B1500A is a Windows-based semiconductor device analyzer that integrates capacitance versus voltage (CV) and current versus voltage (IV) measurements. Provides a complete, self-contained and expandable solution for parametric characterization and analysis capable of handling 65 nm lithographies and beyond. Has a 10-slot configuration and supports EasyEXPERT software.
Supports three SMU types:
o High-resolution SMU (HRSMU)
o Medium-power SMU (MPSMU)
o High-power SMU (HPSMU)
A multi-frequency capacitance measurement unit is also available, and a 4.2 amp ground unit is included.
Besides integrating CV measurement into the device analyzer mainframe, the MFCMU can measure capacitance at up to 5 MHz and provide ± 25 V of DC bias. The combination of the MFCMU and SMUs within the same instrument enables these measurement resources to be more tightly coupled. When joined using the SMU CMU Unify Unit, supports capacitance measurement with ± 100 V of DC bias.
SCUU connects the two SMUs and the MFCMU together and can switch between the measurement resources without using a separate external switching matrix. Software handles all of the IV-CV switching, compensation and return path issues.
Can be used for a range of characterization needs for semiconductor devices and emerging materials, including nanotechnology devices.
Agilent Technologies Inc., www.agilent.com
Visual 3-D Engineering is a computer-based visualization method allows customers to see engineered solutions in full 3-D, including their product or tool in the cart.
The manufacturing solution allows customers to work with Bliss' engineers to share ideas instead of having to build expensive prototypes. Virtually all interference problems faced in new product development are eliminated.
"It is like looking at a photograph of a product that has not even been built yet," said Ken L. Bliss, president and CEO.
Bliss Industries, blissindustries.com
HYDRA Speedmount 21k ER can hande component sizes from 0201 to15 x15 mm large ICs. New mounthead option facilitates multi-picking of a broader range of components.
Uses Linescan vision system for on-the-fly vision centering of the smallest chips up to complex mid-sized components. Mounthead is compatible with a range of tools as well as the automatic tool exchanger. Features the new H05 tool for large components and the H06 tool for ultra small chips.Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.
Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.Mydata Automation
Zestron Asia Pacific will exhibit solutions for PCB/ceramic hybrids, chip packaging and stencil/misprint cleaning applications at Nepcon Shanghai on April 12 - 15. The Asian technical and sales team can answer your latest questions on lead-free cleaning at booth 2H15.
The high-throughput IX-3000 is a Class 1 UV Excimer-based laser step and scan ablation system for micro-machining, drilling and laser processing.
The high-accuracy mask imaging system for large field of view (FOV) processing applications is also surrounded by a cleanroom enclosure with HEPA filtration.
Operates at 248 or 193nm UV wavelengths primarily; however, customer can choose different lasers, including: large-area patterning, microvia drilling, microelectronics micro-machining; general drilling; manufacture of inkjet nozzle arrays; flat panel displays, wafer-scale processing; sensors; microfluidics; and other applications, all with resolution down to 1 micron.
Optical resolution, repeatability and structural accuracies are sub-micron with 0.2 to 0.3 micron repeatability. Granite-based, vibration and thermal dampened for optimum stability.
Available with cassette-to-cassette wafer handling, panel-handling, robotics handling or tape and reel systems as options. Readily integrates with high-volume part handling systems.
J P Sercel Associates (JPSA), www.jpsalaser.com
The x-ray tube-based XLt is the first handheld x-ray fluorescence (XRF) instrument.
A proprietary calibration algorithm said to effectively, accurately covers the range of plastic samples used in manufacturing, while eliminating any need for user interaction or calibrations. Unlike benchtop systems, can be used on the assembly line, in the warehouse or as a benchtop instrument operated via wireless connection to a PC or PocketPC device.
Provides fast, accurate confirmation analysis of lead-free solder and electronic components, insuring compliance with European Union directives slated to go into effect in July 2006.
Automatically encrypts analysis results against unauthorized editing.
Calibrated for the quantification of Cadmium (Cd), Lead (Pb), Chromium (Cr),
Antimony (Sb), Tin (Sn), Mercury (Hg), Bromine (Br) and other toxic metals.
Niton, www.nitom.com
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