New Products
Z:TA-R / YSM40R modular surface mount placement machine has placement rates of 200,000cph. Has a 1m‐wide platform, a 4‐beam layout and multi-nozzle rotary head. High‐speed head is capable of simultaneous pickup and simultaneous vision recognition. Has high‐rigidity base frame, lightweight X-gantry, and high‐speed side-view camera. Is compatible with components down to 0201.
Yamaha Motor Intelligent Machinery, www.yamaha-motor-im.com
Machine vision smart camera is compact and flexible to meet the needs of on-board image acquisition, vision processing and communications options. Is capable of high-performance barcode reading and complex vision inspection, enabling automatic identification, quality assurance and guidance applications. Features integrated liquid lens autofocus technology.
Microscan, www.microscan.com
ST5S-BT Smart Tweezer is a handheld LCR- and ESR-meter with a Bluetooth-enabled connection. Remotely records measurements. Offers basic accuracy of 0.2%. Can connect to computers and NI Labview via USB receiver stick that enables a virtual serial port. 
Is based on ST-5S Smart Tweezer model. Data can be received by any communication software.
Siborg Systems, www.siborg.com
Q-upAuto quality control system links component mounters and inspection equipment and integrates the information they produce. Simplifies quality control of the entire PCB-mounting line, which conventionally has required highly expert knowledge and enormous working hours, thus contributing to defect prevention and enhanced productivity. Upgrades defect analysis platform from Q-upNavi Series; identifies defect causes among multiple factors and extract optimal setting conditions (parameters) for individual facilities, based on final quality inspection. Links quantitative inspection results to information on operation of component mounters to identify defect causes in multiple processes including printing, placement and reflow.
Omron, omron.com
Surface-Cure Thermal Paste is stable during thermal shock testing. Fills gaps that naturally exist between two metal surfaces placed one upon the other, improving the effective range of surface area for heat transfer. Does not set. Remains malleable when rework of components is required. Resists pump-out of the thermal interface layer from the bond line, ensuring minimal degradation of effective heat dissipation. 
For applications that are exposed to rapid and frequent changes in temperature. Thermally stable up to 200⁰C. Applicable using conventional industrial dispensing equipment and can also be applied via screen/stencil printing directly onto the contact surfaces. Contains no solvents and can be applied to very thin films.
Electrolube, electrolube.com
BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and flip chip assemblies are made using ultra micron technology from highly pure metals. Alloy compositions made using piezoelectric droplet jet technology for accurate diameter uniformity, bright shiny surface finishes and sphericity. Come in diameters of 0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05mm.
Shenmao America, shenmao.com
