SMT 88UH reportedly can be underfilled at room temperature without preheating substrate. Advantages reportedly include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance. Can be stored in a regular refrigerator or freezer. Can be used for chip-scale packaging, ball grid array devices, package-on-package, land grid array, and certain flip-chip applications. Suitable for bare chip protection in memory cards, chip carriers, hybrid circuits and multichip modules.

Yincae Advanced Materials, http://yincae.com/board-level-assembly.html

Loctite Eccobond NCP 5209 nonconductive paste is designed for fine-pitch flip-chips. Delivers underfill protection. Is pre-applied onto substrate, facilitating bump protection and interconnection. Formulated for Cu pillar bumps and Cu OSP substrate pad finishes, it reportedly offers bump reinforcement and safeguarding for devices with pitches of less than 100µm and gaps less than 40µm. Has stage life up to 2 hr. at 70°C. Passed MSL3 testing. Withstands up to 1,000 thermal cycles. Is capable of high-temperature storage of up to 1,000 hr. at 150°C.

Henkel Electronics Group, www.henkel.com/electronics
 

VuData statistical process analysis software for YesTech automated optical inspection systems  stores data with all faults related to assembly numbers, board serial numbers, system operator and time. Collects performance data in terms of line speeds, timing and throughput. Generates comprehensive reports showing yield rates in both board and opportunity format, as well as current and historical failure rates with types and trends. Management reports are also available for inspection and review timing, false and genuine fault rates and other line metrics. Live charting directly shows yields and part failure rates, with common failures and rankings. Generates and emails performance alarms. Exports to Excel, pdf, jpg or other formats. Fail pictures presented in a fault picture viewer, and any data can be used to generate live charts, graphs and reports as circumstances demand. AOI performance can be tracked through reports related to time, user, board, fault, false call, assembly, job and serial numbers. Data can be searched, sorted, filtered and grouped without need for external software. Provides yield and throughput monitoring as well as other management statistics. 

Cupio Yestech Europe, www.cupio.co.uk

XJFlash module automatically generates custom programming to overcome speed limitations generally associated with using boundary scan to program flash memories connected to FPGAs. Relieves JTAG chain of unnecessary traffic (usually generated by repetitive functions such as shifting in control, address and data bits). By doing so, programming speeds close to the device’s theoretical maximum can be achieved. Supports a range of flash and FGPA configurations, and can now be used as part of an XJDeveloper boundary scan test project to create a programming solution. Reportedly erases, programs and verifies any flash memory provided there is access to it from an FPGA on the target board, all within the XJTAG software.

XJTAG, www.xjtag.com