Loctite 3549 is a high flow underfill formulated for use with advanced CSP and BGA packages. Is designed to quickly fill the space beneath the CSP and BGA packages and cures rapidly at low temperature, which minimizes thermal stress to other components on the PCB and allows for in-line curing.
When fully cured, it reportedly delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4 and 0.5 mm Pb-free devices has shown that it offers five times the reliability over non-underfilled Pb-free devices.
Compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs. Has long pot life (14 days at room temp. and up to 7 days at processing temp.) and simple, standard refrigeration temperature storage.
Henkel, electronics.henkel.com
When fully cured, it reportedly delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4 and 0.5 mm Pb-free devices has shown that it offers five times the reliability over non-underfilled Pb-free devices.
Compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs. Has long pot life (14 days at room temp. and up to 7 days at processing temp.) and simple, standard refrigeration temperature storage.
Henkel, electronics.henkel.com
Version 2.5 of the Environmental Material Aggregation and Reporting System (EMARS) completely supports the IPC-1752 Material Declarations standard for the RoHS directive.
"The IPC-1752 materials directive is a critical industry standard to help control the data formats and forms involved in complying with RoHS," said German Avila, product manager for environmental products. "Thoroughly understanding IPC-1752 is extremely important for OEMs and suppliers trying to streamline their processes and reduce the cost and burden of exchanging data related to RoHS. Our new version of EMARS has been designed to support IPC-1752 and ease the pain of gathering, organizing and storing the mass amounts of data involved in compliance."
EMARS is an off-the-shelf solution that can analyze and track compliance at the substance, material, part and product level as well as efficiently manage the data collection and reporting process. Version 2.5 fully supports the IPC-1752 Class 1 through Class 6 forms, providing the ability to generate IPC-1752 requests and reports, and validating and loading IPC-1752 reports.
Synapsis Technology, synapsistech.com
"The IPC-1752 materials directive is a critical industry standard to help control the data formats and forms involved in complying with RoHS," said German Avila, product manager for environmental products. "Thoroughly understanding IPC-1752 is extremely important for OEMs and suppliers trying to streamline their processes and reduce the cost and burden of exchanging data related to RoHS. Our new version of EMARS has been designed to support IPC-1752 and ease the pain of gathering, organizing and storing the mass amounts of data involved in compliance."
EMARS is an off-the-shelf solution that can analyze and track compliance at the substance, material, part and product level as well as efficiently manage the data collection and reporting process. Version 2.5 fully supports the IPC-1752 Class 1 through Class 6 forms, providing the ability to generate IPC-1752 requests and reports, and validating and loading IPC-1752 reports.
Synapsis Technology, synapsistech.com
MicroLine 350Ci laser system offers stress-free depaneling of assembled PCBs. Uses a laser technology featuring higher cutting speeds then mechanical depaneling methods and requires no expensive artwork related tooling.
The laser technique leaves no residual dust on the PCBs does not damage sensitive components. Cuts any contour while maintaining a higher precision than mechanical routing systems. Non-contact cutting with a laser means no mechanical stress for both the board and its components. Using a very small beam diameter allows components to be placed close to the edge of the board for optimum utilization of the panel.
The compact system can be integrated in an existing SMD production line, or used as a stand-alone work station. The laser works straight off of CAD data. The cutting speed is reportedly superior to most mechanical methods, especially when using thinner board materials. A dual fiducial camera system provides instant fiducial recognition over the entire working area.
The laser technique leaves no residual dust on the PCBs does not damage sensitive components. Cuts any contour while maintaining a higher precision than mechanical routing systems. Non-contact cutting with a laser means no mechanical stress for both the board and its components. Using a very small beam diameter allows components to be placed close to the edge of the board for optimum utilization of the panel.
The compact system can be integrated in an existing SMD production line, or used as a stand-alone work station. The laser works straight off of CAD data. The cutting speed is reportedly superior to most mechanical methods, especially when using thinner board materials. A dual fiducial camera system provides instant fiducial recognition over the entire working area.
LPKF Laser & Electronics, lpkfusa.com
A new line of Pb-free no-clean solder pastes was introduced by the Contact Materials Division (CMD) of Heraeus during Apex last week. The F640 Series is said to promote wetting and minimize defects with tin/silver/copper alloy soldering.
With a wide process window, the paste is able to compensate for process variations in printing, component placement and soldering. Provide wetting on a variety of surfaces and finishes, and leave behind a clear residue. Offer minimal slumping and exceptional print-to-print consistency, can also be reflowed in air or nitrogen environments.
Heraeus, 4cmd.com
S-50 System 10:1 ratio cartridges are available for the Mixpac Hand-Held Cartridge Dispensing System. The system consists of a manual dispensing gun, a cartridge and a static mixer.
Cartridges are used to dispense two-component adhesives in a 10:1 volumetric ratio. The total capacity of each cartridge is 50 ml and they are available in either polypropylene or polyester. Offers precise ratio control and reduction in hazardous material waste.
ConProTec Inc., conprotec.com
Cartridges are used to dispense two-component adhesives in a 10:1 volumetric ratio. The total capacity of each cartridge is 50 ml and they are available in either polypropylene or polyester. Offers precise ratio control and reduction in hazardous material waste.
ConProTec Inc., conprotec.com
Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high-volume stencil printing applications with CSP lead pitches of 0.5 mm and 0.4 mm. As lead-free manufacturing becomes the norm, the ability to reliably process finer pitched devices within Pb-free parameters will be vital.
Is formulated to deliver low voiding in BGA joints. Said to offer performance over a range of reflow profiles and long abandon time capabilities, the paste gives assemblers the flexibility they require when running lead-free processes. The material provides tack force to resist component movement during high-speed placement, allows a fast print speed with low print pressure to minimize board warpage and offers humidity resistance. Soldering activity on a range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper enables lead-free production.
Produces safe residues, which eliminate the need for cleaning, and its post-reflow low-color residues simplify visual inspection .
Classified as ROL0 to ANSI/J-STD-004.
Henkel, electronics.henkel.com
Is formulated to deliver low voiding in BGA joints. Said to offer performance over a range of reflow profiles and long abandon time capabilities, the paste gives assemblers the flexibility they require when running lead-free processes. The material provides tack force to resist component movement during high-speed placement, allows a fast print speed with low print pressure to minimize board warpage and offers humidity resistance. Soldering activity on a range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper enables lead-free production.
Produces safe residues, which eliminate the need for cleaning, and its post-reflow low-color residues simplify visual inspection .
Classified as ROL0 to ANSI/J-STD-004.
Henkel, electronics.henkel.com
Press Releases
- Student Engagement and Involvement is a Major Focus of the Upcoming 75th Annual IEEE Electronic Components and Technology Conference
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