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New Products

MDP-300 combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint. Includes synchronous head motion that enables bond head and dispenser to work in parallel. Is said to increase bond quality and enhance overall throughput. Supports up to 300mm (12”) wafer substrates. Connects to SMT machines.

Panasonic Factory Solutions Co. of America, www.panasonicfa.com

Vision Mini Xi industrial compact smart camera with embedded Ethernet is for close-range industrial auto ID, inspection, and other machine vision applications. Is reportedly the smallest fully-integrated smart camera with embedded Ethernet, measuring 25.4mm x 45.7mm x 53.3mm. Weighs 3.2oz. Features serial connectivity, a 24-volt interface, and optically isolated I/O. Can handle dot peen marks on power-train components, laser markings on medical devices or printed circuit boards, and printed barcodes on packaging and labels.

Microscan, www.microscan.com

 

Horus 3D measurement system measures volume and dimension of nearly any type of substance, part, component, or die. Can measure transparent and shiny materials and difficult-to-measure objects at production speeds. Is for semiconductor applications and electronics manufacturing and assembly applications, including board-level SMT. Can measure flux and solder balls using wide field of view optics. Can be used as inline inspection machine.

Koh Young Technology, www.kohyoung.com  

 

2004D multi-purpose dispensers combine 3-axis robots with digital dispense controllers for SMT assembly tasks. Provide point-to-point, linear, or curved-arc application of solder pastes, solder masks, conductive epoxies, and other adhesives. Benchtop units weigh fewer than 100lbs.; can store up to 10,000 different dispensing routines created through the use of a handheld teach pendant. Can import CAD and graphics file formats and 3D interpolation of arc and line data points. Feature high-torque drive mechanism for speeds to 800mm/sec. and linear guide rails for a repeatability of ±0.01mm per axis.  Have 100mm of z-axis stroke and braking system that can hold up to a 6kg payload without power.

Manncorp, www.manncorp.com

 

 

MV-9 SIP is configured with Omni-Vision 2D/3D technology for semiconductor inspection. Combines 25Mp CoaXPress 2D ISIS vision system with digital multi-frequency quad Moiré 3D system for inspection of semiconductor assemblies. Features four 10Mp side-view cameras and 25Mp top-down camera. MP-7 Micro is designed for BGA ball inspection. Is configured with 15Mp ISIS vision system, a 6µm telecentric compound lens and color strobe LED lighting.

Mirtec, www.mirtec.com

 

CION Module SO-DIMM204-3/ECC is for boundary scan test of DDR3-DIMM sockets.

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