bumps, leads or pads of large devices at a high magnification with a click on the GUI.
Incorporates independent, programmable motions for pick-up and top heater height. Pick-up motion allows placement force control and zero force removal. Component pick-up tube features 360° Theta control and automatic alignment height. Programmable heater position with automatic height sensing allows the nozzle to gasket the board with minimal force, or to be located at a pre-set gap above the board.
Features standard board handling of 18 x 22", placement accuracy of 0.0005 to 0.001" and magnification capability from 2 to 40X.
VJ Electronix Inc., vjelectronix.com
Booth 2265
