LPKF MicroLine 350Ci laser system provides stress-free depaneling of assembled PCBs. Features higher cutting speeds for mechanical depaneling methods; requires no expensive tooling. The laser technique leaves no residual dust on the PCBs and will not damage sensitive components. Cuts any contours while maintaining higher precision than mechanical routing systems. The non-contact and stress-free cutting process, with a very small beam diameter, allows components to be placed close to the edge of the board for optimum utilization of the panel. Can be integrated in an existing SMD production line, or used as a stand-alone work station. LPKF Laser & Electronics, lpkf.de
The ProtoFlow oven, with Pb-free capability, reportedly has significant advantages over previous models. Has new PC control software package. Four user-positioned temperature sensors and a microprocessor controller regulate an even heat distribution over PCBs up to 9 x 12” (228 x 305 mm).
Several user programmable zones between preheating and final re-flow process reflow profiles up to 320°C.
The temperature profile measured by the four freely positioned sensors is displayed in real time on the PC. The reflow process can also be observed through a large glass window.
Ideal for prototyping, technology research and pre-production runs, it is a high tech, user friendly, reflow oven with many pre-programmed process profiles that can be selected via the LCD display and keypad. Intuitive software package enables process parameters to be changed, managed and archived on a PC.
AMS 2.0 Advanced Manufacturing Suite recognizes that fast, error-free NPI, minimization of changeovers and labor costs, and logistical efficiency demand that the component placement function is integrated into the overall production environment. Focuses on maximizing the performance of Assembléon machines and providing connectivity to other machines and software in the factory.
Moves many production preparation functions off-line, assures error-free set-ups and eliminates bottlenecks and component starvation.
Rapid NPI is achieved by decoupling preparation tasks from board production through off-line implementation of operations such as creation of vision files and data preparation, electrical verification of R, C and L values, and checking of the barcodes on reels. Provides a central database for programs and vision files.
Has production scheduling and line optimization functionality. Generates placement programs and feeder set-ups for every machine in the production line. A feeder viewer enables analysis and allows dynamic re-assignment of feeders.
Has off-line and on-line verification of set-ups, with an optional CLi interface using RFID technology for automatic set-up verification. Provides line control and data transfer with all machines in the line, with functionality including production line start/stop, upload/download of programs and component database information to the line, MIS data download and line warm-up. Can enable remote line monitoring and operation.
Data from set-up verification supports logistics by monitoring component usage and tracking inventory, issuing an alert on potential shortages to avert component starvation. Timely information to the operator indicates how many boards can still be produced or how many production hours remain with the available on-machine component inventory. The component tracking software also forms the foundation for the lot traceability system, which tracks complete production details on a real-time basis for possible future product recalls.
User interface matches the Assembléon machine user interface.
Threaded PEM ReelFast SMT spacers/nuts are available in more thread sizes to satisfy a range of application requirements. The fasteners are suited to space or stack PCBs or (as nuts) to mount boards or attach components. They install on PC boards in the same manner and at the same time as other surface-mount components prior to the automated reflow solder process.
Said to reduce the risk of damage to boards (and resulting scrap) that may occur when improperly installing fasteners with off-line equipment; reduce handling of loose parts; and speed assembly by eliminating secondary operations.
Threaded types are offered in sizes #2-56 through #8-32 and M2 through M4; thru-hole (non-threaded) types are available in sizes .116”, .143”, 3.6 mm and 4.2 mm. Lengths range from .065 to .375” and 2 to 10 mm. All types can be installed in boards as thin as .060” and all are RoHS compliant.
Tape-and-reel packaging for their automated installation conforms with industry standards and preferences for other surface-mount components. Each reel carries up to 1,500 parts, depending on fastener size. Fasteners are supplied with Kapton patch for vacuum pickup.
Feinfocus and Xradia announce a new 3-D x-ray inspection technology for the semiconductor packaging and medical device industries.
The microXCT defect detection system uses non-destructive 3-D tomography to view the complete structure of advanced packages. Unlike conventional x-ray imaging systems that lose resolution during tomography, this system scans packages in 3-D at full resolution. Multiple resolution modes allow users to switch from navigation at 30µm to high-resolution defect localization and characterization at 1 µm. Automated 3-D tomography features virtual cross-section capability, eliminating the need for sample preparation. Can image and construct a high-resolution 3-D Volumetric dataset with up to 1000 cross-sectional slices in 15min. Has a compact design.
LDCLDC-319 Micro-Probe is a micro size radiometric detector developed for medical and photobiological applications as well as general radiometry. Mmeasures 2.5 x 2.5 x 20 mm, enabling it to operate in remote limited space applications. In combination with a single or multi-channel optometer, irradiance from 1 nanowatt/cm² to 3 watts/cm² (limited exposures) over a 250 to 1100 nm spectral range can be measured and monitored. Stainless steel housing makes it suitable for medical use; includes a 2.3 x 5 mm RADIN diffuser for cosine corrected measurements. Certification of absolute calibration in watts/cm² at any or all wavelengths between 250 to 1100nm including relative spectral responsivity plot, is supplied for each detector.