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Tilt Table platform permits the subject under inspection -- a populated PCB -- to be rotated 360 degrees in combination with up to 30 degrees of tilt, affording side views of device packages, legs and solder joints. Incorporates a large spherical joint for durability and stability. The 250mm diameter platform comes with adjustable PCB holders and an ESD-protected non-slip mat to safely maintain desired position, leaving hands free for other tasks. Optional electromagnetic position lock for heavier objects or when an optimum fixed position is required.

Optilia, www.optiliaindustrial.eu

Quicky 300 vapor phase soldering machine is for laboratory and single piece production. Process zone with lift unit and workplace carrier is integrated in the self-supporting structure. Includes sensors for heaters, fluid and vapor temperatures. Handles solder format up to 300 x 300mm, and 60mm height. Processes lead and lead-free product. Runs on a 240V power supply.

Asscon, www.asscon.de

Eazycoat multi-axis coating system is a robotic conformal coating application platform for low- and medium-volume batch and inline processing. Comes with programmable software and stepper motor process control. Slides on XYZ axes. XYZ repeatability and resolution is 50 microns (0.01").

EPS, www.eps-ww.com

WSM 310 wave soldering machine has with finger conveyor for boards up to 11.8" (300mm). Self-contained fluxing, preheating, and laminar (smooth) solder wave modules. Optional turbulent (SMT passive) solder wave module available. Streamlined design, for easy maintenance and cleaning. Welded steel frame. On-board profiler. Is lead or lead-free compatible. Solder pot trolley system offers quick changeover. Single or dual wave compatibility.

EPS, www.eps-ww.com

ESS automated inline selective soldering machine handles boards up to 18" x 24". Has SMEMA pass-through conveyor that features automatic conveyor width adjustment and a "crowder" to facilitate positive location of the board. PCB is maintained stationary during soldering process, preventing components from toppling over and causing "unset" intermetallic fillets. Programmable process parameters, including immersion depths, preheat dwells, travel distances and speeds, solder temperature and wave height.

EPS, www.eps-ww.com

XT V 160 NF flat-panel-based x-ray inspection system facilitates real-time imaging and defect analysis of wafer-level, semiconductor device and PCBA applications. Comes with x-ray NanoFocus source and high-precision manipulator. Has 3MP flat-panel detector; provides feature recognition capability below 0.1µm. Features 360° continuous rotate detector axis; enables oblique angle views of up to 60° to the center of the detector panel. Offers intelligent region of interest lock. Tray is 580mm x 580mm.

Nikon Metrology, www.nikonmetrology.com

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