A new line of Pb-free no-clean solder pastes was introduced by the Contact Materials Division (CMD) of Heraeus during Apex last week. The F640 Series is said to promote wetting and minimize defects with tin/silver/copper alloy soldering.
With a wide process window, the paste is able to compensate for process variations in printing, component placement and soldering. Provide wetting on a variety of surfaces and finishes, and leave behind a clear residue. Offer minimal slumping and exceptional print-to-print consistency, can also be reflowed in air or nitrogen environments.
Heraeus, 4cmd.com
S-50 System 10:1 ratio cartridges are available for the Mixpac Hand-Held Cartridge Dispensing System. The system consists of a manual dispensing gun, a cartridge and a static mixer.
Cartridges are used to dispense two-component adhesives in a 10:1 volumetric ratio. The total capacity of each cartridge is 50 ml and they are available in either polypropylene or polyester. Offers precise ratio control and reduction in hazardous material waste.
ConProTec Inc., conprotec.com
Cartridges are used to dispense two-component adhesives in a 10:1 volumetric ratio. The total capacity of each cartridge is 50 ml and they are available in either polypropylene or polyester. Offers precise ratio control and reduction in hazardous material waste.
ConProTec Inc., conprotec.com
Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high-volume stencil printing applications with CSP lead pitches of 0.5 mm and 0.4 mm. As lead-free manufacturing becomes the norm, the ability to reliably process finer pitched devices within Pb-free parameters will be vital.
Is formulated to deliver low voiding in BGA joints. Said to offer performance over a range of reflow profiles and long abandon time capabilities, the paste gives assemblers the flexibility they require when running lead-free processes. The material provides tack force to resist component movement during high-speed placement, allows a fast print speed with low print pressure to minimize board warpage and offers humidity resistance. Soldering activity on a range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper enables lead-free production.
Produces safe residues, which eliminate the need for cleaning, and its post-reflow low-color residues simplify visual inspection .
Classified as ROL0 to ANSI/J-STD-004.
Henkel, electronics.henkel.com
Is formulated to deliver low voiding in BGA joints. Said to offer performance over a range of reflow profiles and long abandon time capabilities, the paste gives assemblers the flexibility they require when running lead-free processes. The material provides tack force to resist component movement during high-speed placement, allows a fast print speed with low print pressure to minimize board warpage and offers humidity resistance. Soldering activity on a range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper enables lead-free production.
Produces safe residues, which eliminate the need for cleaning, and its post-reflow low-color residues simplify visual inspection .
Classified as ROL0 to ANSI/J-STD-004.
Henkel, electronics.henkel.com
The latest revision of Cadstar Express is the easy to use free Web download of the desktop PCB design solution, Cadstar. This fully functional version of Cadstar 8.0 features tools for design from schematics to manufacture, with a limit of 300 pins and 50 components.
Improved functionality includes developments in schematic design and library management,
lead-free component technology and jumpers.
Users can also view samples of the 140,000 component on-line component library, Cadstar Exchange. This Web-based source currently contains components from 17 manufacturers including Intel, National Semiconductors, Philips, ST Microelectronics and Xilinx and is part of the maintenance
agreement.
Improved functionality includes developments in schematic design and library management,
lead-free component technology and jumpers.
Users can also view samples of the 140,000 component on-line component library, Cadstar Exchange. This Web-based source currently contains components from 17 manufacturers including Intel, National Semiconductors, Philips, ST Microelectronics and Xilinx and is part of the maintenance
agreement.
Includes a Do-It-Yourself manual in PDF, with tutorials and video files to illustrate key features.
To download, visit cadstarworld.com/express.
To download, visit cadstarworld.com/express.
Zuken, zuken.com
Series 1522 Inflow Dust Containment Cabinets are available in a variety of sizes and styles, with a painted steel finish compatible with typical cleanroom environments. They provide an effective solution for mailroom protection, hazardous materials and biosafety applications.
Feature an acrylic hood for durability and long life, with minimal required maintenance. Custom options are available upon request.
The system draws air into wall-mounted filters where it is filtered and
discharged back into the workspace. The HEPA system consists of two parts:
the absolute HEPA filter and a flexible duct to form a modular component.
HEPA filters meet Mil Standard 282 and are tested for leakage for 99.99% removal of all particulate contaminants greater than 0.3 micron.
Before the HEPA filter there are two stages of prefiltering, the second of
which can be an optional charcoal filter. The prefilter is made of
disposable, non-woven framed fiberglass media, with a nominal efficiency of
40%.
Clean Air Products, cleanairproducts.com
Feature an acrylic hood for durability and long life, with minimal required maintenance. Custom options are available upon request.
The system draws air into wall-mounted filters where it is filtered and
discharged back into the workspace. The HEPA system consists of two parts:
the absolute HEPA filter and a flexible duct to form a modular component.
HEPA filters meet Mil Standard 282 and are tested for leakage for 99.99% removal of all particulate contaminants greater than 0.3 micron.
Before the HEPA filter there are two stages of prefiltering, the second of
which can be an optional charcoal filter. The prefilter is made of
disposable, non-woven framed fiberglass media, with a nominal efficiency of
40%.
Clean Air Products, cleanairproducts.com
Articulation LLC, developer of the Reflower prototype SMT reflow oven controller, has released a new software package for managing reflow oven temperature profiles. Reflower PC application allows users to maintain an unlimited number of temperature profiles on their computer's hard disk through a series of tabbed dialogs. The application also allows the user to control oven through a point and click user interface.
Controls a standard countertop convection oven to perform prototype and small batch surface-mount solder reflowing operations. Can control ovens rated up to 1800W or 15A and comes with a 36" bare junction thermocouple, an RS232 cable for connection to a PC and the Reflower PC application.
Using the TempTell Reflower and the techniques outlined at
http://articulationllc.home.comcast.net/sm0402.htm , SMT is now available to hobbyists and small hardware development shops.
Articulation LLC, articulationllc.com
Controls a standard countertop convection oven to perform prototype and small batch surface-mount solder reflowing operations. Can control ovens rated up to 1800W or 15A and comes with a 36" bare junction thermocouple, an RS232 cable for connection to a PC and the Reflower PC application.
Using the TempTell Reflower and the techniques outlined at
http://articulationllc.home.comcast.net/sm0402.htm , SMT is now available to hobbyists and small hardware development shops.
Articulation LLC, articulationllc.com
Press Releases
- Q Source Strengthens Partnership with PACE Worldwide, Showcasing Advanced Soldering and Rework Solutions
- Kimball Electronics Releases 2024 Annual Sustainability Report; Richard Phillips Comments
- Hon Hai Technology Group (Foxconn) Completes Independent Audits At 9 More Manufacturing Sites
- ROCKA Solutions Mexico Partners with MIRTEC to Offer Leading Inspection Systems Exclusively in Mexico, Brazil and Argentina; Brian D’Amico and Rodrigo Cacho Comment