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W. L. Gore & Assoc. has released the GORE 100 Series Connectors, the newest addition to the GORE Blindmate/Push-on Connector family. The connectors are a high-density blindmate, microwave interconnect system offering performance through 100 GHz.

An extension of the SMP and SMPM connector families, the connectors were developed for increased packaging density, low mass and increased performance at higher frequencies. Blindmate interfaces said to be robust, durable and lightweight. A socket-to-socket bullet weighs less than 0.02 g. The connectors accommodate radial and axial misalignment with negligible VSWR change.

“The 100 Series Connector is 35% smaller than the current SMPM connectors,” said Paul Czikora, microwave connector technologist. “They offer increased electrical performance and reduced mechanical footprint, enabling designers to create thinner, lighter, smaller and more cost-effective TR modules, printed circuit boards and power dividers.”

W. L. Gore & Assoc. Inc., gore.com

CR-5000 Lightning was created to meet the demands of increased electronics design complexity resulting from the growth in density, miniaturization and multi-functionality of products.

The unique technology was born from collaboration between R&D teams in  Japan, the UK and Germany. Combines PCB design and simulation for fast, efficient design that enables users to solve high-speed design issues early in the process. 

Fully integrated design environment into CR-5000 Board Designer and CR-5000 System Designer ensures a fully adopted frontloading approach, allowing users to share information through a unified database within the high-speed design environment. In-depth analysis and what-if capabilities available throughout the design process enable engineers to explore design scenarios, trading off signal integrity parameters such as crosstalk, timing or EMI requirements, against mechanical and thermal constraints.

Offers:

Unified and shared design constraints, to eliminate complexities associated with separate design and provide control for activities such as circuit design, floor plans and board design;

Unification and communication between board design and system design with high-speed constraints and analysis;

Unified Analysis Engine Sharing;

and Frontloaded Verification.

Additional features include 'Trunking', H-Tree Routing and Interactive Lengthening.

Zuken, zuken.com

 

Total Parts Plus’ material content database has expanded its coverage for electronic and non-electronic components to more than 2.5 million part numbers. Data coverage includes full and partial content information, Restriction of Hazardous Substances (RoHS) compliancy flags, lead-free identification, exemption tracking, compliant alternates, tin whiskering data and reflow temperature.

Total Parts Plus has been collecting material content data since the announcement of the European Directives and has added RoHS compliancy flags to its material disclosure information to help manufacturers identify compliant replacements quickly.

Total Parts Plus, totalpartsplus.com

Libra Industries has introduced a lead-free transition services package to help manufacturers extend their internal engineering capacity to successfully comply with the RoHS directive. 

The package consists of in-house BOM review and conversion, and assistance with product redesign though Libra’s Design Service.  The company has partnered with Engent Inc. (Norcross, GA) to offer pilot assembly and reliability testing for new lead-free product designs. These services are available a la carte, or as a complete package.

Libra Industries, libraind.com

DEK will show its cost-saving, throughput-enhancing packaging technologies at  booth #7111 during Semicon West in San Francisco.

The company will demonstrate its backside wafer coating process, which is said to allow high throughput on a cost-effective mass imaging system and is capable of exceeding the +/- 12.5mm Total Thickness Variation (TTV) required by most wafer processing manufacturers.

Enabled by metal stencil and emulsion screen technologies, materials can be deposited accurately at high speeds, while achieving control over print thickness and ensuring uniformity. This process will be shown on the Micron-class Galaxy printer platform.

Other packaging applications on display will include: Thermal Interface Material (TIM) imaging and wafer bumping solutions enabled by ProFlow DirEKt Imaging technology; encapsulation that only requires one print stroke; singulation technology utilizing Virtual Panel Tooling (VPT); repeatable ball placement technology and high speed substrate bumping. 

DEK, dek.com

Samtec has announced the addition of RF cable connectors and cable assemblies to mate with its line of MMCX, MCX and SMA connectors.

SMA subminiature RF cable assemblies are available with straight and right angle terminations and feature high durability, compact semi-precision connectors. They use .085” (2.16 mm) and .141” (3.58 mm) semi-rigid cables and standard flexible cables, including double-shielded RG-316.

Mini connector cable assemblies are available as jacks and plugs and with a choice of straight or right angle terminations. These quick connect/disconnect style connectors are for applications with limited weight and space availability.

Micro-Mini cable plugs are also available with straight and right angle terminations, and feature quick connect/disconnect style snap-on mating.  A “Ganged” variation is also offered for terminating two, four, six or eight wires simultaneously.

 

Samtec Inc. , samtec.com                 

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