SpectorBox AOI systems now include a 5" camera clearance, reportedly enabling single-pass inspection of nearly any assembly. Are optimized for inspection of PTH components to identify defects such as presence/absence, wrong polarity, color, type, and bent pins.  Top clearance of 130mm permits Top-Down SpectorBox to inspect electronics and electromechanical assemblies. Modules can be equipped with eight wide field-of-view side cameras, in addition to a top-view camera on the FWAz optical unit. Include 18.8μ2-pixel capture sensor. Z-Axis adjustable optical head adapts to printed circuit board thickness and automatically compensates for warpage. FWAx model has eight simultaneously operating, multiplexed angular side cameras.  

Marantz Business Electronics, http://model22x.com/english/index.html

MasterSil 930 fluorosilicone is for bonding, sealing and coating. Is a one-part system able to withstand exposure to water, fuels, oils, greases, refrigerants, acids, bases and solvents. Has a paste viscosity and has a tack-free time of 20 to 30 min. Tensile strength 800 to 1,100 psi. Reportedly bonds well to metals, composites, ceramics, glass, rubbers, plastics and other silicones. Hardness rating 30 to 40 Shore A. Is electrically insulative and has a volume resistivity of more than 1014 ohm-cm. Service temperature range is -85° to +450°F. Comes in 80g tubes.

Master Bond, www.masterbond.com

Axium series feeders automatically place labels using existing pick-and-place equipment. Now includes adjustable presentation speed modes and Generic Media Platform label module that enables adjustments for label changeover, for increased flexibility. Combined with auto-apply labels, improves placement accuracy and process speed. Presents label like any other SMT component.

Identco, identco.com

X-Line 3D inline AXI now comes “X40 Plus” for 3D inspection speed increase of up to 18%. Optimized imaging chain in combination with an improved axle system and faster execution of test algorithms results in cycle time savings, depending on maximum resolution and board dimensions. A 216 x 164mm assembly with more than 8,000 solder joints requires about 40 sec. for complete 3D X-ray inspection. For double-sided boards; captures top and bottom sides within a single pass. Based on a real time multi-angle image, recording a complete 3D inspection of the assembly is possible. Integrated reconstruction methods based on digital thomosynthesis enables the defined evaluation of individual layers of the circuit board under test.

Goepel Electronics, www.goepel.com