LeadHound RoHS/Pb-Free Verification System will verify Pb-free or leaded components, sub-assemblies, PCBs and other items in as little as 15 sec.
Using micro-focus x-ray fluorescence (XRF), can detect the presence of lead, cadmium, mercury, chromium and bromine, as well as other elements, in a safe working environment and provide the percentage of each element found in a tested item. This enables shops to determine if an item complies with RoHS/WEEE directives or military and avionics specifications.
Can test several items in one session and generate a report for most requirements in 30 sec. Generates a report after each test that can be printed or stored as a file to meet applicable documentation needs.
In addition to testing boards and components, can detect lead in BGA spheres and solder paste in pots.
Can identify which items pass/fail the test and take appropriate action for a facility’s production requirements. In-depth reporting capabilities can tell the percentages or ppm of specified elements in each item.
Runs on a stand-alone, Windows XP-based computer. The x-ray system can be standardized at lunch or dinner breaks midway through production shifts. Power-up automatically initiates a standardization which takes approximately 3 min.
Pentaplex Inc.’s High Energy Pulse Discharge capacitors reportedly set new standards of Low Equivalent Series Inductance and High Pulse Discharge Current. ESLs as low as 5 nanoHenrys and pulse discharge currents of 100,000 Amps have been achieved for a 100 KV 4.0 nanoFarad unit.
This was achieved by combining the oldest known inorganic dielectric, MICA, with a new proprietary manufacturing process based upon Pentaplex’s low-out gassing PCB technology at Fermi National Accelerator Laboratory.
Additional advantages: completely solid-state construction with no sealed containers to rupture or oil to leak. Form-factor is completely flexible; units can be custom made to thicknesses less than 1/2 cm for planar transmission line installation to a standard rectangular form factor to drop-in replace lower performance capacitors.
Temperature rating to 150°C thanks to the inert nature of the specially processed mica dielectric.
Range from 0.1 to100 nF and from 20,000 to 200,000 Volts.
VIPx (Verifier Image Processor) is a PC/Windows XP-based Image Processor that delivers solder joint, package and PCB board level diagnostic software capabilities for visualization, precise measurement and user defined (pass or fail) analysis of SMT/BGA solder joints, PCBs, components, mechanical parts and electrical interconnections. Suitable for upgrading almost any x-ray inspection system, (manual or semi-automated) with PC-based functionality.
Application centric tool set focuses on key high-use features facilitated by wizard-driven diagnostic helpers. Algorithm-based inspection modules automatically find solder connections and perform measurement and defect detection by operator defined pass/fail analysis criteria. This collective image processing automatically finds failures at the solder joint level or selected regions of interest (voids, opens, shorts, ball size, ball shape, etc.) by color-coded indicators. Data collection and e measurement reporting further isolate, quantify and document faults for corrective action.
Features a number of modules for BGA analysis, SMT analysis, custom analysis, package analysis, PCB analysis or image enhancement.
An extension of the VIP software series offered on Verifier, Concept FX and refurbished Nicolet x-ray equipment products. Can be added to any camera-based x-ray inspection systems offered in the industry.
TSD-100 thermal shock chamber can meet the Mil-Std 883 test method 1010.7 with up to 22 lbs. of samples, such as plastic IC chips. Overall interior volume is 4 cu. ft. (100L), allowing testing of larger products and sub-assemblies, as well as large quantities of components like ICs.
Measurer 44” wide, resulting in a 40% smaller footprint than the ETS4-2CW. Overall power consumption (full-load amps) has been reduced by 60%. Have Copeland brand Scroll refrigeration compressors and touch-screen controller mounted on the door.
Has an interior of 28 x 16”.
STT, or Specimen Temperature Trigger, actively monitors the temperature of the product and only advances the program to the next step once the product has reached the desired temperature. It adjusts the soak period according to how much product is being tested.
Other features include: a flexible cabling tube (for monitoring or powering samples) that comes out the side, rather than a moving pipe that sticks out the top; a cool-down mode; an option for a window to check on the samples r.
Built at ESPEC’s headquarters in Japan and will be stocked at their Michigan factory along with replacement parts. A one-year parts and labor warranty is included.
B2 Benchtop automated optical inspection system for post-reflow PCBs is said to offer up to a three times improvement in inspection speed and improved fusion lighting to provide defect coverage. Features large board handling in a compact package, and complete software/board setup compatibility with the inline F1 series.
Operators typically take less than 30 min. to create a complete inspection program including solder joints. Uses a stand package library to simplify training and ensure program portability across manufacturing lines. Image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms to provide inspection coverage with a low false failure rate.
YESPC software provides real-time process monitoring. Continuously monitors inspection results, so users can immediately react to critical process events. In a networked environment, user defined charts and alarms can be accessed remotely via Web browsers. It can also provide email alerts.
Provides diagnostic and trending analysis of the manufacturing process.
Features a package of SPC charts, including X-bar range, X- moving range, histogram, Pareto analysis, scatter plot, Cp, CpK and other reports that provide real-time alarms for out-of-tolerance conditions. Compatible with YESTech AOI and YTX-5000 combined x-ray/vision system.