VISULA 8 features three core areas of improvement: layout, library tools and CAM tools. Layout developments include enhancements to functionality associated with the use of starpoint components, which can now be simply added to a design. Thermal relief on vias has been extended to allow relief at 45-degrees as well as the existing 90-degree setting. Other layout features include allowing the user to display areas of different types using different colors, introduction of a 'necked width violations' report, identification of component pads that violate via keep-out areas supported by batch and interactive checking and the option of coloring trunk* items within the design.
Users can now print using the standard Windows printing dialog in the Databook Designer, in addition to the PostScript printing option. Tabular display option makes adding gate suffixes to elements within the Library Editor much simpler. Search results from the Library Searcher can also be output in CSV format.
Use of CAM tools allows the employment of standard page sizes for printing PDF outputs, and the user can specify the default plot file extension for post-processing output files in their MDF database.
Version 8 is free of charge for all current customers with a maintenance agreement.
Users can now print using the standard Windows printing dialog in the Databook Designer, in addition to the PostScript printing option. Tabular display option makes adding gate suffixes to elements within the Library Editor much simpler. Search results from the Library Searcher can also be output in CSV format.
Use of CAM tools allows the employment of standard page sizes for printing PDF outputs, and the user can specify the default plot file extension for post-processing output files in their MDF database.
Version 8 is free of charge for all current customers with a maintenance agreement.
Zuken, www.zuken.com
TherMoire PS200 lab tool is the result of customer feedback and changing industry needs. The new JEDEC standard for temperature-dependent warpage measurement of packages (JESD22B112) now requires faster heating and cooling rates, and this tool delivers improvements in both. Allows the user to more precisely replicate a temperature profile, while taking real-time flatness measurements. New ergonomic design and better user interface improve ease-of-use.
LineMoire PS16 is a room-temperature flatness measurement system, designed for both QA/QC and high-volume production settings. Capable of both package and PCB flatness measurements. Can measure global and local area warpage with a 1 sec. data acquisition time.
AkroMetrix, akrometrix.com
Booth 1451
AERIAL L4 is the latest addition to Seica's Pilot line, and is for customers who need to implement test strategies for prototype verification, pre-screen for manufacturing defects,and fault diagnostics after functional maintenance tests.
Being based on the VIVA Integrated Platform (VIP) it integrates the core VIP hardware and software, and is fully compatible with the other Seica test products including the PILOT Flying Probe, STRATEGY In-circuit and VALID Functional testers.
Uses four independent, mobile test probes to carry out tests on both sides of the UUT (two on each side). The vertical board clamping system is said to eliminate vibration of the board under test and allows a compact footprint. Offers a board test area of 24 x 24 in. (610 x 610 mm).
SEICA Inc., seica.com
Booth 2257
Being based on the VIVA Integrated Platform (VIP) it integrates the core VIP hardware and software, and is fully compatible with the other Seica test products including the PILOT Flying Probe, STRATEGY In-circuit and VALID Functional testers.
Uses four independent, mobile test probes to carry out tests on both sides of the UUT (two on each side). The vertical board clamping system is said to eliminate vibration of the board under test and allows a compact footprint. Offers a board test area of 24 x 24 in. (610 x 610 mm).
SEICA Inc., seica.com
Booth 2257
ZESTRON America will showcase its latest Pb-free cleaning services during Apex. The company will also feature recent advances in PCB, stencil/misprint and maintenance cleaning applications.
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the conference’s technical sessions, Zestron’s Application Technology Manager, Umut Tosun, will discuss “Cleaning Lead-Free Prior to Conformal Coating? Risks and Implications.” The presentation will take place on Wed., Feb. 8 at 1:30: Quality Reliability and Testing.
Zestron America, zestronusa.com
Booth 1229
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the conference’s technical sessions, Zestron’s Application Technology Manager, Umut Tosun, will discuss “Cleaning Lead-Free Prior to Conformal Coating? Risks and Implications.” The presentation will take place on Wed., Feb. 8 at 1:30: Quality Reliability and Testing.
Zestron America, zestronusa.com
Booth 1229
Multi-Seals offers a free engineering sample kit of Uni-form epoxy preforms. Includes a variety of epoxy preform configurations along with an information pack. Free evaluation samples in specified dimensions and epoxy systems are also available for specific applications. The preforms are an alternative to liquid epoxy for high-volume epoxy sealing applications.
Preforms are one-part epoxy resins that are solid at room temperature. When heated, they melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings and other contaminants. Close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst and consistent viscosity from beginning to end of batch ensure uniform results.
Can be dispensed at 200 to 600 parts/min. with little or no operator training. Said to eliminate pot-life concerns and cleanup procedures.
Multi-Seals Inc., multi-seals.com
Preforms are one-part epoxy resins that are solid at room temperature. When heated, they melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings and other contaminants. Close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst and consistent viscosity from beginning to end of batch ensure uniform results.
Can be dispensed at 200 to 600 parts/min. with little or no operator training. Said to eliminate pot-life concerns and cleanup procedures.
Multi-Seals Inc., multi-seals.com
LeadHound RoHS/Pb-Free Verification System will verify Pb-free or leaded components, sub-assemblies, PCBs and other items in as little as 15 sec.
Using micro-focus x-ray fluorescence (XRF), can detect the presence of lead, cadmium, mercury, chromium and bromine, as well as other elements, in a safe working environment and provide the percentage of each element found in a tested item. This enables shops to determine if an item complies with RoHS/WEEE directives or military and avionics specifications.
Can test several items in one session and generate a report for most requirements in 30 sec. Generates a report after each test that can be printed or stored as a file to meet applicable documentation needs.
In addition to testing boards and components, can detect lead in BGA spheres and solder paste in pots.
Can identify which items pass/fail the test and take appropriate action for a facility’s production requirements. In-depth reporting capabilities can tell the percentages or ppm of specified elements in each item.
Runs on a stand-alone, Windows XP-based computer. The x-ray system can be standardized at lunch or dinner breaks midway through production shifts. Power-up automatically initiates a standardization which takes approximately 3 min.
HEPCO, hepcoblue.com
Booth 1396
Booth 1396
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