Parallel Link Robot is an easy-to-program, automated six-axis robot for various manufacturing applications including insertion, wiring, assembling, adhesive application, soldering, and labeling. Simple, direct teaching process uses hand-guided intuitive operation to replicate precise human motion. Doesn’t require typical engineering skills and computer work to program. Once programmed, can run 24 hours a day.

Panasonic Factory Solutions Company of America, www.panasonicfa.com

The Handbook of Electronic Assembly and A Guide to SMTA Certification, authored by Ronald Lasky, Ph.D., James Hall, Katherine Hickey and Jennifer Tate, Ph.D. is a reference manual for process engineers in electronics and those new to the industry. Provides in-depth view of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test. Originally conceived as a supplement to the SMTA Certification Program. 81 pages.

SMTA, www.smta.org

ACP 120 series anti-oxidation solderable coatings replace nanofilm gold. Are for anti-corrosion and anti-rusting on solderable surfaces on which solder paste, solder preform or a solder ball can be soldered.

Yincae Advanced Materials, www.yincae.com

LEN66AL optoelectric die attachment adhesive is UV curable and said to be fast bonding. Reportedly provides bubble-free optical coverage and moisture resistance. Bonding flexibility dissipates thermal stress from different CTE substrates. Meets MIL-I46058C and IPC-CC-830 and RoHS compliant. Is specifically for chip attachment.

Yincae Advanced Materials, www.yincae.com