OmniFlex 10 Reflow Oven is designed to optimize operating efficiencies, reduce maintenance intervals, and lower life-cycle costs. Said to feature advanced heating and cooling transfer technologies, energy efficient design concepts and reduced maintenance requirements. Up to 50% less power and 35% less nitrogen is required than comparable platforms– due to new designs and features including standard, variable-speed closed-loop blower control, power limiting, balanced gas flow and a dual chamber heating design.
Process Width: 508 mm (20"); Heated Length: 3810 mm (148"); Cooling Length: 1285 mm (50.5"); and Maximum Operating Temperature: 350°C (662°F).
Electrovert VectraElite wave soldering system features a host of improvements. Combines UltraFill nozzles and the upper High Velocity Convection pre-heat (HVC) module. The ServoJet spray fluxer is coupled with the Performa and Opti-Flux II. Has a new roll-out solder pot design, and additional enhancements.
The μCT-FOX 2D/3D x-ray inspection system now offers hardware-based modular high-end volumetric isotropic rendering. Combines high-resolution 2-D x-ray technology with 3-D computed tomography techniques for inspection and analysis of complex electronic devices. Using dedicated hardware processors, the added hardware and software capability enhances defect detection, ideal for complex electromechanical component inspection applications. A hardware and software based CT solution represents the next-generation of CT user interface. Has improved volumetric isotropic rendering, volumes can be produced that reveal the depth value required for a full 3-D analysis. Modular CT package can gather data sets from 2-D x-ray inspection systems and process them through a CT reconstruction engine. The resulting high-resolution CT images can be instantaneously uploaded to the internet, in real-time, using proprietary iView technology developed by TeraRecon. This feature allows F/A service labs to transmit CT imagery instantly using a secure internet connection. The software is integrated into Feinfocus GUI version 2.2, allowing users to save digital images in JPG, TIF, or BMP formats.
Version 5.0 of CXInsight for Electronics is a powerful project content management system that allows internal and external collaboration between project members across OEM and manufacturing sites. The release delivers functionality for flexible server-to-server connectivity across the electronics supply chain, based upon a peer-to-peer structure.
With server-to-server connectivity and appropriate authorisation, server owners can connect to other servers and work with their own fixed clients on all linked servers across different projects and through different firewalls. This allows partners to access data, track changes and perform required tasks while maintaining data integrity. A ‘two phase commit’ protocol ensures that data is intact and correct at all times, at all locations.
Jan Keijzer, managing director, said, “For true freedom in supply chain collaboration, server-to-server connectivity allows for multiple connections between the ‘owner’ of the data and all its external partners – in a secure and controlled environment, without compromise to rights control and management. It also allows customers to establish new collaborations with ease and flexibility, unlike in a client-server configuration. Since the launch of CXInsight, we are making good business in the OEM sector, where this added functionality is certainly required.”
JTAG chain debugger helps reduce debug and test times for engineers designing and testing complex PCBs. Features a range of debug options which allow designers to trace signals around the board and immediately find the location of any problems within the JTAG chain. Engineers can get boards up and running quickly, rapidly diagnose faults and speed up the development process.
“With the addition of the chain debugger to the XJTAG system, engineers now have an ‘out-of-the-box’ solution for debugging and testing boards populated with JTAG devices,” said Dominic Plunkett, CTO. “Design engineers can now debug and test their printed circuits in hours as opposed to days/weeks with other competitive systems.”
In addition to the chain debugger, the XJTAG Development System has other new features to speed up board design and prototype testing. The connection test now includes built-in testing of pull-up and pull-down resistors, along with more precise fault detection. Within XJAnalyser, BSDL file auto-detection has been improved and the library of reusable JTAG scripts has been expanded. It is quicker to set up non-JTAG devices following enhancements to the Devscript utility for XJEase.
The Development System meets the need for testing tightly-packed PCBs populated with BG) and chip scale devices, which cannot be tested by traditional methods.
Designed to cut the cost and shorten the development cycle of electronic products, can test JTAG or non-JTAG devices. Can test a high proportion of a circuit including BGA and chip scale devices, SDRAMs, Ethernet controllers, video interfaces, Flash memories, FPGAs, microprocessors and other devices. Enables In-System Programming of FPGAs, CPLDs and Flash memories.
Data I/O announced support for the Renesas R8C/11 “Tiny” series of microcontrollers beginning with support for the R5F211 on Data I/O’s FlashCore programming systems.
The FlashCore family includes the FlashPAK desktop programmer, the ProLine RoadRunner for inline automated handling and programming (attaching directly to the SMT feeder) and the PS offline automated handler and programming systems.
The microcontrollers are targeted at multiple applications including automotive products, consumer products, PC/networking and industrial environments. Based on the M16C architecture, the series is small in size but optimized for embedded systems applications.
High Energy Pulse Discharge capacitors reportedly set new standards of low equivalent series inductance and high pulse discharge current. ESLs of 5 nanoHenrys and pulse discharge currents of 100,000 Amps have been achieved for a 100 KV 4.0 nanoFarad unit.
The capacitors combine the oldest known inorganic dielectric, MICA, with a proprietary manufacturing process based on low-out gassing PCB technology used at Fermi National Accelerator Laboratory.
Advantages include completely solid-state construction with no sealed containers to rupture or oil to leak. Form-factor is completely flexible; units can be custom made to thicknesses less than 1/2 cm for planar transmission line installation to a standard rectangular form factor to drop-in replace lower performance capacitors. Temperature rating is 150°C.
Available ranging from 0.1 to 100 nF and from 20,000 to 200,000 Volts.