New Products
Speedmask 9-20479-B-Rev-A UV/light cure temporary masking agent protects connectors and other components during soldering or conformal coating.
Connection Validation evaluates solder joint quality by calculating intermetallic compound formation and provides closed-loop feedback to the operator, mitigating risk in the process.
Co-NECT production software addresses connectivity between different machines, software and enterprise systems. Enables Industry 4.0 for electronics assembly. Connectivity layer enables data exchange in real-time at large manufacturing sites with hundreds of machines. Architecture and supporting infrastructure are optimized to ensure no delays or lag in response time. Is built on TTC platform. Supports standards such as SECS/GEM, CAMX, ZVEI, JSON, as well as proprietary interfaces from MES and machine vendors.
Cogiscan, www.cogiscan.com
This software automates the cost calculation of printed circuit board assembly. Can generate cost estimate by importing a bill of materials with basic attribute information about the components. Assigns cost to board components using a library of component costs and estimates assembly costs of attaching the components to the board. Can specify test and verification processes required, whereby the system will automatically assess the cost of each process and roll it into the overall PCBA cost. Comes with more than 45 out-of-the-box assembly and test manufacturing cost models.
aPriori, www.apriori.com
OvenRIDER NL2+ reflow oven verification system now has a higher temperature-rated pallet material of 280°C continuous, 300°C maximum for a longer pallet life.
Press Releases
- Scanfil and Etteplan deepen their strategic partnership into production testing
- NOTE receives order worth 132 MSEK and expands collaboration with customer within Security & Defence
- Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
- ZTEST Electronics Inc. Announces Transition to the OTCID Market