This inspection method for fan-out wafer level packaging compares the image acquisition of the dies on the reconstructed wafer with the CAD data used in fabricating the wafer.

Camtek, www.camtek.com

Hot crimping resistance welding systems are for joining insulated copper wire to cable shoes or terminals. Miyachi Peco weld head mechanically holds electrodes and feeds electrical current to them. Integrated water cooling system actively cools all components to prevent overheating during production. Welding process monitor guards and stores electrical parameters. No metal stripping or removal, for maximum strength. Unique weld-to-displacement feature permits the equipment to be programmed to reach the specified compression, after which the current flow and heating is switched off. This compensates for part-to-part variation, and lets users program a parameter that is closely related to joint quality.

Amada Miyachi Europe, amadamiyachi.eu

ELM-800 laser marker works inline machine to add QR, 1D, or 2D barcodes on PCBs. Marking data does not wear off over time. Minimizes marking cycle time by using a laser head with a moving X/Y axis robot and high-speed running conveyor. Optional integrated barcode scanner and data communication, which transfers marking data to production management systems. Other options include vision camera, PCB orientation verification, and fiducial mark. Compact machine length.

Eunil, eunil-ha.com

X Line 3D x-ray inspection system enables reliable inspection of THT and pin-in-paste solder joints in compliance with IPC quality standard through a combination of 3D AXI and 2D AOI. Max fault coverage at line cycle times reportedly can be achieved. By scanning image acquisition, time-efficient quality control is possible. Hole fill levels, pin and pad wetting, bridging and solder balls can be detected with one system. Is for safe testing double-sided assembled PCBs. Covers top and bottom sides within a continuous process. Basis is real-time multi-angle image acquisition, allowing a complete 3D capture of the assembly. Integrated reconstruction methods based on planarGT provide detailed evaluation of the PCB under test layer by layer.

Goepel electronic, www.goepel.com