cmNavigo 4.0 MES software has embedded finite  scheduling. Scheduling models plant floor resources and defines the role of each in fulfilling orders in a near-term time frame. Schedules can be weighted around multiple production criteria and key performance indicators, such as minimizing delivery delays, maximizing machine loads, and reducing cycle times. Is built on Microsoft application development layers; integrates with more than 30 extensible MES applications. These provide visibility and traceability, operational efficiency, quality management, factory integration, operations intelligence, and factory management.  Can configure and extend models and define workflows without programming. Avoids duplication of master data, allows real-time updates across different areas of the plant floor, and eliminates the need to maintain separate interfaces. Features include lot-based sampling; document management; warehouse management; durables tracking, and a shift logbook.

Critical Manufacturing, www.criticalmanufacturing.com

EP62-1LPSP optically clear epoxy is for bonding, sealing, coating and encapsulation applications. Has a tensile lap shear strength exceeding 2,000psi. Has a non-critical four-to-one mix ratio by weight and features an open time of 12-24 hrs. at ambient temperatures. Has a thin mixed viscosity of 150-300cps, which can be lowered by adding heat. Low exotherm while curing allows for large encapsulations. Can be cured at temperatures as low as 60-70°C. Faster cures can be achieved at 125°C. Featuring a glass transition temperature of greater than 125°C, it is thermally stable and is serviceable over the temperature range of -60°F to +400°F. Is a reliable electrical insulator and has a volume resistivity over 1014ohm-cm.

Master Bond, www.masterbond.com

535-11M-3 UV-cured epoxy is a low stress, lower glass transition temperature version of 535-10M-1. Is  nonconductive and said to cure rapidly when exposed to high-intensity UV light. Is low outgassing, flexible, and high strength. Contains no antimony. 

Engineered Material Systems, www.conductives.com

Hotflow 3/20 is based on Multijet Ersa heating technology.  Has dual, triple and quad track options. Reportedly can increase throughput by as much as 400% without increasing floor space. Tracks run at own set speed and own printed circuit board width.

Ersa, www.ersa.com