K2000 motorized circular blade depanelizer separates prescored PCBs without dust or scrap. Available with XY table for improved board handling. PCB panels are singulated by passing the scoreline between two circular blades. Front and back blade guards assure operator safety. An adjustable upper front blade guide assures that only the scoreline can be passed to the cutting area. When using the XY table, the operator places the PCB onto the guide rails of the table and brings the scoreline between the top and bottom blade guards to pass it to the cutting area. The motor driven lower blade of the K2000 will pull the PCB through to separate the panels. Two cutting speeds are available for optimal PCB separation. Singulates panels up to 12.5 in. Blades are made of tool steel and can be re-sharpened. The tooling plate for Simm cards allows exact placement of the PCB matrix onto the moveable base. The plate is positioned on the right side for singulating the carrier strip on the left of the panels and then moved to the other side to singulate the remaining carrier strip. Adjustable end stops for the tooling plate allow for positioning of the scoreline with the circular blades. Tooling pins and support rails for either side of the panel provide safe placement and support of the SIMM cards. The rails can be adjusted to insure that there is no contact with the components on the cards. FKN Systek, Fknsystek.com
Portable Leak Finder is a troubleshooting tool to find small leaks in chambers, connections or parts. Is a rechargeable container for helium gas with a spray nozzle similar to an aerosol can. Helium is sprayed onto the suspected leak location of a part or chamber and can then be observed on a mass spectrometer system that continuously measures the helium concentration in the part while under vacuum. A leak is immediately identified if helium is drawn into the part or chamber by the vacuum inside. The mass spectrometer responds to concentration change caused by new helium being drawn into the part or chamber. The timing of the response corresponds with the location of the helium being sprayed at the time of the response to accurately indicate the leak location. Kit includes a recharge fitting and comes in a protective, custom-made carrying case. Valves, pressure gage and pressure relief valve allow safe recharging of the canister. Cincinnati Test Systems, cincinnati-test.com
Scapa 650 is a high-temperature masking tape for low static protection of gold plated finger tabs, assembly holes and components during flux, preheat and soldering processes. Also designed for high-temperature industrial masking in clean room environments.
Consists of a specially treated paper, single coated with a silicone pressure sensitive adhesive. The masking tape reportedly delievers low electrostatic discharge at unwind, eliminating PCB degradation. After processing, the silicone adhesive removes cleanly and easily from the surface without leaving adhesive residue.
During hot air leveling and wave soldering, it provides protection against chemical, solvents, solder and rinse water. Has a wide operating temperature range.
Custom wave solder fixtures are manufactured using the same Gerber and drill files which describe the board, to speed production and improve performance.
Datum Wave Solder Fixtures are designed using customer supplied Gerber and drill files, which allows precise routing for component bottom-side pocketing and permits thicker, stiffer and more stable fixtures. With stepped-down openings on the solder side to prevent turbulence and component skipping, the fixtures provide a positive-locking clamp system to secure the board and for complete solder coverage.
Virtually eliminate the need for glue dotting, feature precise routing for component depth to prevent solder flooding and facilitate trouble shooting. Accommodate densely populated boards with tall secondary side components, can solder through-hole components directly adjacent to SMT devices. Can be supplied for boards up to 24” W.
SynTECH-LF RoHS-compliant, Pb-free, no-clean solder paste is made with 100% synthetic poly adduct components. Compatible with tin/silver and tin/silver/copper alloys, with Pb content <200ppm. Reportedly delivers high hourly throughput with less scrap and rework, lot-to-lot and stencil printing consistency, wide process windows (12-hour stencil life, 12-16 hour tack) and 90% metal loading. Good for ICT, is compatible with OSPs without compromising SIR values. Is non-conductive and non-corrosive, with post reflow residue that acts as a protective coating and can be removed using t cleaners. Available in jars, cartridges, syringes and cassettes.
The compact X-100 reflow oven incorporates Phase Convection technology to offer flexibility and low cost of ownership. Was developed to provide enhanced quality control, enabling individual thermal profiling on a board-by-board basis and thermal performance within the confines of Pb-free soldering.
Provides enhanced temperature uniformity and lower nitrogen usage and power consumption. Unit length is 3,350 mm, uses SPC control with pyrometers. Features a self-cleaning capability and is environmentally friendly.
X-600 Phase Convection system features a hermetically sealed loading system by which boards are loaded into one of the three levels. Each phase unit has a re-circulating convection system in which the temperature is regulated by a pyrometer that measures the exact temperature of the board, not the surrounding air. These measurements can be monitored by an on-system SPC data collection tool for traceability and closed loop control. eXelsius, a ViTechnology brand, www.vitechnology.com