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New Products

TSR benchtop robot series handles a range of fluid dispensing applications, from inline to batch. Comes in three models (TSR2201, TSR2301 and TSR2401) to accommodate a range of working envelopes. Easy-to-program, and features dedicated fluid dispensing software, eliminating the need for complex robot language programming. Fully integrated positioning and fluid dispensing functions. Compatible with all Techcon Systems syringes, valves and jet dispensers.

Techcon Systems, www.techconsystems.com

 

PCBVac shop vac for printed circuit board repair cleaning cleans liquids and solids from a PCB. Is adjustable and includes a handheld tool. Teflon heat-resistant nozzles clean molten solder; nozzles can be trimmed to size for different vacuum pressures. Can clean solidified solder fines, scraped off solder mask or coatings, unreacted flux, flux cleaners, solvents and other liquids. Has a controller with ON/OFF and vacuum adjustment, a disconnect plug, flex input tubing and filtration, a handheld vacuum applicator inclusive of six ft. of flex hose and five tips. Hand piece includes trap system.

BEST Inc., www.solder.net

 

 

Loctite Eccobond EN 3810T and Loctite Eccobond EN 3838T are encapsulant formulations that can be selectively applied to environmentally-susceptible components. Deliver a barrier that is reportedly impervious to moisture and fluids. Are ideal for handheld and automotive applications.  Cure quickly at moderate temperature; are well-suited for high-volume manufacturing operations.  3810T is a non-flexible material and 3838T is a flexible, low Tg encapsulant.

Henkel, www.henkel.com/electronics


535-10M-49 UV cured epoxy adhesive was formulated for disk drive, camera module, optoelectronic and circuit assembly applications. Contains a secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Is ultra-low stress, low shrinkage, and ionically clean, with low glass transition temperature. Designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and general bonding applications in photonics assembly.  Cures rapidly when exposed to high-intensity UV light.

Engineered Material Systems, www.emsadhesives.com

 



Vision Inspection Cell is a test solution for vision inspection of display and camera functionalities of wireless devices. Is fully integrated and based on parallel testing option and adjustable camera quantity. Can be configured to various device sizes by changing cameras and lenses. Can be used to configure benchmark and deploy a system that addresses vision applications from pattern matching to code reading and presence detection.

JOT Automation, www.jotautomation.com

Trident ZDO fully automatic cleaner/defluxer is completely zero discharge, and automatically washes, rinses, verifies cleanliness, and fully dries assemblies within a single compact machine. Requires no separate water recycling systems as both the wash-solution recycling system and the rinse-water recycler are built into the machine. Contains effective shadow mitigation technology for cleaning fine-pitch, low-profile components. Built-in cleanliness verification capability ensures assemblies are cleaned to pre-selected cleanliness levels. Wireless barcode scanner permits all assemblies being cleaned to have their serial numbers scanned and entered into the machine's SQL database. All process data, including set and actual cleanliness results are stored and are searchable in a multi-query format for the most powerful SPC available on any cleaning system.

Aqueous Technologies, www.aqueoustech.com

 

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