Speedprint Technology Ltd., a division of Blakell Europlacer Group, is offering Novatec’s VacuNest Shape Memory Tool on its printer platforms through an OEM supply agreement.
The shape memory tool combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules. Simply place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. The shape will be held until the vacuum is released, and the modules return to their original form awaiting the next version of board.
Will not damage a component due to the pin/printing pressure, support forces are evenly spread over the entire board, provides firm and precise support and can be simply reset when a board version changes.
Said to guarantee board flatness; is not sensitive to solder paste contamination.
VacuNest, www.novatec-eap.com
Speedprint, www.speedprint-tech.com
The shape memory tool combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules. Simply place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. The shape will be held until the vacuum is released, and the modules return to their original form awaiting the next version of board.
Will not damage a component due to the pin/printing pressure, support forces are evenly spread over the entire board, provides firm and precise support and can be simply reset when a board version changes.
Eliminates the cost of a custom tooling plate as well as pin tooling. Can handle high-density boards with ease and requires little to no lead-time.
Said to guarantee board flatness; is not sensitive to solder paste contamination.
VacuNest, www.novatec-eap.com
Speedprint, www.speedprint-tech.com
Wickgun Desoldering Braid Dispenser is a hand-held tool that allows users to dispense, position and cut-off braid using one hand while holding a soldering iron in the other. Features a braid with no clean flux (for use with Pb-free solder), is said to eliminate handling braid, reduces waste and speeds desoldering.
Available in four braid sizes from 0.035” to 0.110” W, the replaceable cassettes are preloaded with 15 ft. of braid and are easy to change. Braid is advanced and retracted using a thumbwheel can be cut-off by squeezing the trigger.
Xuron Corp., xuron.com
Available in four braid sizes from 0.035” to 0.110” W, the replaceable cassettes are preloaded with 15 ft. of braid and are easy to change. Braid is advanced and retracted using a thumbwheel can be cut-off by squeezing the trigger.
Xuron Corp., xuron.com
A hand-held X-Ray Fluorescence (XRF) NITON analyzer is equipped with a helium purging mechanism for direct analysis of “light elements.” The analyzers provide immediate chemical analysis of alloys, electronic materials, coatings, plastics and more.
NITON XLt 898He system has the added ability to quantitatively analyze the elements Mg, Al, Si, and P in most alloy materials. Now, field sorters and inspectors are capable of light element sorting and light alloy chemistries, both non-destructively and on-site.
Thousands of added alloy grades can now be determined with the single hand-held, non-destructive alloy analyzer. Trade-ins are available for current NITON alloy analyzer users.
For recycle applications, alloy sorters can determine directly aluminum alloys, Al in titanium alloys and Al/Si in bronzes. For industrial applications, the non-destructive nature of the XRF technique allows testing of finished or sensitive parts.
NITON XLt 898He system has the added ability to quantitatively analyze the elements Mg, Al, Si, and P in most alloy materials. Now, field sorters and inspectors are capable of light element sorting and light alloy chemistries, both non-destructively and on-site.
Thousands of added alloy grades can now be determined with the single hand-held, non-destructive alloy analyzer. Trade-ins are available for current NITON alloy analyzer users.
For recycle applications, alloy sorters can determine directly aluminum alloys, Al in titanium alloys and Al/Si in bronzes. For industrial applications, the non-destructive nature of the XRF technique allows testing of finished or sensitive parts.
Thermo Electron Corp., thermo.com
SCC-700 Cooling Conveyor station provides a quick PCB cool down that occupies a minimal amount of floor space.
Designed to quickly cool down PCBs after reflow or high-temp curing, allowing operators to hand remove for final disposition.
Is 1000 mm long; incorporates cooling fans and a small refrigeration unit. The cooling temperature output may be selected through a digital readout panel and the conveyor transports the PCB or pallet on 3 mm edge contact.
A vertical lift door seals in the cold air, but provides easy access.
Promation, Pro-mation-Inc.com
Designed to quickly cool down PCBs after reflow or high-temp curing, allowing operators to hand remove for final disposition.
Is 1000 mm long; incorporates cooling fans and a small refrigeration unit. The cooling temperature output may be selected through a digital readout panel and the conveyor transports the PCB or pallet on 3 mm edge contact.
A vertical lift door seals in the cold air, but provides easy access.
Promation, Pro-mation-Inc.com
DDf Ultra can feed a range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine.
Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr.
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”
Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr.
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”
Hover-Davis, hoverdavis.com
ETCO Mighty-T Press is a bench-top semi-automatic press and wire terminal applicator for low volume users that replaces hand crimping. Features a rigid one-piece cast iron frame, employs a 40 mm stroke with 4,450 lbs. of crimping force and includes a footswitch, safety interlock and reel arm. Wire terminal applicator has a two-piece anvil to crimp wire and insulation ear sections in a single stroke. Eliminates hand crimping and has an open architecture for easy feed adjustment and tooling changes.
Suited for up to 5,000 terminations/hr., depending upon the terminal and wire combination, accepts applicator feeds from the right, left or rear and has a 7.9 x 23 x 11.8” footprint. Accepts virtually all mini-style applicators with a standard “T” style coupling. Can handle wire up to 9 AWG, terminals from 0.006” though 0.32” thick and a variety of tooling.
ETCO Inc., etco.com
Suited for up to 5,000 terminations/hr., depending upon the terminal and wire combination, accepts applicator feeds from the right, left or rear and has a 7.9 x 23 x 11.8” footprint. Accepts virtually all mini-style applicators with a standard “T” style coupling. Can handle wire up to 9 AWG, terminals from 0.006” though 0.32” thick and a variety of tooling.
ETCO Inc., etco.com
